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93LC66AT-I/MNY

Microchip Technology

93LC66AT-I/MNY by Microchip Technology

93LC66AT-I/MNY by Microchip Technology is a 512x8 EEPROM with serial bus type MICROWIRE. It operates at 2 MHz clock frequency, has 1000000 write/erase cycles endurance, and supports software write protection. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.

Median Price

$0.410

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 13,200 parts In-Stock

1+ parts

$0.410

100+ parts

$0.370

1k+ parts

$0.350

10k+ parts

$0.340

13,200

$0.410

$0.370

$0.350

$0.340

DigiKey

USA . 3,579 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

$0.378

3,579

$0.410

-

-

$0.378

Mouser Electronics

USA . 3,156 parts In-Stock

1+ parts

$0.410

100+ parts

$0.399

1k+ parts

$0.394

10k+ parts

$0.377

3,156

$0.410

$0.399

$0.394

$0.377

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 6,600 parts In-Stock

1+ parts

$0.420

100+ parts

$0.380

1k+ parts

$0.340

10k+ parts

-

6,600

$0.420

$0.380

$0.340

-

Vyrian

USA . 8,501 parts In-Stock

1+ parts

-

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1k+ parts

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8,501

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-

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VNN

France . 93 parts In-Stock

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93

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Nova Conductors

Japan . 48 parts In-Stock

1+ parts

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 213 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

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213

$0.348

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,000

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100

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RGB Technical Solutions

Ukraine . 82 parts In-Stock

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82

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Overview

Experience the reliability and performance of the 93LC66AT-I/MNY by industry leader Microchip Technology. This EEPROM offers unparalleled quality and durability, making it ideal for a wide range of applications. With its small outline package and software write protection, this product ensures secure data storage and seamless operation. Trust in Microchip's expertise and elevate your projects with the innovative features of the 93LC66AT-I/MNY. Unlock endless possibilities and streamline your processes with this cutting-edge EEPROM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the EEPROM lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient board placement, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and efficient communication with other components in the system, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage provides a stable power source for the EEPROM, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style allows for compact integration into electronic devices, saving space and enabling sleek designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the EEPROM can operate in a wide range of harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in the EEPROM offers low power consumption, fast operation, and high noise immunity, making it an efficient and reliable choice for various applications.

Endurance: 1000000 Write/Erase Cycles

The EEPROM's high endurance of 1,000,000 write/erase cycles ensures long-term reliability and durability for frequent data read/write operations.

Technical Specifications

EEPROM 93LC66AT-I/MNY attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

.8 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Width:

2 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

SOFTWARE

Trade Compliance

93LC66AT-I/MNY Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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