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MTFC8GAKAJCN-4MITTR

Micron Technology

MTFC8GAKAJCN-4MITTR by Micron Technology

Micron Technology's MTFC8GAKAJCN-4MITTR is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates in synchronous mode at up to 52 MHz clock frequency, suitable for industrial applications. The package style is grid array with very thin profile and fine pitch, making it ideal for compact electronic devices.

Median Price

$12.231

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Edge Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$12.231

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$12.231

-

-

-

Chip Stock

USA . 14,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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14,400

-

-

-

-

Cyclops Electronics Ltd

UK . 9,857 parts In-Stock

1+ parts

-

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-

1k+ parts

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9,857

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-

-

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Vyrian

USA . 5,007 parts In-Stock

1+ parts

-

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5,007

-

-

-

-

Component Sense

UK . 3,242 parts In-Stock

1+ parts

-

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3,242

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-

-

-

Digiode

USA . 584 parts In-Stock

1+ parts

-

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584

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ComSIT Distribution GmbH

Germany . 64 parts In-Stock

1+ parts

-

100+ parts

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64

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 8,219 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

8,219

$6.000

$5.850

$5.820

-

Continental Prestige Electronics

USA . 5,099 parts In-Stock

1+ parts

$12.231

100+ parts

-

1k+ parts

-

10k+ parts

$11.986

5,099

$12.231

-

-

$11.986

AZTECH Wire

Italy . 1,123 parts In-Stock

1+ parts

$12.990

100+ parts

-

1k+ parts

-

10k+ parts

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1,123

$12.990

-

-

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Ampacity Inc.

Singapore . 2,773 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

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10k+ parts

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2,773

$21.000

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Corohmni

South Africa . 1,307 parts In-Stock

1+ parts

$85.804

100+ parts

-

1k+ parts

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10k+ parts

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1,307

$85.804

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,000

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-

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Perfect Parts

USA . 4,480 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,480

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-

-

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Argo Parts USA

USA . 3,660 parts In-Stock

1+ parts

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100+ parts

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3,660

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-

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Corphita

USA . 1,481 parts In-Stock

1+ parts

-

100+ parts

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1,481

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-

-

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Microchip USA

USA . 279 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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279

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$11.986

1k+ parts

$11.619

10k+ parts

$11.375

100

-

$11.986

$11.619

$11.375

Overview

Unlock the power of reliable and efficient storage with the MTFC8GAKAJCN-4MITTR by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers top-quality flash memory solutions that are perfect for a wide range of applications. Whether you're looking to boost the performance of your electronics or enhance data storage capabilities, this product offers unparalleled value, benefits, and advantages. Experience seamless operation and peace of mind knowing you're getting a cutting-edge product that meets the highest standards of quality and reliability. Elevate your technology experience with Micron Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and resistance to external factors, making the product reliable and long-lasting.

Surface Mount: YES

Being surface mountable makes it easier to integrate the product into electronic devices, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for high-speed data transfer and efficient performance in synchronized systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption, making the product energy-efficient and suitable for battery-powered devices.

Memory IC Type: FLASH CARD

The Flash Card IC type ensures fast and reliable data storage, making the product ideal for applications requiring high-speed data access.

Technical Specifications

Flash Memory MTFC8GAKAJCN-4MITTR attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

52 MHz

Command User Interface:

NO

Data Polling:

NO

JESD-30 Code:

R-PBGA-B153

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

68719476736 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

153

No. of Words:

8589934592 words

No. of Words Code:

8G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

NO

Type:

MLC NAND TYPE

Width:

11.5 mm

Trade Compliance

MTFC8GAKAJCN-4MITTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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