Loading...

LE24C0221M

Onsemi

LE24C0221M by Onsemi

The Onsemi LE24C0221M is an EEPROM with 256x8 organization, I2C control byte of 1010000R, and industrial temperature grade. It operates at -40 to 85 °C and has a memory density of 2048 bit. Ideal for applications requiring low power consumption and serial bus communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

-

-

-

-

Vyrian

USA . 357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

357

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 6,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,462

-

-

-

-

Kulean Microsystems

USA . 5,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,882

-

-

-

-

Problanco Electronics

Mexico . 1,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,954

-

-

-

-

Corphita

USA . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

412

-

-

-

-

UHIMA Technologies

Türkiye . 315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

315

-

-

-

-

SupplyDigital Components

Austria . 139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

139

-

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69

-

-

-

-

Overview

Unlock the power of efficient data storage with the LE24C0221M by Onsemi. Crafted with precision and reliability, this EEPROM offers unparalleled quality and performance. Ideal for a wide range of applications, this product is designed to meet the demands of industrial-grade environments. Experience seamless connectivity and reliable data storage with the LE24C0221M. Upgrade your systems today and discover the value and benefits this product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into various electronic devices or PCBs.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor that is widely compatible with existing designs and applications.

Power Supplies (V): 3/5

Supporting dual power supplies of 3V and 5V offers flexibility in voltage requirements for different applications.

No. of Terminals: 8

Having 8 terminals enables easy connectivity and communication with other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB and making the product more compact.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments.

Organization: 256X8

The organization of 256 words with 8 bits each provides ample storage capacity and data organization for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables the EEPROM to function effectively in extreme cold conditions.

I2C Control Byte: 1010000R

The I2C control byte allows for easy and standardized communication with other devices on the I2C bus, enhancing compatibility.

Terminal Position: DUAL

The dual terminal positions provide flexibility in the mounting orientation of the EEPROM, making it easier to integrate into different designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures the EEPROM's reliability and performance in harsh operating conditions.

Technology: CMOS

The use of CMOS technology allows for low power consumption, high speed, and reliable operation, making it an efficient choice for data storage.

Parallel or Serial: SERIAL

The serial interface simplifies data transfer and communication with the host system, making it easy to integrate into various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and stable solder connections, ensuring reliable electrical connections in the system.

Maximum Supply Current: 3 mA

The low maximum supply current of 3 mA helps in minimizing power consumption and reducing heat dissipation during operation.

No. of Words: 256 words

Having 256 words of storage capacity allows for storing a significant amount of data or program code in the EEPROM.

Memory Width: 8

With a memory width of 8 bits, the EEPROM can access and store data efficiently in byte-sized chunks.

Minimum Data Retention Time: 20

The minimum data retention time of 20 years ensures that the stored data remains intact and preserved for a long duration.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides easy and precise alignment for soldering during PCB assembly, ensuring reliable connections.

No. of Words Code: 256

With 256 words code, the EEPROM can store and retrieve instructions or data efficiently for various applications.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures reliable and long-lasting performance for frequent data updates or changes.

Serial Bus Type: I2C

Being I2C compatible allows for easy integration into systems that support the I2C protocol, enabling seamless communication and control.

Memory Density: 2048 bit

The memory density of 2048 bits provides sufficient storage capacity for data storage and retrieval in various applications.

Memory IC Type: EEPROM

Being an EEPROM memory IC type offers non-volatile storage, allowing data to be retained even when power is removed, making it suitable for data storage applications.

Maximum Standby Current: 0.000002 Amp

The extremely low maximum standby current consumption of 0.000002 Amp helps in reducing power consumption during idle periods, enhancing energy efficiency.

Technical Specifications

EEPROM LE24C0221M attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Minimum Data Retention Time:

20

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010000R

JESD-30 Code:

R-PDSO-G8

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LE24C0221M Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20