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M95320-BN6T

STMicroelectronics

M95320-BN6T by STMicroelectronics

M95320-BN6T by STMicroelectronics is a 4Kx8 EEPROM with a max clock frequency of 20 MHz and operates in synchronous mode. It features an industrial temperature grade, functioning b/w -40 °C to 85 °C. Ideal for SPI applications, it ensures reliable data storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,186 parts In-Stock

1+ parts

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3,186

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Vyrian

USA . 1,397 parts In-Stock

1+ parts

-

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1,397

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Anansix

USA . 1,389 parts In-Stock

1+ parts

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1,389

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,109 parts In-Stock

1+ parts

$2.701

100+ parts

-

1k+ parts

$2.431

10k+ parts

-

2,109

$2.701

-

$2.431

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MKK Technologies

India . 1,491 parts In-Stock

1+ parts

$5.079

100+ parts

-

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1,491

$5.079

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DigiPath Technology Company

USA . 1,491 parts In-Stock

1+ parts

$5.079

100+ parts

-

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-

1,491

$5.079

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Corphita

USA . 2,322 parts In-Stock

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2,322

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Parana Technologies

USA . 1,243 parts In-Stock

1+ parts

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100+ parts

$3.230

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1,243

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$3.230

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Overview

Unlock innovation with the M95320-BN6T EEPROM from STMicroelectronics, a trusted leader in semiconductor solutions. This high-performance memory device combines reliability and efficiency, making it ideal for automotive, industrial, and consumer applications. With its robust temperature range and synchronous operation, you'll enjoy faster data access and enhanced system performance. Choose M95320-BN6T for superior quality and peace of mind, knowing you’re backed by a world-class manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and resilience against environmental factors.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and optimized use of board space.

Operating Mode: SYNCHRONOUS

Synchronous operation provides high-speed performance and better data transfer efficiency.

Nominal Supply Voltage / Vsup: 5 V

A standard nominal voltage compatible with many devices, simplifying integration.

No. of Terminals: 8

With 8 terminals, this EEPROM offers a straightforward interface for connection.

Package Style (Meter): IN-LINE

In-line packaging eases installation and provides stability on PCB.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, it can operate under harsh conditions without failure.

Organization: 4KX8

This organization provides efficient data handling, catering to a variety of applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold, making it ideal for outdoor and specialized environments.

Terminal Finish: Tin/Lead (Sn60Pb40)

The Tin/Lead finish ensures excellent solderability and reliability during assembly.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in design and mounting options.

Maximum Seated Height: 5.33 mm

A low seated height suitable for compact designs and space-constrained applications.

Maximum Clock Frequency (fCLK): 20 MHz

High clock frequency allows for faster data processing and communication speeds.

Width: 7.62 mm

Compact width enables space-efficient designs without compromising performance.

Minimum Supply Voltage (Vsup): 4.5 V

Allows functionality in a range of supply voltages, ensuring versatility in applications.

Length: 9.27 mm

Maintains a compact footprint, ideal for tight layouts and constrained spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, it ensures durability and reliability.

Technology: CMOS

CMOS technology delivers low power consumption while maintaining high-speed operation.

Parallel or Serial: SERIAL

Serial interface simplifies connections and reduces footprint compared to parallel systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliability in various environments.

No. of Words: 4096 words

Provides ample storage capacity for moderate data needs, perfect for many applications.

Memory Width: 8

An 8-bit wide memory structure suits a wide range of microcontroller applications.

Terminal Pitch: 2.54 mm

Standard pitch allows for compatibility with a variety of sockets and PCB designs.

No. of Words Code: 4K

4K words ensure efficient storage for microcontroller applications and firmware.

Maximum Supply Voltage (Vsup): 5.5 V

A higher maximum voltage tolerance provides flexibility in power supply choices.

Serial Bus Type: SPI

SPI protocol offers fast data transmission and is widely supported in microcontroller applications.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle times enhance the performance for frequently updated applications.

Memory Density: 32768 bit

High memory density supports complex applications with greater data storage capabilities.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatile memory, perfect for storing critical data permanently.

Technical Specifications

EEPROM M95320-BN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

20 MHz

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.27 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn60Pb40)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M95320-BN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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