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LE24C023M

Onsemi

LE24C023M by Onsemi

The Onsemi LE24C023M is an EEPROM with 256x8 organization, I2C control byte of 1010000R, and 2048-bit memory density. It operates in industrial temperature grades (-40 to 85 °C) and offers write protection via hardware. Ideal for applications requiring small outline packages and serial bus communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 495 parts In-Stock

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495

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Digiode

USA . 239 parts In-Stock

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239

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Distributors (Availability)

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Kulean Microsystems

USA . 3,365 parts In-Stock

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SupplyDigital Components

Austria . 2,923 parts In-Stock

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Problanco Electronics

Mexico . 2,182 parts In-Stock

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Corphita

USA . 2,182 parts In-Stock

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TANS Electronics

Latvia . 1,348 parts In-Stock

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UHIMA Technologies

Türkiye . 695 parts In-Stock

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695

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Corohmni

South Africa . 111 parts In-Stock

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Overview

Unlock the power of seamless data storage with the LE24C023M by Onsemi. Crafted with precision and reliability in mind, this EEPROM device offers unparalleled performance and durability for a wide range of applications. Whether you're in the industrial, automotive, or consumer electronics industry, this compact yet powerful solution is designed to provide you with the value and efficiency you need to stay ahead of the competition. Trust in Onsemi's reputation for quality and innovation and experience the benefits of cutting-edge technology with the LE24C023M.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, enhancing the overall efficiency of the design.

Power Supplies (V): 3/5

This product can operate on both 3V and 5V power supplies, providing flexibility in different system configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact integration into electronic devices, ideal for space-constrained applications.

Memory Density: 2048 bit

With a high memory density, this EEPROM can store a large amount of data efficiently, suitable for storing program codes, configurations, and other critical information.

Endurance: 1000000 Write/Erase Cycles

The high endurance level ensures long-lasting performance and reliability, making it a durable solution for frequent read/write operations.

Serial Bus Type: I2C

The I2C serial bus communication protocol offers ease of integration with various microcontrollers and other devices, enabling seamless data transfer.

Technical Specifications

EEPROM LE24C023M attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Minimum Data Retention Time:

20

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010000R

JESD-30 Code:

R-PDSO-G8

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Write Protection:

HARDWARE

Trade Compliance

LE24C023M Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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