Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SDSDQAF3-064G-I by Western Digital is a Flash Memory chip with 64GX8 organization and MLC NAND type technology. It operates in ASYNCHRONOUS mode, has a memory density of 549755813888 bit, and can withstand temperatures from -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
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Surface mount capability allows for easy integration into circuit boards, saving space and simplifying the assembly process.
Asynchronous operation provides flexibility in data transfer timing and can optimize performance for specific applications.
Uncased chip packaging offers a compact form factor, making it suitable for applications where space is limited.
High maximum operating temperature tolerance ensures reliable performance even in demanding thermal conditions.
Wide range of operating temperatures allows for use in both hot and cold environments without compromising performance.
Organized in 64GX8 configuration, offering a good balance between capacity and access speed for various data storage needs.
Terminal positioned at the top of the chip facilitates easier connection to the circuit board during installation.
MLC NAND technology provides a good balance between cost, capacity, and performance, making it suitable for a wide range of applications.
CMOS technology offers low power consumption, high speed, and reliability, ensuring efficient operation and longevity of the memory.
Lead-free terminal form is environmentally friendly and complies with modern regulations, making it a sustainable choice.
High number of words available for storage allows for large data capacity, making it ideal for applications requiring extensive memory.
Memory width of 8 bits provides a good balance between data transfer speed and efficiency for a variety of computing tasks.
64G code denotes the high capacity of the memory, offering ample storage space for storing large amounts of data.
High memory density ensures efficient use of space and resources, maximizing storage capacity in a small footprint.
Flash card memory IC type offers quick access times, high reliability, and durability, making it suitable for various data storage applications.
Flash Memory SDSDQAF3-064G-I attributes and parameters. Explore more Flash Memory devices from Western Digital
JESD-30 Code:
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SDSDQAF3-064G-I Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Western Digital has long been at the forefront of game changing innovations. From the invention of the first hard drive to recent advancements in 3D NAND our journey of innovation continues to inspire those who dare to think big. Wherever you are, Western Digital is with you every step of the way. We are always at the cusp of innovation, pushing the boundaries of technology to make what you thought was once impossible, possible.
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Telefunken
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
Itt Semiconductor
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
MX25L3233FM2I-08GTR
Macronix
Macronix MX25L3233FM2I-08GTR is a 32Mb NOR flash memory with SPI interface, operating at 133MHz. It offers 100K write/erase cycles, -40 to 85°C temp range, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed data storage in compact form factor.
W25N01GVZEIGTR
Winbond Electronics
W25N01GVZEIGTR by Winbond Electronics is a 1Gx1 SLC NAND flash memory with 1073741824-bit memory density. It operates at up to 104MHz clock frequency, has a supply voltage range of 2.7V to 3.6V, and is suitable for industrial temperature grade applications. The package style is small outline with very thin profile, making it ideal for space-constrained designs requiring high-speed data storage.
MX25R8035FZUIL0
Macronix's MX25R8035FZUIL0 is a 1.8V Flash Memory with 2Mx4 organization, operating at up to 104MHz clock frequency. Ideal for industrial applications, it offers 8388608-bit memory density in a small outline package with very thin profile and dual terminals.
SDSDQAB-008G
Western Digital
SDSDQAB-008G by Western Digital is a flash memory chip with 8GX8 organization and 8G word code. It operates b/w -25 to 85 °C, suitable for various applications requiring high memory density like flash cards. The chip features CMOS technology, rectangular shape, and upper terminal position for surface mounting.
JS28F640J3F75A
Micron Technology
Micron Technology's JS28F640J3F75A is a 64Mb NOR flash memory with 4MX16 organization, operating at -40 to 85°C. It features a parallel interface, 4194304 words capacity, and peak reflow temp of 260°C. Ideal for industrial applications requiring fast access times and reliable data storage.
WDS400T2B0A
WDS400T2B0A by Western Digital is a 4TB flash memory with 8-bit memory width and CMOS technology. It operates b/w 0-70°C, ideal for commercial applications requiring high memory density. With a compact size of 100.2mm x 69.85mm x 7mm, it suits microelectronic assemblies needing reliable NAND type storage.
