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XCF32PFSG48C

Xilinx

XCF32PFSG48C by Xilinx

Xilinx XCF32PFSG48C is a 32MX1 EEPROM with 3-STATE output, operating at 50 MHz clock frequency. It has 33554432-bit memory density and supports NOR type technology. Ideal for industrial applications, it offers 20000 Write/Erase cycles endurance and operates in a temperature range of -40 to 85°C.

Median Price

$143.809

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Nova Conductors

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MARBEL Systems

Belgium . 286 parts In-Stock

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Texas Native Microelectronics

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Corohmni

South Africa . 369 parts In-Stock

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Kenton Components

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 3,089 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Qasali Group International

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Semicontronic

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Ampacity Inc.

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AZTECH Wire

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One Stop Electronics

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Component Stockers USA

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Vigor

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Continental Prestige Electronics

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Netroflash

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Overview

Unlock endless possibilities with the Xilinx XCF32PFSG48C EEPROM. Manufactured by Xilinx, a trusted leader in semiconductor technology, this versatile device offers fast and reliable performance for a wide range of applications. Whether you're looking to streamline your industrial processes or enhance the functionality of your electronics, this EEPROM delivers unparalleled value, efficiency, and innovation. Upgrade to the Xilinx XCF32PFSG48C today and experience the difference quality makes in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the EEPROM, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

The compact shape allows for efficient use of space on the PCB.

Operating Mode: SYNCHRONOUS

Enables fast and synchronized data transfer, improving overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 1.8

Provides a low power consumption option for energy-efficient designs.

Power Supplies (V): 1.5/3.3,1.8

Offers flexibility in power supply options, making it versatile for various applications.

No. of Terminals: 48

Provides a sufficient number of terminals for connectivity and data transfer.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Offers a modern package style that optimizes space on the PCB and enhances signal integrity.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Organization: 32MX1

Organizes data in an efficient manner, allowing for quick access and retrieval.

Output Characteristics: 3-STATE

Provides flexibility in output options, enabling seamless integration with other components.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, suitable for a wide range of applications.

Terminal Finish: Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Ensures good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Allows for easy soldering and installation on the PCB.

Write Protection: HARDWARE

Offers a secure way to protect data from unauthorized access or modification.

Maximum Seated Height: 1.2 mm

Low profile design fits in compact spaces, ideal for smaller devices or systems.

Maximum Clock Frequency (fCLK): 50 MHz

Supports high-speed data transfer rates, enhancing overall performance.

Width: 8 mm

Compact width allows for efficient use of space on the PCB.

Minimum Supply Voltage (Vsup): 1.65 V

Provides a wide range of supply voltage options for compatibility with different systems.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during production processes.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during assembly, ensuring durability.

Type: NOR TYPE

Utilizes NOR flash technology for fast read and write speeds, suitable for data-intensive applications.

Length: 9 mm

Compact length allows for efficient use of space on the PCB.

Programming Voltage (V): 1.8

Allows for easy and efficient programming of the EEPROM, enhancing versatility.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, suitable for harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed.

Parallel or Serial: SERIAL

Supports serial communication for efficient data transfer in a variety of applications.

Terminal Form: BALL

Ball terminals ensure secure connections and easy soldering during installation.

Maximum Supply Current: 40 mA

Provides a low power consumption option for energy-efficient designs.

No. of Words: 33554432 words

Offers a large storage capacity for data-intensive applications.

Minimum Data Retention Time: 20

Ensures data integrity and reliability over an extended period.

Terminal Pitch: 0.8 mm

Provides a fine terminal pitch for precise connections and space-saving on the PCB.

No. of Words Code: 32M

Simplifies data organization and management for efficient data processing.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture, suitable for a variety of environmental conditions.

Maximum Supply Voltage (Vsup): 2 V

Supports a high supply voltage option for versatile power supply requirements.

Endurance: 20000 Write/Erase Cycles

High endurance for frequent data read/write operations, ensuring long-term reliability.

Memory Density: 33554432 bit

Offers a large memory density for storing large amounts of data.

Memory IC Type: CONFIGURATION MEMORY

Specifically designed for configuration memory applications, providing reliable storage.

Technical Specifications

EEPROM XCF32PFSG48C attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Additional Features:

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

20

Endurance:

20000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e2

Length:

9 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3,1.8

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Flash Memories

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

8 mm

Write Protection:

HARDWARE

Trade Compliance

XCF32PFSG48C Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

NSN

5962-01-616-0842, 5962016160842

NIIN

016160842

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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