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AT24CS01-SSHM-TVAO

Microchip Technology

AT24CS01-SSHM-TVAO by Microchip Technology

AT24CS01-SSHM-TVAO by Microchip: 1024-bit EEPROM with I2C serial bus, 128x8 organization, and AEC-Q100 screening. Ideal for automotive applications due to -40°C to 85°C operating range and hardware write protection. Compact package style, low standby current of 0.000006A, and endurance of 1M cycles make it versatile in various systems.

Median Price

$2.816

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$2.816

100+ parts

$2.675

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$2.675

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50

$2.816

$2.675

$2.675

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Distributors (In-Stock)

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Vyrian

USA . 8,353 parts In-Stock

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VNN

France . 849 parts In-Stock

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849

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,856 parts In-Stock

1+ parts

$1.993

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2,856

$1.993

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Ampacity Inc.

Singapore . 50 parts In-Stock

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$2.390

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$2.390

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Semicontronic

India . 50 parts In-Stock

1+ parts

$2.390

100+ parts

$2.330

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$2.318

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50

$2.390

$2.330

$2.318

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$2.816

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$2.675

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$2.675

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50

$2.816

$2.675

$2.675

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Corohmni

South Africa . 282 parts In-Stock

1+ parts

$5.012

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282

$5.012

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AZTECH Wire

Italy . 500 parts In-Stock

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$13.573

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NIA Electronics

USA . 5,350 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,166 parts In-Stock

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Argo Parts USA

USA . 4,379 parts In-Stock

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Montano Global Distributors

Canada . 3,388 parts In-Stock

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Continental Prestige Electronics

USA . 2,488 parts In-Stock

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LMD Electronica

Estonia . 2,123 parts In-Stock

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Ledger Components

France . 934 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your electronic projects with the AT24CS01-SSHM-TVAO EEPROM by Microchip Technology. With a reputation for top-quality components, Microchip delivers a reliable and efficient memory solution for a variety of applications. This small outline package offers a wide range of benefits, including easy integration, low power consumption, and high endurance. Upgrade your designs with the AT24CS01-SSHM-TVAO and experience the value of superior performance and longevity in your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it a reliable choice.

Surface Mount

YES - Allows for easy installation on circuit boards, saving space and simplifying assembly processes.

Screening Level

AEC-Q100 - Ensures high quality and reliability, making it suitable for automotive applications.

Package Shape

RECTANGULAR - Offers a compact design that is efficient for space-constrained applications.

Operating Mode

SYNCHRONOUS - Provides synchronous data transfer for faster and more efficient communication.

Nominal Supply Voltage

3V - Operates at a commonly used voltage level, ensuring compatibility with a wide range of systems.

No. of Terminals

8 - Offers a sufficient number of terminals for connecting to other components within a system.

Package Style (Meter)

SMALL OUTLINE - Features a small and slim design, ideal for compact electronic devices.

Maximum Operating Temperature

85 °C - Can withstand high temperatures, suitable for various operating environments.

Organization

128X8 - Provides a balanced organization of memory cells, optimizing storage capacity and access speed.

Technical Specifications

EEPROM AT24CS01-SSHM-TVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES 1.7V AT 400 KHZ

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000006 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

AT24CS01-SSHM-TVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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