Loading...

CAT25010LI-GD

Onsemi

CAT25010LI-GD by Onsemi

CAT25010LI-GD by Onsemi is an EEPROM with 128x8 organization, operating at 5V. It features SPI serial bus type, 10MHz clock frequency, and 1000000 write/erase cycles endurance. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 61,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

61,000

-

-

-

-

Vyrian

USA . 4,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,945

-

-

-

-

Digiode

USA . 696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

696

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 807 parts In-Stock

1+ parts

$13.180

100+ parts

-

1k+ parts

-

10k+ parts

-

807

$13.180

-

-

-

Northwest PG Solutions

USA . 233 parts In-Stock

1+ parts

$14.498

100+ parts

$13.048

1k+ parts

-

10k+ parts

-

233

$14.498

$13.048

-

-

AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$21.650

100+ parts

-

1k+ parts

-

10k+ parts

-

668

$21.650

-

-

-

Component Stockers USA

USA . 404 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,443

-

-

-

-

TANS Electronics

Latvia . 7,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,888

-

-

-

-

Microchip USA

USA . 7,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,364

-

-

-

-

Kulean Microsystems

USA . 6,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,584

-

-

-

-

SupplyDigital Components

Austria . 2,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,595

-

-

-

-

Problanco Electronics

Mexico . 808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

808

-

-

-

-

UHIMA Technologies

Türkiye . 607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

607

-

-

-

-

Corohmni

South Africa . 443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

443

-

-

-

-

Corphita

USA . 121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

121

-

-

-

-

Overview

Unlock endless possibilities with the CAT25010LI-GD EEPROM from Onsemi. Crafted with precision and expertise, this high-quality memory IC offers unparalleled value for a wide range of applications. Whether you're looking to enhance performance in industrial settings or streamline operations in consumer electronics, this versatile product delivers reliability and efficiency. Say goodbye to limitations and embrace innovation with the CAT25010LI-GD by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

Allows for precise timing and control of data transfer, improving overall performance.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently at a standard voltage level, making it compatible with a wide range of devices.

Organization: 128X8

Offers a good balance between memory capacity and data width, suitable for various applications.

Write Protection: HARDWARE/SOFTWARE

Provides added security by allowing for both hardware and software protection of the data stored in the EEPROM.

Temperature Grade: INDUSTRIAL

Can operate effectively in industrial environments with a wide temperature range, ensuring reliability in harsh conditions.

Memory Density: 1024 bit

Offers a sufficient amount of storage capacity for storing data, codes, or configurations in the EEPROM.

Serial Bus Type: SPI

Utilizes a widely-used communication protocol, enabling easy integration with other devices supporting SPI.

Technical Specifications

EEPROM CAT25010LI-GD attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CAT25010LI-GD Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20