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AT24C64BN-10SU-2.7-T

Microchip Technology

AT24C64BN-10SU-2.7-T by Microchip Technology

AT24C64BN-10SU-2.7-T by Microchip is an 8KX8 EEPROM with a serial I2C bus type, operating at 0.4 MHz clock frequency and 3V nominal voltage. It is ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 22,585 parts In-Stock

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Vyrian

USA . 2,049 parts In-Stock

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2,049

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VNN

France . 593 parts In-Stock

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593

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Corohmni

South Africa . 200 parts In-Stock

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$2.905

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200

$2.905

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Ampacity Inc.

Singapore . 1,241 parts In-Stock

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$5.000

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$5.000

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Aztec Data Supply Inc.

USA . 4,357 parts In-Stock

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$5.310

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$5.310

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AZTECH Wire

Italy . 327 parts In-Stock

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$6.880

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327

$6.880

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Semicontronic

India . 764 parts In-Stock

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$21.000

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$20.475

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$20.370

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764

$21.000

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$20.370

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Lixinc

USA . 19,136 parts In-Stock

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Continental Prestige Electronics

USA . 5,547 parts In-Stock

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Argo Parts USA

USA . 3,891 parts In-Stock

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West Coast Incorporated

USA . 2,504 parts In-Stock

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Advanced Electronics

New Zealand . 314 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Enhance your electronic devices with the AT24C64BN-10SU-2.7-T from Microchip Technology, a leading manufacturer known for top-quality components. This EEPROM offers unparalleled reliability and performance, making it ideal for a wide range of applications. With its compact design and advanced technology, this product provides value by ensuring data integrity and security. Upgrade your projects with the AT24C64BN-10SU-2.7-T and experience the benefits of cutting-edge memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the EEPROM chip, ensuring its longevity in various operating conditions.

Surface Mount: YES

Allows for easy and convenient integration onto printed circuit boards, saving space and enabling mass production.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage supply for efficient operation and reliability of the EEPROM chip.

Operating Mode: SYNCHRONOUS

Ensures accurate and synchronized data transfer, enhancing the overall performance of the EEPROM chip.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments or applications where temperature fluctuations occur.

Technology: CMOS

Utilizes low power consumption CMOS technology, resulting in energy efficiency and longer battery life for devices equipped with this EEPROM chip.

Serial Bus Type: I2C

Utilizes the I2C serial bus, enabling easy interfacing with other devices and components in a system, simplifying the overall design and communication process.

Technical Specifications

EEPROM AT24C64BN-10SU-2.7-T attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.925 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

AT24C64BN-10SU-2.7-T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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