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CAT24C02YI-G

Onsemi

CAT24C02YI-G by Onsemi

CAT24C02YI-G by Onsemi is a 256x8 EEPROM with a supply voltage of 1.7-5.5V and max clock frequency of 0.4MHz. It is commonly used in industrial applications for data storage and retrieval due to its high endurance of 1,000,000 write/erase cycles and small package size (4.4mm x 3mm).

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 181,710 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

181,710

-

$0.172

$0.143

$0.127

DigiKey

USA . 181,710 parts In-Stock

1+ parts

-

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10k+ parts

$0.210

181,710

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$0.210

Verical

USA . 119,620 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.159

119,620

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$0.159

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 844 parts In-Stock

1+ parts

$0.126

100+ parts

-

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844

$0.126

-

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Digiode

USA . 2,468 parts In-Stock

1+ parts

$0.134

100+ parts

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2,468

$0.134

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Chip Stock

USA . 58,000 parts In-Stock

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58,000

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Vyrian

USA . 5,219 parts In-Stock

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5,219

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Electronics Depot

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 168,638 parts In-Stock

1+ parts

$0.116

100+ parts

-

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168,638

$0.116

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Semicontronic

India . 168,340 parts In-Stock

1+ parts

$0.116

100+ parts

$0.113

1k+ parts

$0.113

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-

168,340

$0.116

$0.113

$0.113

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Continental Prestige Electronics

USA . 189,811 parts In-Stock

1+ parts

$0.126

100+ parts

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1k+ parts

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$0.123

189,811

$0.126

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$0.123

Argo Parts USA

USA . 593 parts In-Stock

1+ parts

$0.126

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-

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$0.122

593

$0.126

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$0.122

Corphita

USA . 1,241 parts In-Stock

1+ parts

$0.127

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1,241

$0.127

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Corohmni

South Africa . 490 parts In-Stock

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$0.137

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490

$0.137

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$5.190

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300

$5.190

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AZTECH Wire

Italy . 636 parts In-Stock

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$22.230

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636

$22.230

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QUARKTWIN TECHNOLOGY LTD

USA . 27,952 parts In-Stock

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27,952

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Kulean Microsystems

USA . 8,110 parts In-Stock

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8,110

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SupplyDigital Components

Austria . 7,082 parts In-Stock

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7,082

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Problanco Electronics

Mexico . 4,863 parts In-Stock

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Perfect Parts

USA . 3,553 parts In-Stock

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3,553

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TANS Electronics

Latvia . 3,004 parts In-Stock

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3,004

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Netroflash

USA . 2,050 parts In-Stock

1+ parts

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100+ parts

$0.123

1k+ parts

$0.119

10k+ parts

$0.117

2,050

-

$0.123

$0.119

$0.117

Metaverse IC Inc.

Canada . 530 parts In-Stock

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530

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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407

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Microchip USA

USA . 336 parts In-Stock

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336

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Overview

Experience the superior quality and reliability of the CAT24C02YI-G EEPROM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology that exceeds expectations. The CAT24C02YI-G offers a range of applications including data storage, security systems, and consumer electronics. With its advanced features and innovative design, this product provides exceptional value to our customers. Benefit from its high endurance, efficient performance, and easy-to-use interface. Trust Onsemi to deliver products that meet your needs and enhance your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the product, making it a reliable choice.

Surface Mount

YES - This feature allows for easy and convenient installation on circuit boards, saving time and effort.

No. of Functions

1 - With a single function, this product is straightforward to use and efficient in its purpose.

Package Shape

RECTANGULAR - The rectangular shape enables compact design and efficient utilization of space.

Operating Mode

SYNCHRONOUS - This mode ensures synchronized and accurate operation, enhancing overall performance.

Nominal Supply Voltage / Vsup (V)

3.3 - The 3.3V supply voltage ensures compatibility with various systems and devices.

Power Supplies (V)

1.8/5 - This product can accommodate both 1.8V and 5V power supplies, offering versatility and flexibility.

No. of Terminals

8 - The 8 terminals provide sufficient connectivity options for integration with other components.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The compact and slim package style allows for space-saving installation in tight environments.

Maximum Operating Temperature

85 °C - This product can operate reliably in high-temperature conditions, expanding its range of applications.

Organization

256X8 - The organization of 256x8 enables efficient data storage and retrieval, enhancing versatility and performance.

Minimum Operating Temperature

40 °C - This product can withstand extremely low temperatures, making it suitable for various environments and applications.

Terminal Finish

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish ensures reliable and long-lasting electrical connections.

I2C Control Byte

1010DDDR - The specific I2C control byte enhances compatibility and seamless integration with other I2C devices.

Terminal Position

DUAL - The dual terminal position provides flexibility for different circuit board layouts and designs.

Write Protection

HARDWARE - The hardware write protection feature ensures data integrity and prevents accidental data modification.

Maximum Seated Height

1.2 mm - The low seated height enables space-efficient integration into compact electronic systems.

Maximum Clock Frequency (fCLK)

0.4 MHz - The high maximum clock frequency allows for fast data transfer and processing.

Width

3 mm - The compact width facilitates easy placement and integration into various electronic setups.

Minimum Supply Voltage (Vsup)

1.7 V - The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C

260 - The high peak reflow temperature withstands the soldering process during assembly, ensuring product reliability.

Length

4.4 mm - The small length of the product enables space-efficient integration into electronic systems.

Temperature Grade

INDUSTRIAL - The industrial temperature grade ensures reliable operation in rugged environments with varying temperature conditions.

Technology

CMOS - The CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and performance of the product.

Parallel or Serial

SERIAL - The serial operation mode allows for efficient and streamlined data communication and manipulation.

Terminal Form

GULL WING - The gull wing terminal form provides secure and robust soldering connections, ensuring long-term reliability.

Maximum Supply Current

2 mA - The low maximum supply current requirement promotes energy efficiency and extends battery life in portable applications.

No. of Words

256 words - The 256-word capacity allows for storing and accessing a significant amount of data.

Memory Width

8 - The 8-bit memory width facilitates efficient data handling and manipulation.

Minimum Data Retention Time

100 - The minimum data retention time ensures the integrity and reliability of stored data over extended periods.

Terminal Pitch

0.65 mm - The small terminal pitch enables tight spacing and efficient integration into densely packed circuits.

No. of Words Code

256 - The number of words code aligns with the memory capacity, ensuring efficient storage and retrieval of data.

Moisture Sensitivity Level (MSL)

1 - The low moisture sensitivity level enhances the durability and reliability of the product in humid environments.

Maximum Supply Voltage (Vsup)

5.5 V - The high maximum supply voltage tolerance allows for compatibility with a wide range of power sources.

Endurance

1000000 Write/Erase Cycles - The high endurance capability makes this product suitable for frequent data writing and erasing operations.

Serial Bus Type

I2C - The I2C serial bus type offers a standardized and widely used interface for seamless integration with other devices and components.

Maximum Write Cycle Time (tWC)

5 ms - The short maximum write cycle time ensures timely data updates and efficient operation.

Memory Density

2048 bit - The high memory density enables storage of significant amounts of data in a compact form.

Memory IC Type

EEPROM - The EEPROM memory IC type provides non-volatile data storage and easy data manipulation capabilities.

Maximum Standby Current

0.000001 Amp - The ultra-low standby current requirement ensures minimal power consumption during standby mode, promoting energy efficiency.

Technical Specifications

EEPROM CAT24C02YI-G attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAT24C02YI-G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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