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24FC64T-I/MF

Microchip Technology

24FC64T-I/MF by Microchip Technology

24FC64T-I/MF by Microchip Technology is an EEPROM with 8Kx8 organization, 65536-bit memory density, and 1000000 write/erase cycles endurance. It operates in industrial temperature grade, has a max clock frequency of 1 MHz, and uses I2C serial bus type. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.

Median Price

$0.940

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.940

100+ parts

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450

$0.940

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Vyrian

USA . 3,927 parts In-Stock

1+ parts

-

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3,927

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VNN

France . 1,046 parts In-Stock

1+ parts

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1,046

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,955 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

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3,955

$0.940

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Continental Prestige Electronics

USA . 3,686 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

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$0.921

3,686

$0.940

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-

$0.921

Ampacity Inc.

Singapore . 170 parts In-Stock

1+ parts

$5.000

100+ parts

-

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170

$5.000

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AZTECH Wire

Italy . 562 parts In-Stock

1+ parts

$9.526

100+ parts

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562

$9.526

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RGB Technical Solutions

Ukraine . 4,302 parts In-Stock

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4,302

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Overview

Unlock endless possibilities with the 24FC64T-I/MF by Microchip Technology. This high-quality EEPROM offers reliable performance and durability, making it the perfect choice for a wide range of applications. With a focus on value and innovation, Microchip Technology delivers a product that exceeds expectations. Whether you're looking to enhance your IoT devices or streamline your automotive systems, this EEPROM provides the efficiency and reliability you need. Trust in Microchip Technology to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM chip, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort in the assembly process.

Operating Mode: SYNCHRONOUS

Enables synchronized operation with other components in the system, leading to better performance.

Nominal Supply Voltage / Vsup (V): 4.5

Stable supply voltage ensures reliable operation of the EEPROM chip.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures longevity and reliability of the EEPROM chip.

Serial Bus Type: I2C

I2C bus protocol allows for easy interfacing with other devices, enhancing connectivity in the system.

Technical Specifications

EEPROM 24FC64T-I/MF attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.7V TO 2.5V @ 0.4MHZ

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Programming Voltage (V):

4.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24FC64T-I/MF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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