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AT24C128C-SSHM-T-989

Microchip Technology

AT24C128C-SSHM-T-989 by Microchip Technology

AT24C128C-SSHM-T-989 by Microchip: 16KX8 EEPROM with I2C control byte 1010DDDR, operating at 1 MHz. Ideal for industrial applications requiring 1000000 write/erase cycles and -40 to 85 °C temperature range.

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4

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1k+

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Adafruit Industries

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VNN

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Vyrian

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Nova Conductors

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Corohmni

South Africa . 1,007 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

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Ampacity Inc.

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Semicontronic

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Continental Prestige Electronics

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RGB Technical Solutions

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Overview

Discover the innovative AT24C128C-SSHM-T-989 by Microchip Technology, a high-quality EEPROM that offers unparalleled reliability and performance. With a reputation for excellence in the industry, Microchip Technology delivers cutting-edge solutions for a wide range of applications. This compact and versatile memory IC is ideal for industrial environments, offering a maximum operating temperature of 85°C and an endurance of 1,000,000 write/erase cycles. Trust Microchip Technology to provide you with the best-in-class products that deliver value, benefits, and advantages to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into PCBs, saving space and simplifying the manufacturing process.

Screening Level: TS 16949

This high screening level ensures quality and reliability, making this EEPROM suitable for automotive and industrial applications.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and install, increasing user convenience.

Operating Mode: SYNCHRONOUS

This operating mode allows for faster data transfer and processing, making the EEPROM ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V offers compatibility with a wide range of systems and power sources.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile usage in different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments, making this EEPROM suitable for industrial use.

Organization: 16KX8

With an organization of 16Kx8, this EEPROM offers a large memory capacity for storing data efficiently.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for easy interfacing with other components, enhancing compatibility and flexibility in circuit design.

Technical Specifications

EEPROM AT24C128C-SSHM-T-989 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.925 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000006 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

AT24C128C-SSHM-T-989 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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