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LE2464CXATBG

Onsemi

LE2464CXATBG by Onsemi

LE2464CXATBG by Onsemi is a 8KX8 EEPROM with 65536 bit memory density. It operates at 2.5V, has a clock frequency of 0.4 MHz, and supports I2C serial bus type. Ideal for industrial applications requiring reliable non-volatile memory storage in compact devices.

Median Price

$0.378

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 576,499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.380

10k+ parts

-

576,499

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-

$0.380

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Rochester

USA . 573,899 parts In-Stock

1+ parts

-

100+ parts

$0.365

1k+ parts

$0.303

10k+ parts

$0.271

573,899

-

$0.365

$0.303

$0.271

Verical

USA . 573,899 parts In-Stock

1+ parts

-

100+ parts

-

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$0.379

10k+ parts

$0.338

573,899

-

-

$0.379

$0.338

Farnell

UK . 540,230 parts In-Stock

1+ parts

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540,230

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Flip Electronics (Authorized)

USA . 15,000 parts In-Stock

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15,000

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Element14

Singapore . 2,225 parts In-Stock

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$0.376

10k+ parts

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2,225

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-

$0.376

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 88 parts In-Stock

1+ parts

$0.285

100+ parts

-

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88

$0.285

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Vyrian

USA . 380,691 parts In-Stock

1+ parts

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380,691

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Cyclops Electronics Ltd

UK . 644 parts In-Stock

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644

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,230 parts In-Stock

1+ parts

$0.120

100+ parts

-

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10k+ parts

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2,230

$0.120

-

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Semicontronic

India . 381,154 parts In-Stock

1+ parts

$0.255

100+ parts

$0.249

1k+ parts

$0.247

10k+ parts

-

381,154

$0.255

$0.249

$0.247

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Corphita

USA . 146 parts In-Stock

1+ parts

$0.270

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146

$0.270

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Corohmni

South Africa . 173 parts In-Stock

1+ parts

$0.300

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173

$0.300

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Ampacity Inc.

Singapore . 380,886 parts In-Stock

1+ parts

$0.560

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380,886

$0.560

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Aztec Data Supply Inc.

USA . 1,804 parts In-Stock

1+ parts

$4.450

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1,804

$4.450

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$6.114

100+ parts

$5.564

1k+ parts

$5.013

10k+ parts

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70

$6.114

$5.564

$5.013

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Assy Fe

Spain . 25,000 parts In-Stock

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25,000

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Perfect Parts

USA . 23,839 parts In-Stock

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23,839

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Lixinc

USA . 8,210 parts In-Stock

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8,210

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A-Z Elektronik GmbH

Germany . 6,671 parts In-Stock

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6,671

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SupplyDigital Components

Austria . 5,522 parts In-Stock

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5,522

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,742 parts In-Stock

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4,742

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Alle Elektronik GmbH

Germany . 4,447 parts In-Stock

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4,447

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Argo Parts USA

USA . 2,518 parts In-Stock

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2,518

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Problanco Electronics

Mexico . 1,526 parts In-Stock

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1,526

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UHIMA Technologies

Türkiye . 811 parts In-Stock

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811

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 280 parts In-Stock

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280

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TANS Electronics

Latvia . 136 parts In-Stock

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136

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Overview

Discover the unparalleled quality and reliability of the LE2464CXATBG EEPROM by Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers cutting-edge technology that exceeds industry standards. This versatile EEPROM is perfect for a wide range of applications, offering customers seamless operation and enhanced performance. Unlock the value of this product and experience the benefits of its innovative design, making it a smart choice for your next project. Elevate your system with the LE2464CXATBG and see the difference it can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it resistant to external elements and ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and making it suitable for compact electronic devices.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures that data transfer is efficient and reliable, making it ideal for high-performance applications.

Nominal Supply Voltage: 2.5V

The low supply voltage requirement of 2.5V helps in reducing power consumption and extending battery life in portable electronic devices.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature of 85°C, this EEPROM can withstand harsh environmental conditions and maintain stable performance.

Organization: 8KX8

The 8KX8 organization offers a sufficient memory capacity and organization for storing data efficiently, meeting the requirements of various applications.

Technology: CMOS

The CMOS technology used in this EEPROM ensures low power consumption and high speed operation, making it energy-efficient and suitable for battery-operated devices.

Serial Bus Type: I2C

The I2C serial bus interface provides a standardized and easy communication protocol, enabling seamless integration with other I2C-compatible devices in a system.

Technical Specifications

EEPROM LE2464CXATBG attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.2 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.8 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

LE2464CXATBG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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