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M95320-DRDW6TP

STMicroelectronics

M95320-DRDW6TP by STMicroelectronics

M95320-DRDW6TP by STMicroelectronics is an EEPROM with 4KX8 organization, SPI serial bus type, and 32768-bit memory density. It operates in industrial temperature range (-40 to 85 °C) and offers 1000000 write/erase cycles endurance. Ideal for applications requiring small outline, thin profile packages with hardware/software write protection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,802

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-

-

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Digiode

USA . 1,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,955

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Anansix

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,011 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

$2.244

10k+ parts

-

1,011

$2.493

-

$2.244

-

MKK Technologies

India . 2,124 parts In-Stock

1+ parts

$4.688

100+ parts

-

1k+ parts

-

10k+ parts

-

2,124

$4.688

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DigiPath Technology Company

USA . 2,124 parts In-Stock

1+ parts

$4.688

100+ parts

-

1k+ parts

-

10k+ parts

-

2,124

$4.688

-

-

-

AZTECH Wire

Italy . 1,152 parts In-Stock

1+ parts

$20.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,152

$20.120

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-

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Microchip USA

USA . 2,700 parts In-Stock

1+ parts

$34.393

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

$34.393

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-

-

Parana Technologies

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

$2.981

1k+ parts

-

10k+ parts

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1,927

-

$2.981

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Corphita

USA . 589 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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589

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Overview

Unlock endless possibilities with the M95320-DRDW6TP by STMicroelectronics, a high-quality EEPROM that provides reliable data storage in industrial applications. With a durable plastic/epoxy package and a sleek small outline design, this EEPROM offers 4Kx8 organization and 32768-bit memory density. Experience the convenience of hardware/software write protection and SPI serial bus communication. Trust STMicroelectronics' reputation for excellence and innovation to deliver a product that exceeds expectations. Upgrade your systems with the M95320-DRDW6TP and enjoy peace of mind knowing your data is secure and easily accessible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and improving overall design flexibility.

Power Supplies (V): 2/5

Compatible with a wide range of power supplies, making it versatile for different electronic applications.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with other components in the system.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, suitable for industrial applications.

Organization: 4KX8

Offers a large memory capacity of 4Kx8, providing ample storage for data and program code.

Write Protection: HARDWARE/SOFTWARE

Enhances data security by allowing the user to protect the stored information from unauthorized access or modifications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, extending battery life in portable devices.

Parallel or Serial: SERIAL

Enables serial communication with other devices, simplifying data transfer and integration into the system.

Endurance: 1000000 Write/Erase Cycles

Offers high endurance for frequent write and erase operations, ensuring reliable performance over an extended period.

Technical Specifications

EEPROM M95320-DRDW6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

4096 words

No. of Words Code:

4K

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95320-DRDW6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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