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CAT24M01LI-G

Onsemi

CAT24M01LI-G by Onsemi

CAT24M01LI-G by Onsemi is an 8-terminal EEPROM with 128KX8 organization, operating at 3.3V. It features a max clock frequency of 0.4 MHz and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.

Median Price

$0.966

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.966

100+ parts

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300

$0.966

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Chip Stock

USA . 32,000 parts In-Stock

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32,000

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Vyrian

USA . 9,878 parts In-Stock

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9,878

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Sensible Micro Corp

USA . 3,040 parts In-Stock

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3,040

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Digiode

USA . 2,418 parts In-Stock

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2,418

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Cyclops Electronics Ltd

UK . 760 parts In-Stock

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760

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ComSIT Distribution GmbH

Germany . 570 parts In-Stock

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570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.947

100+ parts

-

1k+ parts

$0.909

10k+ parts

-

1,000

$0.947

-

$0.909

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Continental Prestige Electronics

USA . 6,962 parts In-Stock

1+ parts

$0.966

100+ parts

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$0.947

6,962

$0.966

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$0.947

Argo Parts USA

USA . 179 parts In-Stock

1+ parts

$0.966

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179

$0.966

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Aztec Data Supply Inc.

USA . 291 parts In-Stock

1+ parts

$3.370

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291

$3.370

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$7.788

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884

$7.788

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Ampacity Inc.

Singapore . 1,424 parts In-Stock

1+ parts

$15.000

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1,424

$15.000

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Kulean Microsystems

USA . 5,940 parts In-Stock

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5,940

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SupplyDigital Components

Austria . 5,779 parts In-Stock

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5,779

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Problanco Electronics

Mexico . 4,207 parts In-Stock

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TANS Electronics

Latvia . 2,413 parts In-Stock

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2,413

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Microchip USA

USA . 1,714 parts In-Stock

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1,714

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

1+ parts

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100+ parts

$5.033

1k+ parts

$4.661

10k+ parts

$4.661

900

-

$5.033

$4.661

$4.661

Perfect Parts

USA . 778 parts In-Stock

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778

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Corohmni

South Africa . 432 parts In-Stock

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432

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Corphita

USA . 158 parts In-Stock

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158

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UHIMA Technologies

Türkiye . 6 parts In-Stock

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6

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Overview

Unlock the power of advanced data storage with the CAT24M01LI-G EEPROM by Onsemi. Known for their high-quality products, Onsemi delivers a reliable and durable solution for your memory needs. Whether you're looking to enhance security in automotive applications or increase efficiency in industrial settings, this EEPROM offers unparalleled value. With a wide operating temperature range and long data retention time, you can trust this product to perform flawlessly in any environment. Upgrade your system with the CAT24M01LI-G and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for package construction, ensuring long-term performance and protection of the internal components.

Operating Mode: SYNCHRONOUS

Allows for precise and coordinated data transfer, making the EEPROM efficient and reliable in synchronous operations.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient performance and stability of the EEPROM.

Write Protection: HARDWARE

Enhanced security feature to prevent unauthorized write operations, ensuring data integrity and reliability.

Memory IC Type: EEPROM

Being an EEPROM (Electrically Erasable Programmable Read-Only Memory) chip, it allows for flexible and non-volatile data storage and retrieval.

Technical Specifications

EEPROM CAT24M01LI-G attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.27 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAT24M01LI-G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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