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CAT24C02YE-GT3A

Onsemi

CAT24C02YE-GT3A by Onsemi

CAT24C02YE-GT3A by Onsemi is an EEPROM with 256x8 organization, operating at 3.3V. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for automotive applications due to its small outline package and wide temperature range of -40 to 125 °C.

Median Price

$2.974

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 15 parts In-Stock

1+ parts

$5.658

100+ parts

$5.149

1k+ parts

$4.640

10k+ parts

-

15

$5.658

$5.149

$4.640

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Rochester

USA . 311 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

311

-

$0.291

$0.241

$0.215

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,324 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

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2,324

$0.226

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-

-

Chip Stock

USA . 76,000 parts In-Stock

1+ parts

-

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76,000

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-

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Vyrian

USA . 4,494 parts In-Stock

1+ parts

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4,494

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,317 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

$0.214

-

-

-

Corohmni

South Africa . 160 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

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160

$0.238

-

-

-

Native Components

USA . 957 parts In-Stock

1+ parts

$0.836

100+ parts

-

1k+ parts

-

10k+ parts

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957

$0.836

-

-

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Northwest PG Solutions

USA . 1,764 parts In-Stock

1+ parts

$0.920

100+ parts

-

1k+ parts

-

10k+ parts

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1,764

$0.920

-

-

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$5.658

100+ parts

$5.149

1k+ parts

$4.640

10k+ parts

-

15

$5.658

$5.149

$4.640

-

AZTECH Wire

Italy . 1,181 parts In-Stock

1+ parts

$19.750

100+ parts

-

1k+ parts

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10k+ parts

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1,181

$19.750

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QUARKTWIN TECHNOLOGY LTD

USA . 23,012 parts In-Stock

1+ parts

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23,012

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Kulean Microsystems

USA . 8,360 parts In-Stock

1+ parts

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8,360

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TANS Electronics

Latvia . 7,593 parts In-Stock

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7,593

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SupplyDigital Components

Austria . 4,835 parts In-Stock

1+ parts

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4,835

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Problanco Electronics

Mexico . 2,119 parts In-Stock

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2,119

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Microchip USA

USA . 241 parts In-Stock

1+ parts

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241

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UHIMA Technologies

Türkiye . 18 parts In-Stock

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18

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Overview

Upgrade your electronic devices with the CAT24C02YE-GT3A by Onsemi, a high-quality EEPROM that offers unparalleled reliability and performance. Onsemi is a trusted manufacturer known for its cutting-edge technology and innovative solutions. This EEPROM is perfect for automotive applications, ensuring optimal functionality even in challenging environments. Experience the value and benefits of seamless data storage and retrieval with the CAT24C02YE-GT3A, providing peace of mind for customers who demand the best quality in their electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection for the EEPROM chip inside, ensuring a longer lifespan for the product.

Nominal Supply Voltage / Vsup (V): 3.3

This voltage is commonly used in many applications, making this EEPROM compatible with a wide range of devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this EEPROM can withstand harsh environmental conditions, making it suitable for automotive use.

Write Protection: HARDWARE

Having hardware write protection ensures that data stored in the EEPROM cannot be easily tampered with, providing security for sensitive information.

Memory Density: 2048 bit

This EEPROM has a high memory density, allowing for the storage of a large amount of data in a compact chip size.

Endurance: 1000000 Write/Erase Cycles

With a high endurance level, this EEPROM can be written to and erased numerous times without degradation, increasing its reliability and lifespan.

Technical Specifications

EEPROM CAT24C02YE-GT3A attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAT24C02YE-GT3A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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