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LE24512AQF

Onsemi

LE24512AQF by Onsemi

LE24512AQF by Onsemi is an 8-terminal EEPROM with 64KX8 organization, operating at a clock frequency of 0.4 MHz. It features a serial I2C bus type, suitable for industrial applications due to its wide temperature range (-40 to 85 °C) and small form factor (3x2 mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 387 parts In-Stock

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Vyrian

USA . 249 parts In-Stock

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Kulean Microsystems

USA . 5,151 parts In-Stock

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TANS Electronics

Latvia . 3,933 parts In-Stock

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Problanco Electronics

Mexico . 3,446 parts In-Stock

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Corphita

USA . 1,803 parts In-Stock

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UHIMA Technologies

Türkiye . 864 parts In-Stock

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SupplyDigital Components

Austria . 437 parts In-Stock

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Corohmni

South Africa . 207 parts In-Stock

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Overview

Experience the superior quality of Onsemi with the LE24512AQF EEPROM. This versatile memory IC offers reliable performance in a compact package, making it ideal for industrial applications. With a wide operating temperature range and high clock frequency, this EEPROM is designed to meet the demands of advanced technology. Trust Onsemi to deliver innovative solutions that provide value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the EEPROM, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes the EEPROM easy to integrate into various electronic devices, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is commonly used in electronics and ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the EEPROM to function reliably in industrial environments with elevated temperatures.

Organization: 64KX8

The 64KX8 organization means the EEPROM has a capacity of 64 kilobits arranged in an 8-bit wide configuration, providing ample storage for data.

Parallel or Serial: SERIAL

The serial interface allows for simple and efficient communication with the EEPROM, making it well-suited for applications where space is limited.

Serial Bus Type: I2C

The I2C serial bus type is a popular and widely supported communication protocol, enabling easy integration of the EEPROM with various microcontrollers and devices.

Technical Specifications

EEPROM LE24512AQF attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Maximum Seated Height:

.8 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

LE24512AQF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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