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MTFC4GACAJCN-4MIT

Micron Technology

MTFC4GACAJCN-4MIT by Micron Technology

MTFC4GACAJCN-4MIT by Micron Technology is a 4GX8 MLC NAND flash memory with 34359738368 bit density. Operating at -40 to 85 °C, it has a clock frequency of 52 MHz and supports parallel interface. Ideal for industrial applications requiring high-speed data storage in compact devices.

Median Price

$6.900

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.900

10k+ parts

-

1,000

-

-

$6.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$9.865

100+ parts

-

1k+ parts

-

10k+ parts

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40

$9.865

-

-

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Ozdisan Elektronik

Türkiye . 909 parts In-Stock

1+ parts

$16.476

100+ parts

-

1k+ parts

-

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909

$16.476

-

-

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Cyclops Electronics Ltd

UK . 46,650 parts In-Stock

1+ parts

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46,650

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-

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Chip Stock

USA . 16,200 parts In-Stock

1+ parts

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16,200

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BCID Electronics Ltd.

Israel . 8,971 parts In-Stock

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8,971

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Vyrian

USA . 6,579 parts In-Stock

1+ parts

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6,579

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Component Sense

UK . 5,669 parts In-Stock

1+ parts

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5,669

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-

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Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

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4,000

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-

-

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VRG Components

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

-

-

-

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Dark Horse Electronics

USA . 694 parts In-Stock

1+ parts

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694

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Sensible Micro Corp

USA . 332 parts In-Stock

1+ parts

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332

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Digiode

USA . 313 parts In-Stock

1+ parts

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313

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PC Components Company LLC

USA . 163 parts In-Stock

1+ parts

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163

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Goldney Electronics S.L.

Spain . 27 parts In-Stock

1+ parts

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27

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Bristol Electronics

USA . 21 parts In-Stock

1+ parts

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21

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NexGen Digital

USA . 3 parts In-Stock

1+ parts

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3

-

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

1+ parts

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3

-

-

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

1+ parts

-

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-

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$3.006

100+ parts

$2.855

1k+ parts

$2.855

10k+ parts

-

3,000

$3.006

$2.855

$2.855

-

Aztec Data Supply Inc.

USA . 4,347 parts In-Stock

1+ parts

$4.330

100+ parts

-

1k+ parts

-

10k+ parts

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4,347

$4.330

-

-

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Semicontronic

India . 2,009 parts In-Stock

1+ parts

$5.870

100+ parts

$5.723

1k+ parts

$5.694

10k+ parts

-

2,009

$5.870

$5.723

$5.694

-

Ampacity Inc.

Singapore . 532 parts In-Stock

1+ parts

$5.870

100+ parts

-

1k+ parts

-

10k+ parts

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532

$5.870

-

-

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Continental Prestige Electronics

USA . 2,437 parts In-Stock

1+ parts

$8.249

100+ parts

-

1k+ parts

-

10k+ parts

$8.084

2,437

$8.249

-

-

$8.084

Netroflash

USA . 50 parts In-Stock

1+ parts

$9.865

100+ parts

$9.667

1k+ parts

-

10k+ parts

-

50

$9.865

$9.667

-

-

Microchip USA

USA . 3,544 parts In-Stock

1+ parts

$24.004

100+ parts

-

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10k+ parts

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3,544

$24.004

-

-

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Corohmni

South Africa . 1,217 parts In-Stock

1+ parts

$31.773

100+ parts

-

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1,217

$31.773

-

-

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S.R.D Solutions

India . 35,100 parts In-Stock

1+ parts

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35,100

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RC Electronics

USA . 9,728 parts In-Stock

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9,728

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Lucentia Tech

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$2.410

1k+ parts

$2.410

10k+ parts

$2.410

9,000

-

$2.410

$2.410

$2.410

A-Z Elektronik GmbH

Germany . 7,308 parts In-Stock

1+ parts

-

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7,308

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-

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Speed Components Ltd (Excess)

Israel . 5,885 parts In-Stock

1+ parts

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5,885

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-

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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-

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ChipstoGo Electronic ltd

UK . 3,785 parts In-Stock

1+ parts

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3,785

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-

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Computer Components Inc. - USA

USA . 2,880 parts In-Stock

1+ parts

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2,880

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-

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

-

-

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Alle Elektronik GmbH

Germany . 1,757 parts In-Stock

1+ parts

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100+ parts

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1,757

-

-

-

-

Corphita

USA . 1,521 parts In-Stock

1+ parts

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100+ parts

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1,521

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-

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Argo Parts USA

USA . 247 parts In-Stock

1+ parts

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247

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Modulus Dynamics

Lithuania . 50 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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50

-

-

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Robosynatics

Brazil . 20 parts In-Stock

1+ parts

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100+ parts

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20

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Overview

Revolutionize the way you store data with Micron Technology's MTFC4GACAJCN-4MIT Flash Memory. With a cutting-edge design and top-quality materials, this product offers unparalleled reliability and performance. Ideal for industrial applications, this flash memory delivers lightning-fast speeds and ample storage capacity to meet your needs. Experience the convenience and efficiency of Micron Technology's flash memory solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides a durable and lightweight housing for the flash memory, making it ideal for portable devices.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for faster data transfer and more efficient performance, making this flash memory suitable for high-speed applications.

Maximum Clock Frequency (fCLK): 52 MHz

With a high maximum clock frequency of 52 MHz, this flash memory can support rapid data transfer speeds, making it a reliable choice for demanding tasks.

Technology: CMOS

The CMOS technology used in this flash memory ensures low power consumption and high reliability, making it a cost-effective and efficient option for various applications.

Memory Density: 34359738368 bit

With a high memory density of 34359738368 bits, this flash memory can store a large amount of data in a compact form factor, making it suitable for devices with limited space.

Technical Specifications

Flash Memory MTFC4GACAJCN-4MIT attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

52 MHz

Command User Interface:

NO

Data Polling:

NO

JESD-30 Code:

R-PBGA-B153

Length:

13 mm

Memory Density:

34359738368 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

153

No. of Words:

4294967296 words

No. of Words Code:

4G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

NO

Type:

MLC NAND TYPE

Width:

11.5 mm

Trade Compliance

MTFC4GACAJCN-4MIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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