Loading...

LE24L042CS-B-SH

Onsemi

LE24L042CS-B-SH by Onsemi

LE24L042CS-B-SH by Onsemi is a 512x8 EEPROM with 2.5V nominal voltage, operating at -40 to 85°C. It features I2C serial bus type, 0.4 MHz clock frequency, and 10ms write cycle time. Ideal for industrial applications requiring low-power memory storage in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

-

-

-

-

Digiode

USA . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

215

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 354 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

354

$10.000

-

-

-

AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$14.958

100+ parts

-

1k+ parts

-

10k+ parts

-

786

$14.958

-

-

-

SupplyDigital Components

Austria . 7,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,416

-

-

-

-

Kulean Microsystems

USA . 7,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,252

-

-

-

-

Continental Prestige Electronics

USA . 6,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,547

-

-

-

-

Problanco Electronics

Mexico . 3,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,634

-

-

-

-

Argo Parts USA

USA . 2,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,867

-

-

-

-

Corphita

USA . 2,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

-

-

-

-

UHIMA Technologies

Türkiye . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Corohmni

South Africa . 367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

367

-

-

-

-

TANS Electronics

Latvia . 123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

123

-

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Unlock the power of reliable data storage with the LE24L042CS-B-SH by Onsemi. Crafted with precision and expertise, this EEPROM offers a seamless solution for various applications in industrial settings. With a focus on quality and performance, Onsemi delivers a product that stands out for its value and benefits to customers. Experience the advantages of this innovative technology and elevate your projects with ease. Choose the LE24L042CS-B-SH for unparalleled efficiency and peace of mind in your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the EEPROM, ensuring durability and reliability.

Operating Mode: SYNCHRONOUS

Allows for efficient and synchronized data transfers, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal voltage for stable operation, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the EEPROM to function in extreme environments.

Memory Density: 4096 bit

Offers a high storage capacity in a compact package, ideal for various applications.

Serial Bus Type: I2C

Supports serial communication protocol, enabling easy integration with other devices.

Technical Specifications

EEPROM LE24L042CS-B-SH attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Additional Features:

20 YEAR DATA RETENTION

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.5 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Maximum Seated Height:

.5 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.06 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

LE24L042CS-B-SH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20