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24LC16BT-E/OTG

Microchip Technology

24LC16BT-E/OTG by Microchip Technology

24LC16BT-E/OTG by Microchip Technology is a 2Kx8 EEPROM with I2C serial bus, operating at 5V. It offers 1000000 write/erase cycles, -40 to 125°C temperature range, and 0.4 MHz clock frequency. Ideal for automotive applications due to its small size and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,620 parts In-Stock

1+ parts

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1,620

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VNN

France . 870 parts In-Stock

1+ parts

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870

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$2.036

100+ parts

-

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57

$2.036

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Aztec Data Supply Inc.

USA . 3,395 parts In-Stock

1+ parts

$3.010

100+ parts

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3,395

$3.010

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$3.173

100+ parts

$3.015

1k+ parts

$3.015

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500

$3.173

$3.015

$3.015

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Ampacity Inc.

Singapore . 812 parts In-Stock

1+ parts

$4.000

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-

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812

$4.000

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AZTECH Wire

Italy . 511 parts In-Stock

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$11.454

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511

$11.454

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Semicontronic

India . 864 parts In-Stock

1+ parts

$23.000

100+ parts

$22.425

1k+ parts

$22.310

10k+ parts

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864

$23.000

$22.425

$22.310

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West Coast Incorporated

USA . 4,805 parts In-Stock

1+ parts

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4,805

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Continental Prestige Electronics

USA . 1,247 parts In-Stock

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1,247

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Argo Parts USA

USA . 1,133 parts In-Stock

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1,133

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Robosynatics

Brazil . 263 parts In-Stock

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263

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Lucentia Tech

USA . 263 parts In-Stock

1+ parts

-

100+ parts

$0.594

1k+ parts

$0.594

10k+ parts

$0.594

263

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$0.594

$0.594

$0.594

Modulus Dynamics

Lithuania . 100 parts In-Stock

1+ parts

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100

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the power of reliable data storage with the 24LC16BT-E/OTG by industry leader Microchip Technology. This small yet powerful EEPROM device offers high-quality performance for automotive applications, ensuring secure and efficient data management on the go. With a durable package body material and advanced features like hardware write protection, this product delivers unmatched value and innovation to customers. Trust Microchip Technology for cutting-edge solutions that enhance your products and drive success in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the EEPROM, ensuring long-term reliability.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

Enables faster data transfer and synchronization with other components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supplies, making it easy to incorporate into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in various environmental conditions, including automotive applications.

Memory Density: 16384 bit

Offers sufficient storage capacity for data storage needs, ensuring reliable operation.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures longevity and reliability of the EEPROM, making it a dependable choice for data storage.

Technical Specifications

EEPROM 24LC16BT-E/OTG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1 MILLION ERASE/WRITE CYCLES

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010MMMR

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.95 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.63 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC16BT-E/OTG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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