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24LC256T-I/SM15KVAO

Microchip Technology

24LC256T-I/SM15KVAO by Microchip Technology

Microchip Technology's 24LC256T-I/SM15KVAO is an EEPROM with 32KX8 organization, operating at 3.6V. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for applications requiring small outline package, such as automotive electronics and industrial controls.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 1,463 parts In-Stock

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Vyrian

USA . 174 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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98

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 45,298 parts In-Stock

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$2.030

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$2.030

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Ampacity Inc.

Singapore . 577 parts In-Stock

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$3.000

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577

$3.000

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$4.130

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$3.924

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$3.924

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750

$4.130

$3.924

$3.924

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Corohmni

South Africa . 532 parts In-Stock

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$5.392

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532

$5.392

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AZTECH Wire

Italy . 783 parts In-Stock

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$11.999

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783

$11.999

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Semicontronic

India . 1,153 parts In-Stock

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$28.000

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$27.300

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$27.160

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1,153

$28.000

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Continental Prestige Electronics

USA . 6,204 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,613 parts In-Stock

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Ledger Components

France . 2,726 parts In-Stock

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LMD Electronica

Estonia . 2,280 parts In-Stock

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Argo Parts USA

USA . 707 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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Montano Global Distributors

Canada . 548 parts In-Stock

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NIA Electronics

USA . 167 parts In-Stock

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Overview

Unlock the power of reliable data storage with the 24LC256T-I/SM15KVAO by industry leader Microchip Technology. This high-quality EEPROM offers unparalleled performance and endurance, making it ideal for a wide range of applications. From automotive to industrial, this EEPROM provides peace of mind with its secure write protection and robust design. Trust Microchip Technology to deliver top-notch products that exceed expectations, ensuring your data is safe and accessible when you need it most. Elevate your projects with the unmatched value and reliability of the 24LC256T-I/SM15KVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the EEPROM, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable makes the EEPROM easy to integrate into circuit boards, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the EEPROM meets stringent automotive industry requirements for reliability and long-term performance.

Nominal Supply Voltage / Vsup (V): 3.6

The 3.6V supply voltage is a common and stable voltage level that ensures consistent operation of the EEPROM.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for easy interfacing with other devices in the circuit, providing flexibility in system design.

Write Protection: HARDWARE

The hardware write protection feature adds an extra layer of security to prevent accidental data corruption or unauthorized write access to the EEPROM.

Memory Density: 262144 bit

With a high memory density of 262144 bits, this EEPROM can store a large amount of data, making it suitable for applications that require extensive data storage.

Endurance: 1000000 Write/Erase Cycles

The EEPROM's high endurance of 1,000,000 write/erase cycles ensures reliable data retention and longevity, making it a durable choice for frequent read/write operations.

Technical Specifications

EEPROM 24LC256T-I/SM15KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

5.26 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

4.5

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000015 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.6

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC256T-I/SM15KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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