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LE24L042CS-B-TFM-H

Onsemi

LE24L042CS-B-TFM-H by Onsemi

LE24L042CS-B-TFM-H by Onsemi is a 512X8 EEPROM with a supply voltage range of 1.7V to 3.6V. It operates in synchronous mode with a clock frequency of up to 0.4MHz and has a very thin profile package style. This memory IC is commonly used in industrial applications requiring non-volatile storage.

Median Price

$0.392

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 68,160 parts In-Stock

1+ parts

-

100+ parts

$0.425

1k+ parts

$0.352

10k+ parts

$0.314

68,160

-

$0.425

$0.352

$0.314

DigiKey

USA . 68,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.360

10k+ parts

-

68,160

-

-

$0.360

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Farnell

UK . 68,160 parts In-Stock

1+ parts

-

100+ parts

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$0.359

68,160

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$0.359

Verical

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.441

10k+ parts

$0.393

35,000

-

-

$0.441

$0.393

Flip Electronics (Authorized)

USA . 10,000 parts In-Stock

1+ parts

-

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10,000

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Distributors (In-Stock)

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Digiode

USA . 558 parts In-Stock

1+ parts

$0.331

100+ parts

-

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558

$0.331

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.336

100+ parts

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450

$0.336

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Vyrian

USA . 49,836 parts In-Stock

1+ parts

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49,836

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Flip Electronics

USA . 10,000 parts In-Stock

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10,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 49,684 parts In-Stock

1+ parts

$0.296

100+ parts

-

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49,684

$0.296

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Corphita

USA . 1,611 parts In-Stock

1+ parts

$0.313

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1,611

$0.313

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Argo Parts USA

USA . 4,333 parts In-Stock

1+ parts

$0.336

100+ parts

-

1k+ parts

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10k+ parts

$0.326

4,333

$0.336

-

-

$0.326

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.336

100+ parts

-

1k+ parts

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100

$0.336

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Corohmni

South Africa . 109 parts In-Stock

1+ parts

$0.348

100+ parts

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109

$0.348

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Continental Prestige Electronics

USA . 68,160 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.278

10k+ parts

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68,160

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$0.278

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QUARKTWIN TECHNOLOGY LTD

USA . 15,530 parts In-Stock

1+ parts

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15,530

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SupplyDigital Components

Austria . 8,397 parts In-Stock

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8,397

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Kulean Microsystems

USA . 7,813 parts In-Stock

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7,813

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Problanco Electronics

Mexico . 3,720 parts In-Stock

1+ parts

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3,720

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Microchip USA

USA . 3,187 parts In-Stock

1+ parts

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3,187

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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TANS Electronics

Latvia . 1,698 parts In-Stock

1+ parts

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100+ parts

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1,698

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UHIMA Technologies

Türkiye . 559 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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559

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Overview

Discover the LE24L042CS-B-TFM-H by Onsemi, a cutting-edge EEPROM that guarantees top-quality performance. As a trusted manufacturer, Onsemi delivers unmatched reliability and innovation. This versatile product finds its applications in various industries, offering customers endless possibilities. With its superior value, benefits, and advantages, the LE24L042CS-B-TFM-H is designed to exceed expectations. Experience seamless operation, enhanced functionality, and exceptional durability—all packed into one compact package. Elevate your projects with the LE24L042CS-B-TFM-H and unlock a world of endless possibilities today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material provides durability and resistance to environmental conditions, making it suitable for various applications.

Surface Mount

YES - The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape

RECTANGULAR - The rectangular package shape offers compatibility with standard PCB designs, ensuring easy integration into existing systems.

Operating Mode

SYNCHRONOUS - The synchronous operating mode enables precise and synchronized data transfer, ensuring reliable performance in time-sensitive applications.

Nominal Supply Voltage / Vsup (V)

2.5V - The 2.5V nominal supply voltage ensures compatibility with a wide range of electronic devices, making it versatile for different system requirements.

No. of Terminals

4 - With 4 terminals, this EEPROM can be easily connected and integrated within electronic circuits, simplifying the overall design and installation process.

Package Style (Meter)

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - The grid array package style offers high-density mounting, while the very thin profile and fine pitch enable compact and space-saving designs.

Maximum Operating Temperature

85 °C - The high maximum operating temperature of 85°C ensures excellent performance and reliability, even in demanding environments or industrial applications.

