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W25Q64JVSSIQT

Winbond Electronics

W25Q64JVSSIQT by Winbond Electronics

Winbond Electronics' W25Q64JVSSIQT is a 3.3V Flash Memory with 8MX8 organization, operating at up to 133MHz clock frequency. Ideal for industrial applications, it offers 67108864-bit memory density in a small outline package with dual terminals and Gull Wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 147,990 parts In-Stock

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147,990

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Sensible Micro Corp

USA . 1,850 parts In-Stock

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1,850

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Vyrian

USA . 415 parts In-Stock

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415

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Nova Conductors

Japan . 29 parts In-Stock

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29

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Corohmni

South Africa . 1,044 parts In-Stock

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$4.327

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1,044

$4.327

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

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$4.738

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$4.501

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$4.501

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1,500

$4.738

$4.501

$4.501

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Aztec Data Supply Inc.

USA . 985 parts In-Stock

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$5.010

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985

$5.010

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AZTECH Wire

Italy . 447 parts In-Stock

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$8.484

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447

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Perfect Parts

USA . 8,053 parts In-Stock

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Continental Prestige Electronics

USA . 4,413 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,270 parts In-Stock

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1,270

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Modulus Dynamics

Lithuania . 900 parts In-Stock

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900

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Argo Parts USA

USA . 698 parts In-Stock

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698

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 40 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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$16.920

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$16.920

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$16.920

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$16.920

Robosynatics

Brazil . 10 parts In-Stock

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Overview

Unlock the power of reliable and high-performance flash memory with the W25Q64JVSSIQT from Winbond Electronics. As a trusted manufacturer in the industry, Winbond Electronics delivers top-quality products that are perfect for a wide range of applications. With its small outline package shape, synchronous operating mode, and industrial temperature grade, this flash memory offers unparalleled value and benefits to customers looking for fast and efficient data storage solutions. Trust Winbond Electronics to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, ensuring long-term reliability.

Surface Mount: YES

Makes it easy to integrate the flash memory into various electronic devices without the need for through-hole mounting.

Operating Mode: SYNCHRONOUS

Allows for faster data transfer and more efficient operation compared to asynchronous modes.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient power consumption and performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the flash memory.

Memory IC Type: FLASH

Flash memory provides non-volatile storage, allowing data to be retained even when power is removed, making it ideal for storing critical information.

Technical Specifications

Flash Memory W25Q64JVSSIQT attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Additional Features:

ALSO OPERATES WITH 2.7V-3V SUPPLY AT 104MHZ

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

2.7

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.28 mm

Trade Compliance

W25Q64JVSSIQT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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