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LE2416RDXATDG

Onsemi

LE2416RDXATDG by Onsemi

LE2416RDXATDG by Onsemi is a 2Kx8 EEPROM with 16384-bit memory density. It operates at 1MHz clock frequency, has I2C serial bus type, and supports synchronous mode. Ideal for industrial applications requiring low power consumption and reliable non-volatile memory storage.

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$0.260

1k+ parts

$0.216

10k+ parts

$0.192

5,000

-

$0.260

$0.216

$0.192

Farnell

UK . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.201

5,000

-

-

-

$0.201

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

5,000

-

-

-

$0.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,596 parts In-Stock

1+ parts

$0.202

100+ parts

-

1k+ parts

-

10k+ parts

-

1,596

$0.202

-

-

-

Vyrian

USA . 4,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,085

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 362 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

-

10k+ parts

-

362

$0.192

-

-

-

Corohmni

South Africa . 79 parts In-Stock

1+ parts

$0.201

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$0.201

-

-

-

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$17.060

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$17.060

-

-

-

TANS Electronics

Latvia . 6,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,717

-

-

-

-

Kulean Microsystems

USA . 6,495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,495

-

-

-

-

Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.201

10k+ parts

-

5,000

-

-

$0.201

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

SupplyDigital Components

Austria . 1,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

-

-

-

-

Problanco Electronics

Mexico . 957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

957

-

-

-

-

UHIMA Technologies

Türkiye . 943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

943

-

-

-

-

Microchip USA

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Overview

Unleash the power of data storage with the LE2416RDXATDG by Onsemi. This high-quality EEPROM offers unparalleled reliability and performance, thanks to its innovative design and cutting-edge technology. Ideal for industrial applications, this product provides a seamless solution for storing critical information efficiently and securely. With a compact package style and durable construction, the LE2416RDXATDG delivers exceptional value and peace of mind to customers looking for a reliable memory solution. Elevate your projects with the best-in-class EEPROM from Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and durability for the EEPROM, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount feature allows for easy and convenient installation on PCBs, saving space and making it ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 2

Operating at a nominal supply voltage of 2V makes this EEPROM energy efficient and compatible with low power applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and accurate data transfer, making it reliable for critical applications.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting the EEPROM to other components, enhancing integration and ease of use.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this EEPROM can withstand harsh environmental conditions, ensuring reliable performance in various industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C makes this EEPROM suitable for use in extreme cold environments without compromising functionality.

Memory IC Type: EEPROM

Being an EEPROM, this memory IC allows for non-volatile storage of data, ensuring that information is retained even when power is disconnected.

Technical Specifications

EEPROM LE2416RDXATDG attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.2 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.8 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

LE2416RDXATDG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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