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24FC64-I/MS

Microchip Technology

24FC64-I/MS by Microchip Technology

24FC64-I/MS by Microchip Tech is an 8KX8 EEPROM with I2C control byte. Operating at 1 MHz, it offers 1000000 write/erase cycles and -40 to 85°C temp range. Ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package.

Median Price

$0.503

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,200 parts In-Stock

1+ parts

$0.460

100+ parts

$0.430

1k+ parts

$0.400

10k+ parts

$0.380

2,200

$0.460

$0.430

$0.400

$0.380

Mouser Electronics

USA . 793 parts In-Stock

1+ parts

$0.460

100+ parts

$0.448

1k+ parts

$0.446

10k+ parts

$0.442

793

$0.460

$0.448

$0.446

$0.442

DigiKey

USA . 451 parts In-Stock

1+ parts

$0.460

100+ parts

$0.448

1k+ parts

-

10k+ parts

-

451

$0.460

$0.448

-

-

Newark

USA . 550 parts In-Stock

1+ parts

$0.474

100+ parts

$0.461

1k+ parts

-

10k+ parts

-

550

$0.474

$0.461

-

-

Arrow

USA . 693 parts In-Stock

1+ parts

$0.532

100+ parts

$0.519

1k+ parts

$0.507

10k+ parts

-

693

$0.532

$0.519

$0.507

-

Farnell

UK . 1,057 parts In-Stock

1+ parts

$0.604

100+ parts

$0.569

1k+ parts

$0.557

10k+ parts

-

1,057

$0.604

$0.569

$0.557

-

Element14

Singapore . 1,057 parts In-Stock

1+ parts

$0.630

100+ parts

$0.592

1k+ parts

-

10k+ parts

-

1,057

$0.630

$0.592

-

-

Verical

USA . 693 parts In-Stock

1+ parts

-

100+ parts

$0.914

1k+ parts

-

10k+ parts

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693

-

$0.914

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Avnet

USA . 200 parts In-Stock

1+ parts

-

100+ parts

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200

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

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100

$0.560

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Vyrian

USA . 3,433 parts In-Stock

1+ parts

-

100+ parts

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3,433

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VNN

France . 1,771 parts In-Stock

1+ parts

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1,771

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Sensible Micro Corp

USA . 67 parts In-Stock

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67

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,179 parts In-Stock

1+ parts

$0.403

100+ parts

$0.382

1k+ parts

-

10k+ parts

-

1,179

$0.403

$0.382

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-

Vigor

Singapore . 367 parts In-Stock

1+ parts

$0.440

100+ parts

-

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10k+ parts

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367

$0.440

-

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Semicontronic

India . 3,288 parts In-Stock

1+ parts

$0.441

100+ parts

$0.430

1k+ parts

$0.428

10k+ parts

-

3,288

$0.441

$0.430

$0.428

-

Ampacity Inc.

Singapore . 2,993 parts In-Stock

1+ parts

$0.441

100+ parts

-

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10k+ parts

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2,993

$0.441

-

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Argo Parts USA

USA . 4,022 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

$0.543

4,022

$0.560

-

-

$0.543

Aztec Data Supply Inc.

USA . 4,407 parts In-Stock

1+ parts

$3.220

100+ parts

-

1k+ parts

-

10k+ parts

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4,407

$3.220

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Corohmni

South Africa . 6 parts In-Stock

1+ parts

$3.985

100+ parts

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6

$3.985

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Lixinc

USA . 14,292 parts In-Stock

1+ parts

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14,292

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Perfect Parts

USA . 8,876 parts In-Stock

1+ parts

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8,876

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Fulton Briggs Corp.

USA . 2,401 parts In-Stock

1+ parts

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2,401

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Eastek

USA . 500 parts In-Stock

1+ parts

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500

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.549

1k+ parts

$0.532

10k+ parts

$0.521

100

-

$0.549

$0.532

$0.521

Overview

Unlock the power of reliable data storage with the 24FC64-I/MS EEPROM by Microchip Technology. Designed for industrial applications, this high-quality memory chip offers a compact design and durable construction, making it ideal for a wide range of projects. With 8Kx8 organization and 1000000 write/erase cycles endurance, this EEPROM delivers consistent performance and peace of mind. Trust in Microchip Technology's expertise and elevate your designs with the 24FC64-I/MS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM chip, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and making it suitable for mass production.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, making it suitable for use in automotive applications.

