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CAT24C08WI-GT3

Onsemi

CAT24C08WI-GT3 by Onsemi

CAT24C08WI-GT3 by Onsemi is an 8Kx1 EEPROM with 3.3V programming voltage, I2C serial bus type, and 1000000 write/erase cycles. It operates in industrial temperature range (-40 to 85°C) and has a max clock frequency of 0.4 MHz. Ideal for applications requiring reliable non-volatile memory storage in compact electronic devices.

Median Price

$0.224

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 111 parts In-Stock

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$0.270

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111

$0.270

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Mouser Electronics

USA . 12,476 parts In-Stock

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$0.310

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$0.253

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$0.244

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12,476

$0.310

$0.253

$0.244

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DigiKey

USA . 69,106 parts In-Stock

1+ parts

$0.340

100+ parts

$0.299

1k+ parts

$0.277

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69,106

$0.340

$0.299

$0.277

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Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$2.569

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$2.440

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$2.440

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350

$2.569

$2.440

$2.440

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Rochester

USA . 351,948 parts In-Stock

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$0.223

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$0.185

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$0.165

351,948

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$0.223

$0.185

$0.165

Verical

USA . 267,872 parts In-Stock

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$0.206

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Future Electronics

Canada . 81,000 parts In-Stock

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$0.110

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Master Electronics

USA . 7,550 parts In-Stock

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$0.157

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$0.151

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$0.145

7,550

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$0.157

$0.151

$0.145

Arrow

USA . 6,000 parts In-Stock

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$0.171

6,000

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Avnet

USA . 3,000 parts In-Stock

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Chip1Stop

Japan . 1,983 parts In-Stock

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$0.172

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$0.150

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$0.135

1,983

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$0.135

Farnell

UK . 148 parts In-Stock

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$0.224

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$0.216

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$0.209

148

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Element14

Singapore . 98 parts In-Stock

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$0.374

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$0.356

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$0.349

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$0.349

Distributors (In-Stock)

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Digiode

USA . 2,396 parts In-Stock

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$0.147

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Nova Conductors

Japan . 22 parts In-Stock

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$0.207

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TME

Poland . 1,688 parts In-Stock

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$0.300

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$0.241

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$0.210

1,688

$0.300

$0.241

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$0.210

Component Electronics Inc.

Canada . 20 parts In-Stock

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$1.000

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$0.750

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$0.650

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20

$1.000

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Sensible Micro Corp

USA . 407,598 parts In-Stock

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IBS Electronics

USA . 200,750 parts In-Stock

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$0.220

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$0.211

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$0.202

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$0.202

NAC Semi

USA . 96,000 parts In-Stock

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Vyrian

USA . 61,354 parts In-Stock

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Flip Electronics

USA . 42,000 parts In-Stock

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Chip Stock

USA . 33,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 11,878 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9,915 parts In-Stock

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ComSIT USA

USA . 9,915 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,928 parts In-Stock

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SPM Sales

USA . 250 parts In-Stock

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Electronics Depot

USA . 150 parts In-Stock

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Prism Electronics

USA . 107 parts In-Stock

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Cogito LLC

Ukraine . 33 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 146 parts In-Stock

1+ parts

$0.076

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146

$0.076

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Ampacity Inc.

Singapore . 56,068 parts In-Stock

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$0.096

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Corphita

USA . 717 parts In-Stock

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$0.140

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Argo Parts USA

USA . 2,836 parts In-Stock

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$0.206

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$0.200

2,836

$0.206

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$0.200

Netroflash

USA . 1,000 parts In-Stock

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$0.207

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$0.207

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Semicontronic

India . 182,308 parts In-Stock

1+ parts

$0.244

100+ parts

$0.238

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$0.237

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182,308

$0.244

$0.238

$0.237

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Microchip USA

USA . 4,425 parts In-Stock

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$1.755

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$1.755

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Aztec Data Supply Inc.

USA . 2,466 parts In-Stock

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$2.863

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2,466

$2.863

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Advanced Electronics

New Zealand . 1,800 parts In-Stock

1+ parts

$3.995

100+ parts

$3.796

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$3.796

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$3.995

$3.796

$3.796

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Perfect Parts

USA . 85,305 parts In-Stock

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RC Electronics

USA . 53,895 parts In-Stock

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$0.210

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$0.190

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$0.190

53,895

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$0.210

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$0.190

Metaverse IC Inc.