Organization

512X8 - The organization of 512X8 provides a total memory capacity of 512 words, with each word consisting of 8 bits, allowing for ample storage and retrieval of data.

Minimum Operating Temperature

40 °C - The low minimum operating temperature of -40°C guarantees reliable functionality even in extremely cold conditions, expanding the product's range of usability.

Terminal Finish

TIN SILVER COPPER - The terminal finish of tin silver copper offers superior conductivity, corrosion resistance, and solderability, ensuring robust and long-lasting electrical connections.

Terminal Position

BOTTOM - The terminal position at the bottom facilitates straightforward PCB layout and assembly, simplifying the overall manufacturing process.

Maximum Seated Height

0.5 mm - The maximum seated height of 0.5 mm allows for low-profile designs, making it suitable for space-constrained applications without compromising performance or functionality.

Maximum Clock Frequency (fCLK)

0.4 MHz - The high maximum clock frequency of 0.4 MHz ensures efficient and fast data transfer, ideal for applications requiring quick and precise communication.

Width

0.79 mm - The compact width of 0.79 mm enables the integration of this EEPROM into small-sized devices or circuit boards, promoting versatility and flexibility in design.

Minimum Supply Voltage (Vsup)

1.7 V - The low minimum supply voltage requirement of 1.7V allows for compatibility with low-power and battery-operated systems, maximizing energy efficiency.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum time at the peak reflow temperature of 30 seconds ensures safe and reliable soldering processes, minimizing the risk of damage to the product.

Peak Reflow Temperature °C

260 - The peak reflow temperature of 260°C guarantees optimal soldering results, ensuring a solid and durable connection between the EEPROM and the PCB.

Length

1.06 mm - The compact length of 1.06 mm enables space-efficient designs and flexibility in placement, making it suitable for compact electronic devices and systems.

Temperature Grade

INDUSTRIAL - The temperature grade of industrial signifies that this EEPROM is capable of operating reliably in harsh industrial environments, meeting the demanding requirements of industrial applications.

Technology

CMOS - The CMOS technology used in this EEPROM ensures low power consumption, high speed, and excellent noise immunity, making it an efficient and reliable choice for various applications.

Parallel or Serial

SERIAL - The serial interface allows for simple and efficient communication with other devices, maximizing compatibility and ease of use.

Terminal Form

BALL - The ball terminal form enables reliable and secure connections with the PCB, ensuring a stable and durable setup in various applications.

No. of Words

512 words - The 512-word capacity offers ample storage for data, allowing for efficient and extensive data handling in a wide range of applications.

Memory Width

8 - The 8-bit memory width allows for the storage, retrieval, and manipulation of data in chunks, providing versatility and compatibility with various data formats.

Minimum Data Retention Time

20 - The minimum data retention time of 20 years ensures long-term data storage without loss or corruption, making it suitable for critical or archival applications.

Terminal Pitch

0.4 mm - The small terminal pitch of 0.4 mm enables high-density mounting and integration, optimizing the use of space on the PCB for compact and miniaturized designs.

No. of Words Code

512 - The 512-word code capacity accommodates a large amount of code, enabling efficient programming and execution in various embedded systems.

Maximum Supply Voltage (Vsup)

3.6 V - The high maximum supply voltage of 3.6V allows for compatibility with a wide range of systems and power sources, offering flexibility and adaptability in different scenarios.

Serial Bus Type

I2C - The I2C serial bus type ensures a standardized, widely supported communication protocol for seamless integration and compatibility with other devices and systems.

Maximum Write Cycle Time (tWC)

10 ms - The maximum write cycle time of 10 milliseconds enables fast and efficient programming and data modification, minimizing latency and improving overall performance.

Memory Density

4096 bit - With a memory density of 4096 bits, this EEPROM provides ample storage capacity for various data types and quantities, allowing for versatile and extensive data handling.

Memory IC Type

EEPROM - Being an Electrically Erasable Programmable Read-Only Memory, this product provides the ability to erase and reprogram data, making it versatile and adaptable for changing application needs.

Technical Specifications

EEPROM LE24L042CS-B-TFM-H attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Additional Features:

20 YEAR DATA RETENTION

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e1

Length:

1.06 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.79 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

LE24L042CS-B-TFM-H Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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