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AT24C32D-SSHM-T-899

Microchip Technology

AT24C32D-SSHM-T-899 by Microchip Technology

AT24C32D-SSHM-T-899 by Microchip: 4KX8 EEPROM with 1MHz fCLK, -40 to 85 °C temp range. Ideal for industrial applications requiring reliable data storage in a compact 3.9mm x 4.925mm package with I2C serial interface and hardware write protection.

Median Price

$2.855

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,500 parts In-Stock

1+ parts

$2.855

100+ parts

$2.712

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$2.712

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2,500

$2.855

$2.712

$2.712

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Distributors (In-Stock)

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Vyrian

USA . 2,481 parts In-Stock

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VNN

France . 627 parts In-Stock

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627

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Semicontronic

India . 2,426 parts In-Stock

1+ parts

$2.430

100+ parts

$2.369

1k+ parts

$2.357

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2,426

$2.430

$2.369

$2.357

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Ampacity Inc.

Singapore . 2,294 parts In-Stock

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$2.430

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$2.430

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.855

100+ parts

$2.712

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$2.712

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2,500

$2.855

$2.712

$2.712

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Aztec Data Supply Inc.

USA . 406 parts In-Stock

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$3.574

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406

$3.574

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Corohmni

South Africa . 721 parts In-Stock

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$4.537

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721

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Continental Prestige Electronics

USA . 6,263 parts In-Stock

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Argo Parts USA

USA . 1,891 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Marpe Global Electronics

Taiwan . 956 parts In-Stock

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QualityLine Systems

Poland . 956 parts In-Stock

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XL Components Corporation

Australia . 956 parts In-Stock

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Overview

Unleash the power of reliable data storage with the AT24C32D-SSHM-T-899 by Microchip Technology. This high-quality EEPROM offers unparalleled value and benefits, ensuring your data is safe and secure. Whether you need to store critical information in automotive, industrial, or consumer electronics applications, this versatile product delivers unmatched performance. Trust in Microchip Technology's expertise and experience to provide you with the best solutions for your data storage needs. Elevate your projects with the AT24C32D-SSHM-T-899 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the EEPROM, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and improving overall efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred efficiently and reliably, making the EEPROM suitable for time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a standard voltage of 3V ensures compatibility with many systems and devices.

Memory IC Type: EEPROM

Being an EEPROM, this product offers non-volatile memory capabilities, allowing data to be retained even when power is disconnected.

Maximum Clock Frequency (fCLK): 1 MHz

High clock frequency allows for fast data access and transfer speeds, improving overall performance of the EEPROM.

Endurance: 1000000 Write/Erase Cycles

With a high endurance rating, this EEPROM can withstand frequent read/write operations, ensuring long-term reliability and durability.

Technical Specifications

EEPROM AT24C32D-SSHM-T-899 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.7V TO 5.5V @0.4MHZ

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.925 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000006 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

AT24C32D-SSHM-T-899 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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