Operating Mode: SYNCHRONOUS

Enables efficient and synchronized data transfer, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for the EEPROM chip, ensuring stable operation and data retention.

Power Supplies (V): 2/5

Offers flexibility in power supply options for different applications, enhancing compatibility.

No. of Terminals: 8

Provides multiple connection points for data input/output and power, ensuring reliable communication with the system.

Package Style (Meter): SMALL OUTLINE

Compact package design saves space on the circuit board, ideal for devices with limited space.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without compromising performance, suitable for industrial use.

Organization: 8KX8

Organized memory structure allows for efficient storage and retrieval of data, improving data access speed.

Output Characteristics: OPEN-DRAIN

Open-drain output design allows for easy interfacing with other components, enhancing system compatibility.

Minimum Operating Temperature: -40 °C

Maintains stable performance in low-temperature conditions, making it suitable for a wide range of environments.

Terminal Finish: Matte Tin (Sn)

Provides a reliable and durable finish on the terminals, ensuring secure connections and long-term reliability.

I2C Control Byte: 1010DDDR

Standardized control byte format for I2C communication, ensuring compatibility with other I2C devices.

Terminal Position: DUAL

Dual terminal position provides multiple connection options, enhancing flexibility in system design.

Write Protection: HARDWARE

Hardware-based write protection feature prevents accidental data corruption, ensuring data integrity.

Maximum Seated Height: 1.1 mm

Low-profile package design allows for easy integration into compact devices, ideal for space-constrained applications.

Maximum Clock Frequency (fCLK): 1 MHz

High clock frequency enables fast data transfer, improving overall system performance.

Width: 3 mm

Compact width size saves space on the circuit board, suitable for small electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during assembly process, reducing the risk of damage to the EEPROM chip.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures secure solder joints during manufacturing process.

Length: 3 mm

Compact length size saves space on the circuit board, suitable for small electronic devices.

Programming Voltage (V): 4.5

Optimal programming voltage for the EEPROM chip, ensuring reliable data programming and retention.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall reliability.

Parallel or Serial: SERIAL

Serial interface allows for easy integration with microcontrollers and other serial devices, enhancing compatibility.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections, ensuring reliable electrical connections.

Maximum Supply Current: 3 mA

Low maximum supply current requirement for efficient power consumption, ideal for battery-powered devices.

No. of Words: 8192 words

Large memory capacity for storing a significant amount of data, suitable for data-intensive applications.

Memory Width: 8

8-bit memory width allows for efficient data storage and retrieval, improving overall system performance.

Minimum Data Retention Time: 200

Long data retention time ensures data integrity and reliability, suitable for critical data storage.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for compact design and high-density mounting, ideal for space-constrained applications.

No. of Words Code: 8K

Standard code for memory capacity, making it easy to identify and integrate into the system.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance for flexibility in power supply options, enhancing compatibility.

Endurance: 1000000 Write/Erase Cycles

High write/erase cycle endurance ensures long-term data storage and reliability, suitable for frequent data updates.

Serial Bus Type: I2C

I2C serial bus interface allows for easy communication with other I2C devices, enhancing system compatibility.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time for efficient data programming, improving overall system performance.

Memory Density: 65536 bit

High memory density for storing a large amount of data in a compact size, suitable for data-intensive applications.

Memory IC Type: EEPROM

Specifically designed for data storage and retrieval, ensuring reliable performance for data-intensive applications.

Maximum Standby Current: 0.000001 Amp

Low standby current consumption for energy-efficient operation, ideal for battery-powered devices.

Technical Specifications

EEPROM 24FC64-I/MS attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.7V TO 2.5V @ 0.4MHZ

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

4.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24FC64-I/MS Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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