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S25FL128SAGNFI013

Infineon Technologies

S25FL128SAGNFI013 by Infineon Technologies

S25FL128SAGNFI013 by Infineon: NOR flash memory with 32MX4 organization, SPI serial bus type, and 133 MHz clock frequency. Ideal for industrial applications requiring high endurance, such as IoT devices and embedded systems. Operating temperature range from -40 to 85°C with 100000 write/erase cycles.

Median Price

$3.970

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 5 parts In-Stock

1+ parts

$2.730

100+ parts

$2.730

1k+ parts

$2.730

10k+ parts

-

5

$2.730

$2.730

$2.730

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Farnell

UK . 27 parts In-Stock

1+ parts

$3.970

100+ parts

$2.810

1k+ parts

$2.700

10k+ parts

-

27

$3.970

$2.810

$2.700

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Mouser Electronics

USA . 4,958 parts In-Stock

1+ parts

$3.990

100+ parts

$3.460

1k+ parts

$3.180

10k+ parts

$3.140

4,958

$3.990

$3.460

$3.180

$3.140

DigiKey

USA . 3,370 parts In-Stock

1+ parts

$3.990

100+ parts

$3.451

1k+ parts

$3.178

10k+ parts

$3.073

3,370

$3.990

$3.451

$3.178

$3.073

Verical

USA . 7,500 parts In-Stock

1+ parts

-

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-

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$2.620

7,500

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$2.620

Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

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1,500

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Rochester

USA . 542 parts In-Stock

1+ parts

-

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$2.090

1k+ parts

$1.870

10k+ parts

$1.760

542

-

$2.090

$1.870

$1.760

Element14

Singapore . 27 parts In-Stock

1+ parts

-

100+ parts

$5.030

1k+ parts

$4.830

10k+ parts

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27

-

$5.030

$4.830

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.734

100+ parts

-

1k+ parts

-

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100

$3.734

-

-

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Digiode

USA . 388 parts In-Stock

1+ parts

$3.772

100+ parts

-

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388

$3.772

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Vyrian

USA . 726 parts In-Stock

1+ parts

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726

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Flip Electronics

USA . 34 parts In-Stock

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34

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Distributors (Availability)

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Semicontronic

India . 690 parts In-Stock

1+ parts

$2.520

100+ parts

$2.457

1k+ parts

$2.444

10k+ parts

-

690

$2.520

$2.457

$2.444

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Modulus Dynamics

Lithuania . 423 parts In-Stock

1+ parts

$2.616

100+ parts

$2.511

1k+ parts

$2.407

10k+ parts

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423

$2.616

$2.511

$2.407

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Aztec Data Supply Inc.

USA . 975 parts In-Stock

1+ parts

$2.663

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975

$2.663

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Corohmni

South Africa . 337 parts In-Stock

1+ parts

$2.745

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337

$2.745

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$3.234

100+ parts

$3.072

1k+ parts

$3.072

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600

$3.234

$3.072

$3.072

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Corphita

USA . 57 parts In-Stock

1+ parts

$3.573

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57

$3.573

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Argo Parts USA

USA . 2,116 parts In-Stock

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$3.734

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2,116

$3.734

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Continental Prestige Electronics

USA . 1,404 parts In-Stock

1+ parts

$3.734

100+ parts

-

1k+ parts

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10k+ parts

$3.660

1,404

$3.734

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-

$3.660

Lixinc

USA . 19,229 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,889 parts In-Stock

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GreenTree Electronics

Israel . 4,914 parts In-Stock

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Futuretech Components

Singapore . 4,572 parts In-Stock

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Bastille Electronics

Australia . 4,121 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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$0.261

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$0.261

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$0.261

350

-

$0.261

$0.261

$0.261

Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.261

1k+ parts

$0.261

10k+ parts

$0.261

350

-

$0.261

$0.261

$0.261

Overview

Unlock endless possibilities with the S25FL128SAGNFI013 by Infineon Technologies, a top-tier flash memory solution that guarantees superior quality and performance. Designed with precision and innovation, this product is perfect for a wide range of applications in various industries. Experience seamless data storage and retrieval with its advanced features and cutting-edge technology. Trust in Infineon Technologies to deliver reliability and excellence in every aspect of your project. Elevate your systems with the S25FL128SAGNFI013 and discover the true potential of efficient data management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and better system performance.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency enables faster access times and data processing.

Endurance: 100000 Write/Erase Cycles

With a high endurance rate, this flash memory can withstand frequent read/write operations without degradation.

Memory Density: 134217728 bit

High memory density allows for storing a large amount of data in a compact form.

Technical Specifications

Flash Memory S25FL128SAGNFI013 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128SAGNFI013 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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