SDSDQAF3-008G-I
Sandisk
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Memory Density: 68719476736 bit;
S25FL128SAGNFI011
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
S25FL128SAGMFIR01
Infineon Technologies
S25FL128SAGMFIR01 by Infineon Technologies is a NOR type flash memory with 32Mx4 organization, operating at up to 133MHz clock frequency. It features 100,000 write/erase cycles endurance and SPI serial bus interface. Ideal for industrial applications requiring high-speed synchronous operation and reliable data storage in a compact small outline package.
AT45DB321E-MHF-Y
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;
M29W160ET70N6E
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 1MX16;
MTFC4GACAJCN-4MIT
MTFC4GACAJCN-4MIT by Micron Technology is a 4GX8 MLC NAND flash memory with 34359738368 bit density. Operating at -40 to 85 °C, it has a clock frequency of 52 MHz and supports parallel interface. Ideal for industrial applications requiring high-speed data storage in compact devices.
W25Q128JVFIQ
W25Q128JVFIQ by Winbond Electronics is a 16MX8 NOR flash memory with 133 MHz clock frequency, ideal for industrial applications. It operates at 3.3V, offers 100000 write/erase cycles, and has a memory density of 134217728 bits. With SPI serial bus type and small outline package style, it ensures reliable data storage in harsh environments.
S29AL008J70TFI010
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
MT29F1G08ABADAWP:D
Micron Technology's MT29F1G08ABADAWP:D is a 3.3V SLC NAND Flash Memory with 128Mx8 organization, operating in asynchronous mode. It features a page size of 2K words and sector size of 128K words, suitable for commercial applications requiring fast access times and low standby current.
AT45DB641E-MHN-Y
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1;
AT45DB321E-SHFHC-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
MX30LF2G18AC-XKI
Macronix's MX30LF2G18AC-XKI is a 256MX8 SLC NAND flash memory with 2147483648-bit density. Operating at 3V, it has an industrial temperature grade of -40 to 85°C. With a very thin profile and fine pitch grid array package, it is suitable for high-performance applications requiring reliable non-volatile memory storage.
M25P16-VMN6TP
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00001 Amp;
S25FL128SAGBHI200
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SDSDQAF3-008G-I by Western Digital is an 8GX8 flash memory chip with MLC NAND technology. It operates in ASYNCHRONOUS mode, has a memory density of 68719476736 bits, and can withstand temperatures from -25 to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Terminal Position: UPPER;
SDSDQAF3-064G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Operating Mode: ASYNCHRONOUS; Terminal Form: NO LEAD;
SDSDQED-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;
SDSDQAF3-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Words Code: 8G; Minimum Operating Temperature: -40 Cel;
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Programming Voltage (V): 2.7; Package Body Material: UNSPECIFIED;
SDSDQAB-016G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8; Organization: 16GX8;
SDSDQ-4096
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz;
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8;
SDSDQAF3-016G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Minimum Operating Temperature: -25 Cel;
SDSDQAF3-016G-I by Western Digital is a Flash Memory chip with 16GX8 organization, MLC NAND type, and 137.4Gb memory density. It operates in ASYNCHRONOUS mode at temperatures ranging from -25°C to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQAF3-032G-I
SDSDQAF3-032G-I by Western Digital is a Flash Memory chip with 32GX8 organization, MLC NAND technology, and 274877906944 bit memory density. It operates in ASYNCHRONOUS mode with a temperature range of -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Words: 34359738368 words;
SDSDAF3-008G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Density: 68719476736 bit; Terminal Form: NO LEAD;
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Supply Voltage (Vsup): 3.6 V;
SDSDQAF3-064G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 64GX8; JESD-30 Code: X-XUUC-N; Surface Mount: YES;
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Width: 8; Maximum Supply Voltage (Vsup): 3.6 V;
SDSDQAF3-016G-XI
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 16GX8; Minimum Operating Temperature: -40 Cel;
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