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SST39SF040-70-4C-WHE-T

Microchip Technology

SST39SF040-70-4C-WHE-T by Microchip Technology

SST39SF040-70-4C-WHE-T by Microchip: 512Kx8 NOR Flash Memory with 70°C max temp, 5V supply, and 70ns access time. Ideal for commercial applications requiring high endurance, featuring 100k Write/Erase cycles and a compact form factor of 12.4mm x 8mm.

Median Price

$2.385

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$2.385

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150

$2.385

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Chip Stock

USA . 31,310 parts In-Stock

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31,310

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Vyrian

USA . 2,012 parts In-Stock

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2,012

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 6,304 parts In-Stock

1+ parts

$1.890

100+ parts

$1.740

1k+ parts

$1.670

10k+ parts

-

6,304

$1.890

$1.740

$1.670

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Semicontronic

India . 184 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

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184

$2.000

$1.950

$1.940

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Argo Parts USA

USA . 3,649 parts In-Stock

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$2.385

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3,649

$2.385

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Netroflash

USA . 1,000 parts In-Stock

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$2.385

100+ parts

$2.338

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1,000

$2.385

$2.338

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Continental Prestige Electronics

USA . 577 parts In-Stock

1+ parts

$2.385

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$2.338

577

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$2.338

Corohmni

South Africa . 139 parts In-Stock

1+ parts

$2.414

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139

$2.414

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$2.433

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$2.433

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$2.433

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5,000

$2.433

$2.433

$2.433

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Aztec Data Supply Inc.

USA . 2,423 parts In-Stock

1+ parts

$5.396

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AZTECH Wire

Italy . 771 parts In-Stock

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$19.324

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771

$19.324

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Ampacity Inc.

Singapore . 1,366 parts In-Stock

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$30.000

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QUARKTWIN TECHNOLOGY LTD

USA . 20,342 parts In-Stock

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Fulton Briggs Corp.

USA . 8,084 parts In-Stock

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Lixinc

USA . 3,933 parts In-Stock

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Metaverse IC Inc.

Canada . 1,381 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Elevate your electronics with the SST39SF040-70-4C-WHE-T by Microchip Technology. This high-quality Flash Memory device boasts top-tier performance and reliability, setting it apart in its category. With a seamless user experience and versatile applications, this product offers unparalleled value to customers seeking fast access times and high endurance. Trust Microchip Technology to deliver cutting-edge technology that exceeds expectations. Upgrade your devices today with the SST39SF040-70-4C-WHE-T!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and lightweight, making the product suitable for portable devices.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Operating Mode: ASYNCHRONOUS

Enables independent read and write operations, improving overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, ensuring easy integration into existing systems.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for various operating environments.

Memory Density: 4194304 bit

Provides ample storage capacity for data-intensive applications.

Endurance: 100000 Write/Erase Cycles

High endurance rating ensures long-term reliability and durability of the flash memory.

Technical Specifications

Flash Memory SST39SF040-70-4C-WHE-T attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Command User Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G32

Length:

12.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

128

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.56,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

8 mm

Trade Compliance

SST39SF040-70-4C-WHE-T Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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