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CAT24C32TSI-T3

Onsemi

CAT24C32TSI-T3 by Onsemi

CAT24C32TSI-T3 by Onsemi is a 4Kx8 EEPROM with I2C control byte. It operates at 1MHz clock frequency, has 1000000 write/erase cycles endurance, and -40 to 85 °C temperature range. Ideal for industrial applications requiring low power consumption and reliable data storage in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 37,000 parts In-Stock

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Vyrian

USA . 3,974 parts In-Stock

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Digiode

USA . 2,448 parts In-Stock

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Native Components

USA . 94 parts In-Stock

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$6.933

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Ampacity Inc.

Singapore . 776 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 1,155 parts In-Stock

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$17.810

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Problanco Electronics

Mexico . 8,297 parts In-Stock

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TANS Electronics

Latvia . 7,343 parts In-Stock

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Kulean Microsystems

USA . 5,731 parts In-Stock

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Corphita

USA . 919 parts In-Stock

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Corohmni

South Africa . 457 parts In-Stock

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Northwest PG Solutions

USA . 322 parts In-Stock

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UHIMA Technologies

Türkiye . 287 parts In-Stock

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Microchip USA

USA . 190 parts In-Stock

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SupplyDigital Components

Austria . 79 parts In-Stock

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Overview

Enhance your electronic devices with the CAT24C32TSI-T3 EEPROM by Onsemi! Manufactured with top-quality materials and designed for industrial-grade applications, this product offers unparalleled reliability and performance. With a wide operating temperature range and impressive endurance, it ensures data integrity and security. Its compact size and low power consumption make it ideal for a variety of applications. Upgrade your projects with the CAT24C32TSI-T3 and experience the benefits of superior memory storage technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the EEPROM, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mount capabilities make it easy to integrate this EEPROM into various electronic devices, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this EEPROM compatible with a wide range of electronic systems and applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this EEPROM can function reliably in harsh environments or extreme conditions.

Memory Density: 32768 bit

With a memory density of 32768 bits, this EEPROM offers ample storage capacity for storing data or program codes efficiently.

Endurance: 1000000 Write/Erase Cycles

High endurance rating of 1,000,000 write/erase cycles ensures long-lasting performance and data reliability, making it a dependable choice for critical applications.

Technical Specifications

EEPROM CAT24C32TSI-T3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Additional Features:

100 YEAR DATA RETENTION

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

5

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.5 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAT24C32TSI-T3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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