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24AA256-I/STG

Microchip Technology

24AA256-I/STG by Microchip Technology

24AA256-I/STG by Microchip Technology is a serial EEPROM with 32Kx8 organization, operating at 2-5V. It features I2C control byte, hardware write protection, and endurance of 1M cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 4,079 parts In-Stock

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Vyrian

USA . 837 parts In-Stock

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Nova Conductors

Japan . 91 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$3.868

100+ parts

$3.674

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$3.674

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50

$3.868

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$3.674

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Aztec Data Supply Inc.

USA . 2,593 parts In-Stock

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$5.110

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AZTECH Wire

Italy . 312 parts In-Stock

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$5.318

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Corohmni

South Africa . 305 parts In-Stock

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$5.740

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Semicontronic

India . 1,208 parts In-Stock

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$10.000

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$9.750

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$9.700

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Ampacity Inc.

Singapore . 1,601 parts In-Stock

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$13.000

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RGB Technical Solutions

Ukraine . 2,503 parts In-Stock

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Continental Prestige Electronics

USA . 1,207 parts In-Stock

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Argo Parts USA

USA . 496 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of reliable data storage with the 24AA256-I/STG by Microchip Technology. This high-quality EEPROM offers a seamless solution for a variety of applications, providing customers with durability, efficiency, and peace of mind. With a million write/erase cycles, industrial temperature grade, and I2C serial bus type, this memory IC is designed to meet your needs with precision and reliability. Trust Microchip Technology to deliver exceptional performance in a compact, easy-to-install package, giving you the confidence to focus on what matters most.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to environmental factors, making the EEPROM long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Ensures data is transferred efficiently and accurately in sync with the clock signal.

Power Supplies (V): 2/5

Compatible with both 2V and 5V power supplies, providing flexibility in various applications.

No. of Terminals: 8

Simplified interface with only 8 terminals, making it easy to connect and control.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions, ensuring reliability in harsh environments.

Write Protection: HARDWARE

Offers a secure way to protect data from accidental or unauthorized writing, enhancing data integrity.

Endurance: 1000000 Write/Erase Cycles

Withstands a high number of write and erase cycles, ensuring longevity and reliability of the EEPROM.

Serial Bus Type: I2C

Utilizes the I2C bus for communication, enabling easy integration with other devices in a system.

Technical Specifications

EEPROM 24AA256-I/STG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Reverse Pinout:

NO

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA256-I/STG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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