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CAT24C02YI-GT3A

Onsemi

CAT24C02YI-GT3A by Onsemi

CAT24C02YI-GT3A by Onsemi is an EEPROM with 256x8 organization, operating at 3.3V. It offers a write protection feature and endurance of 1M cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.

Median Price

$3.579

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 270 parts In-Stock

1+ parts

$3.579

100+ parts

$3.257

1k+ parts

$2.935

10k+ parts

-

270

$3.579

$3.257

$2.935

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Distributors (In-Stock)

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Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$0.145

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-

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95

$0.145

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Digiode

USA . 731 parts In-Stock

1+ parts

$3.400

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731

$3.400

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Chip Stock

USA . 47,000 parts In-Stock

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47,000

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Vyrian

USA . 10,718 parts In-Stock

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10,718

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Connect4Technologies Inc.

Canada . 2,060 parts In-Stock

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2,060

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,755 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

-

10k+ parts

$0.142

5,755

$0.145

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-

$0.142

Argo Parts USA

USA . 146 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

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10k+ parts

$0.141

146

$0.145

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-

$0.141

Semicontronic

India . 38 parts In-Stock

1+ parts

$3.040

100+ parts

$2.964

1k+ parts

$2.949

10k+ parts

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38

$3.040

$2.964

$2.949

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Corphita

USA . 906 parts In-Stock

1+ parts

$3.221

100+ parts

-

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906

$3.221

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$3.579

100+ parts

$3.257

1k+ parts

$2.935

10k+ parts

-

270

$3.579

$3.257

$2.935

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Corohmni

South Africa . 173 parts In-Stock

1+ parts

$3.579

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173

$3.579

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Aztec Data Supply Inc.

USA . 202 parts In-Stock

1+ parts

$4.696

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202

$4.696

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Ampacity Inc.

Singapore . 270 parts In-Stock

1+ parts

$6.620

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270

$6.620

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AZTECH Wire

Italy . 626 parts In-Stock

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$15.017

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626

$15.017

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Component Stockers USA

USA . 313 parts In-Stock

1+ parts

$99.990

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313

$99.990

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Perfect Parts

USA . 19,379 parts In-Stock

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TANS Electronics

Latvia . 6,082 parts In-Stock

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6,082

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 5,982 parts In-Stock

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5,982

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SupplyDigital Components

Austria . 5,408 parts In-Stock

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Microchip USA

USA . 4,376 parts In-Stock

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4,376

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Problanco Electronics

Mexico . 4,370 parts In-Stock

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4,370

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Alle Elektronik GmbH

Germany . 3,988 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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S.R.D Solutions

India . 2,503 parts In-Stock

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2,503

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Kulean Microsystems

USA . 1,220 parts In-Stock

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1,220

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Lixinc

USA . 926 parts In-Stock

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926

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UHIMA Technologies

Türkiye . 548 parts In-Stock

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548

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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GreenTree Electronics

Israel . 46 parts In-Stock

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Overview

Upgrade your electronics with the CAT24C02YI-GT3A by Onsemi, a top-quality EEPROM that offers unmatched reliability and performance. Onsemi is known for their innovative technology and commitment to excellence, making this product a must-have for any application requiring non-volatile memory storage. With its compact size and low power consumption, the CAT24C02YI-GT3A provides value and convenience to customers looking for a dependable solution. Whether you're working on industrial automation, consumer electronics, or automotive systems, this EEPROM is sure to meet your needs and exceed your expectations. Elevate your projects with the CAT24C02YI-GT3A and experience the benefits of superior quality and functionality.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount:

YES - The surface mount feature allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Package Shape:

RECTANGULAR - The rectangular package shape provides a standardized form factor for easy integration into existing designs.

Operating Mode:

SYNCHRONOUS - The synchronous operation ensures precise timing and data transfer, making it suitable for synchronized applications.

Nominal Supply Voltage / Vsup (V):

3.3 - The 3.3V nominal supply voltage ensures compatibility with a wide range of systems and power sources.

Power Supplies (V):

1.8/5 - The availability of multiple power supply options (1.8V/5V) enhances flexibility in system design and compatibility.

No. of Terminals:

8 - The 8 terminals provide ample connectivity options while keeping the overall footprint compact.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style optimize space utilization and facilitate high-density mounting.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions.

Organization:

256X8 - The 256x8 organization allows for efficient data storage and retrieval, suitable for a wide range of applications.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature rating ensures reliable operation even in extreme cold environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance for long-term reliability.

I2C Control Byte:

1010DDDR - The I2C control byte configuration enables easy interfacing and communication with other devices in a system.

Terminal Position:

DUAL - The dual terminal position provides redundancy and improved connectivity in case of terminal damage or failure.

Write Protection:

HARDWARE - The hardware write protection feature offers enhanced security and prevents accidental data corruption.

Maximum Seated Height:

1.2 mm - The low maximum seated height allows for compact and low-profile designs, suitable for space-constrained applications.

Maximum Clock Frequency (fCLK):

0.4 MHz - The high maximum clock frequency ensures fast data transfer rates and efficient operation.

Width:

3 mm - The 3mm width dimensions make the product suitable for applications where space is limited.

Minimum Supply Voltage (Vsup):

1.7 V - The low minimum supply voltage requirement enables operation in low-power scenarios and extends battery life.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature ensures proper soldering and reliable connections during manufacturing.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance ensures the product can withstand typical soldering processes without damage.

Length:

4.4 mm - The compact 4.4mm length dimensions make the product suitable for small form factor devices and applications.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade rating ensures reliable operation in harsh temperature environments typically found in industrial settings.

Technology:

CMOS - The CMOS technology used in the product offers low power consumption, high noise immunity, and reliable performance.

Parallel or Serial:

SERIAL - The serial data transfer mode enables efficient and reliable data communication with other devices in a system.

Terminal Form:

GULL WING - The gull wing terminal form provides secure mechanical connections and facilitates easy soldering during assembly.

Maximum Supply Current:

2 mA - The low maximum supply current consumption helps in minimizing power usage and extends battery life.

No. of Words:

256 words - The 256 words capacity allows for storing a significant amount of data efficiently in the EEPROM.

Memory Width:

8 - The 8 memory width ensures compatibility with various data formats and simplifies data handling and processing.

Minimum Data Retention Time:

100 - The 100-year minimum data retention time ensures long-term data storage without loss, making the product suitable for archival purposes.

Terminal Pitch:

0.65 mm - The small 0.65mm terminal pitch allows for high-density mounting and precise connections in space-constrained designs.

No. of Words Code:

256 - The 256 words code capacity allows for storing and managing a large number of data words efficiently in the EEPROM.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage tolerance provides flexibility in power source selection without risking damage to the device.

Endurance:

1000000 Write/Erase Cycles - The high endurance rating of 1,000,000 write/erase cycles ensures longevity and reliability in data storage and retrieval operations.

Serial Bus Type:

I2C - The I2C serial bus type allows for easy integration and communication with other I2C-compatible devices in a system.

Maximum Write Cycle Time (tWC):

5 ms - The short 5ms maximum write cycle time ensures fast and efficient updating of data in the EEPROM.

Memory Density:

2048 bit - The 2048-bit memory density provides ample storage capacity for various data types and applications.

Memory IC Type:

EEPROM - The EEPROM memory IC type offers non-volatile data storage capabilities, making it ideal for applications requiring data retention even when power is disconnected.

Maximum Standby Current:

0.000001 Amp - The ultra-low standby current consumption helps in minimizing power usage during idle periods, extending battery life.

Technical Specifications

EEPROM CAT24C02YI-GT3A attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAT24C02YI-GT3A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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