Canada . 15,000 parts In-Stock

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Lixinc

USA . 14,061 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,996 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,357 parts In-Stock

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TANS Electronics

Latvia . 6,019 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 4,987 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,238 parts In-Stock

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Kulean Microsystems

USA . 4,132 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,119 parts In-Stock

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Infinite Electronics LLP (Excess)

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Problanco Electronics

Mexico . 3,113 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 2,871 parts In-Stock

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Authorized Procurement Solutions

USA . 2,639 parts In-Stock

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2,639

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GreenTree Electronics

Israel . 2,639 parts In-Stock

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2,639

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Continental Prestige Electronics

USA . 2,418 parts In-Stock

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$0.188

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$0.181

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$0.148

2,418

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$0.188

$0.181

$0.148

Glotronic Ltd.

UK . 2,400 parts In-Stock

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2,400

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iodParts Technologies Inc.

India . 2,274 parts In-Stock

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$0.324

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2,274

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$0.324

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ChipstoGo Electronic ltd

UK . 960 parts In-Stock

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960

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UHIMA Technologies

Türkiye . 754 parts In-Stock

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754

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Overview

Enhance your electronic projects with the cutting-edge CAT24C08WI-GT3 EEPROM by Onsemi. Known for their top-quality components, Onsemi delivers reliability and performance that exceeds expectations. This versatile EEPROM is perfect for a wide range of applications, offering easy integration and seamless operation. With a durable package body and low power consumption, this product provides exceptional value and benefits to customers looking for efficient memory solutions. Elevate your designs with the CAT24C08WI-GT3 and experience the difference that Onsemi quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in making the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

The rectangular shape makes the product compatible with standard PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures reliable and efficient data transfer.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V supply voltage ensures compatibility with a wide range of applications.

Power Supplies: 2/5V

The dual power supply options provide flexibility in different operating conditions.

No. of Terminals: 8

Having 8 terminals simplifies the connection and integration process.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB.

Maximum Operating Temperature: 85°C

The high operating temperature range allows for use in various environments.

Organization: 8KX1

The 8KX1 organization offers a high memory density for storing data.

Output Characteristics: 3-STATE

3-state output characteristics allow for multi-device sharing on a bus.

Minimum Operating Temperature: -40°C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish provides excellent conductivity and corrosion resistance.

I2C Control Byte: 1010DMMR

The I2C control byte simplifies communication and control of the device.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB design and layout.

Write Protection: HARDWARE

Hardware write protection ensures data security and integrity.

Maximum Seated Height: 1.75mm

The low seated height allows for compact designs and saves space.

Maximum Clock Frequency (fCLK): 0.4 MHz

The high clock frequency enables fast data transfer.

Width: 3.9mm

The compact width makes the product suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.7V

The low minimum supply voltage allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature: 30s

The maximum time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature: 260°C

The high peak reflow temperature ensures proper soldering and reliability.

Length: 4.9mm

The compact length makes the product suitable for space-constrained designs.

Programming Voltage (V): 3.3

The 3.3V programming voltage simplifies the programming process.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows for use in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and reliable performance.

Parallel or Serial: SERIAL

Serial communication allows for easy integration with microcontrollers and other devices.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy and reliable soldering.

Maximum Supply Current: 2mA

The low supply current consumption is ideal for battery-powered applications.

No. of Words: 8192 words

The high number of words provides ample storage capacity for data.

Minimum Data Retention Time: 100

The high minimum data retention time ensures data integrity even during power loss.

Terminal Pitch: 1.27mm

The standard terminal pitch simplifies PCB layout and assembly.

No. of Words Code: 8K

The 8K words code indicates the memory capacity of the device.

Maximum Supply Voltage (Vsup): 5.5V

The high maximum supply voltage tolerance ensures versatility in different power supply environments.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures long-lasting performance and reliability.

Serial Bus Type: I2C

The I2C serial bus type allows for easy interfacing with other devices.

Maximum Write Cycle Time (tWC): 5ms

The short write cycle time enables fast data programming and updating.

Memory Density: 8192 bit

The high memory density offers ample storage capacity for data.

Memory IC Type: EEPROM

Being an EEPROM type memory IC ensures non-volatile data storage.

Maximum Standby Current: 0.000001 Amp

The low standby current consumption is ideal for power-saving applications.

Technical Specifications

EEPROM CAT24C08WI-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAT24C08WI-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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