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93LC56B-I/SN15KVAO

Microchip Technology

93LC56B-I/SN15KVAO by Microchip Technology

93LC56B-I/SN15KVAO by Microchip Technology is a 2048-bit EEPROM with 128x16 organization, operating at 2MHz clock frequency. It features hardware/software write protection and industrial temperature grade suitability. Ideal for automotive applications due to AEC-Q100 screening and TS16949 compliance.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.330

100+ parts

-

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900

$0.330

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VNN

France . 22,604 parts In-Stock

1+ parts

-

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-

1k+ parts

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22,604

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Vyrian

USA . 3,840 parts In-Stock

1+ parts

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3,840

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,757 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

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10k+ parts

$0.323

3,757

$0.330

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-

$0.323

Argo Parts USA

USA . 2,888 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

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10k+ parts

$0.320

2,888

$0.330

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-

$0.320

Semicontronic

India . 428 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

10k+ parts

-

428

$2.000

$1.950

$1.940

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Corohmni

South Africa . 343 parts In-Stock

1+ parts

$2.350

100+ parts

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343

$2.350

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Aztec Data Supply Inc.

USA . 3,186 parts In-Stock

1+ parts

$4.540

100+ parts

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3,186

$4.540

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$10.116

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444

$10.116

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Ampacity Inc.

Singapore . 1,018 parts In-Stock

1+ parts

$24.000

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1,018

$24.000

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Fulton Briggs Corp.

USA . 1,396 parts In-Stock

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1,396

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Microchip USA

USA . 1,038 parts In-Stock

1+ parts

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1,038

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

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500

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Overview

Unlock the power of reliable data storage with the 93LC56B-I/SN15KVAO by Microchip Technology. This high-quality EEPROM boasts AEC-Q100 and TS 16949 screening, ensuring top-notch performance for industrial applications. With a durable plastic/epoxy package and hardware/software write protection, this versatile memory solution offers peace of mind and flexibility. Experience the benefits of seamless operation in an industrial-grade package, making it the ideal choice for your next project. Trust in Microchip Technology's expertise and innovation to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM chip, making it suitable for various environments.

Surface Mount: YES

Allows for easy and reliable installation on a PCB, saving space and improving overall product reliability.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, improving efficiency and ensuring data integrity.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common and stable voltage level, ensuring compatibility with standard power sources.

Write Protection: HARDWARE/SOFTWARE

Provides security for data stored in the EEPROM by allowing for both hardware and software-based protection mechanisms.

Memory Density: 2048 bit

Offers a sufficient amount of memory for storing data, making it suitable for a variety of applications.

Endurance: 1000000 Write/Erase Cycles

Withstands a high number of write and erase cycles, ensuring long-term reliability and data retention.

Serial Bus Type: MICROWIRE

Uses the efficient Microwire serial bus communication protocol, allowing for fast and reliable data transfer.

Technical Specifications

EEPROM 93LC56B-I/SN15KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

93LC56B-I/SN15KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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