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LE2432RDXATDG

Onsemi

LE2432RDXATDG by Onsemi

LE2432RDXATDG by Onsemi is a 4KX8 EEPROM with 32768 bit memory density. It operates at 1 MHz clock frequency, has a supply voltage range of 1.7V to 3.6V, and uses I2C serial bus type. Ideal for industrial applications requiring reliable non-volatile memory storage in compact devices.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.170

20,000

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-

-

$0.170

Flip Electronics (Authorized)

USA . 20,000 parts In-Stock

1+ parts

-

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20,000

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Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$0.246

1k+ parts

$0.204

10k+ parts

$0.182

5,000

-

$0.246

$0.204

$0.182

Farnell

UK . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.162

5,000

-

-

-

$0.162

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.256

5,000

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-

-

$0.256

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,719 parts In-Stock

1+ parts

$0.162

100+ parts

-

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1,719

$0.162

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Digiode

USA . 1,926 parts In-Stock

1+ parts

$0.192

100+ parts

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10k+ parts

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1,926

$0.192

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Flip Electronics

USA . 20,000 parts In-Stock

1+ parts

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100+ parts

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20,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,170 parts In-Stock

1+ parts

$0.138

100+ parts

-

1k+ parts

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10k+ parts

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12,170

$0.138

-

-

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Corohmni

South Africa . 165 parts In-Stock

1+ parts

$0.162

100+ parts

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165

$0.162

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Corphita

USA . 1,166 parts In-Stock

1+ parts

$0.182

100+ parts

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10k+ parts

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1,166

$0.182

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

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Problanco Electronics

Mexico . 8,209 parts In-Stock

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8,209

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SupplyDigital Components

Austria . 7,494 parts In-Stock

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7,494

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.162

10k+ parts

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5,000

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$0.162

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Kulean Microsystems

USA . 4,460 parts In-Stock

1+ parts

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4,460

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UHIMA Technologies

Türkiye . 782 parts In-Stock

1+ parts

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782

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TANS Electronics

Latvia . 484 parts In-Stock

1+ parts

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484

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Microchip USA

USA . 112 parts In-Stock

1+ parts

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112

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Overview

Discover the innovative LE2432RDXATDG EEPROM by Onsemi, setting new standards for quality and reliability. With a focus on cutting-edge technology and precision engineering, Onsemi delivers exceptional performance and durability. This versatile EEPROM is perfect for a wide range of applications, providing seamless operation and seamless integration. Experience the value and benefits of this product firsthand, with its compact design and advanced features offering unmatched advantages to customers seeking top-notch performance in their devices. Elevate your projects with the LE2432RDXATDG and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the EEPROM, making it suitable for various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination within the EEPROM, enhancing overall performance and reliability.

Nominal Supply Voltage: 2V

A low nominal supply voltage of 2V helps in reducing power consumption, making the EEPROM energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this EEPROM can withstand harsh environments and wide temperature ranges.

Organization: 4KX8

The organizational structure of 4KX8 allows for efficient data storage and retrieval, making the EEPROM suitable for data-intensive applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this EEPROM a reliable choice for various electronic devices.

Memory Density: 32768 bit

With a memory density of 32768 bits, this EEPROM offers ample storage capacity for data-intensive applications.

Serial Bus Type: I2C

The I2C serial bus type enables easy interfacing with other devices, simplifying the integration of this EEPROM into existing systems.

Technical Specifications

EEPROM LE2432RDXATDG attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.2 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.8 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

LE2432RDXATDG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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