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LE24512AQF-AH

Onsemi

LE24512AQF-AH by Onsemi

LE24512AQF-AH by Onsemi is an EEPROM with 64KX8 organization, operating at -40 to 85 °C. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for industrial applications requiring a memory density of 524288 bit and serial bus type I2C communication.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,000 parts In-Stock

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$0.390

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$0.390

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Chip Stock

USA . 45,000 parts In-Stock

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45,000

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Vyrian

USA . 9,692 parts In-Stock

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Digiode

USA . 539 parts In-Stock

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539

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Distributors (Availability)

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Corohmni

South Africa . 340 parts In-Stock

1+ parts

$0.390

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340

$0.390

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AZTECH Wire

Italy . 938 parts In-Stock

1+ parts

$22.150

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938

$22.150

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GreenTree Electronics

Israel . 10,970 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,351 parts In-Stock

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TANS Electronics

Latvia . 5,765 parts In-Stock

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Kulean Microsystems

USA . 5,114 parts In-Stock

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SupplyDigital Components

Austria . 4,529 parts In-Stock

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4,529

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Alle Elektronik GmbH

Germany . 4,234 parts In-Stock

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4,234

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,720 parts In-Stock

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Component Stockers USA

USA . 2,441 parts In-Stock

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Corphita

USA . 2,235 parts In-Stock

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Microchip USA

USA . 360 parts In-Stock

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360

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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264

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Overview

Unlock the power of data storage with the LE24512AQF-AH by Onsemi, a top-quality EEPROM that promises reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this EEPROM is ideal for a wide range of applications. With its compact design and high-end features, it provides customers with unparalleled value and benefits. Say goodbye to data loss worries and hello to seamless operation with the LE24512AQF-AH. Experience the advantages firsthand and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the EEPROM, ensuring it can withstand harsh environmental conditions.

Surface Mount: YES

Surface mount capability makes it easy to integrate the EEPROM onto circuit boards, saving space and simplifying assembly.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different setups.

No. of Terminals: 8

A moderate number of terminals makes it easy to connect the EEPROM to other components and peripherals in the system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the EEPROM in a variety of operating conditions.

Organization: 64KX8

Organized as 64Kx8, this EEPROM offers a large storage capacity and efficient data organization for various applications.

Write Protection: HARDWARE

Hardware-based write protection adds an extra layer of security to prevent accidental or unauthorized write operations on the EEPROM.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the EEPROM energy efficient and high performing.

Endurance: 1000000 Write/Erase Cycles

High endurance of 1,000,000 write/erase cycles ensures longevity and reliability of the EEPROM for frequent data read/write operations.

Serial Bus Type: I2C

I2C serial bus type allows for easy integration and communication with other devices, making the EEPROM versatile and compatible in various systems.

Technical Specifications

EEPROM LE24512AQF-AH attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Minimum Data Retention Time:

20

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Write Protection:

HARDWARE

Trade Compliance

LE24512AQF-AH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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