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S29GL064S70TFI040

Infineon Technologies

S29GL064S70TFI040 by Infineon Technologies

Infineon's S29GL064S70TFI040 is an 8MX8 flash memory with a memory density of 67108864 bit. Operating at 3V, it offers a max access time of 70 ns and operates in industrial temperature grades. This parallel memory chip is suitable for applications requiring high-speed data storage and retrieval in harsh environments.

Median Price

$2.885

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 698 parts In-Stock

1+ parts

$2.540

100+ parts

$1.950

1k+ parts

$1.910

10k+ parts

-

698

$2.540

$1.950

$1.910

-

Arrow

USA . 835 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

$2.231

10k+ parts

-

835

$3.070

-

$2.231

-

Mouser Electronics

USA . 10,483 parts In-Stock

1+ parts

$3.090

100+ parts

-

1k+ parts

$2.280

10k+ parts

-

10,483

$3.090

-

$2.280

-

DigiKey

USA . 7,866 parts In-Stock

1+ parts

$3.090

100+ parts

$2.442

1k+ parts

$2.288

10k+ parts

-

7,866

$3.090

$2.442

$2.288

-

Chip1Stop

Japan . 3,176 parts In-Stock

1+ parts

$4.020

100+ parts

$2.810

1k+ parts

$2.380

10k+ parts

$2.030

3,176

$4.020

$2.810

$2.380

$2.030

Verical

USA . 3,353 parts In-Stock

1+ parts

-

100+ parts

$2.700

1k+ parts

$2.688

10k+ parts

$2.438

3,353

-

$2.700

$2.688

$2.438

Flip Electronics (Authorized)

USA . 2,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,568

-

-

-

-

Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$2.280

1k+ parts

$2.040

10k+ parts

$1.920

900

-

$2.280

$2.040

$1.920

Future Electronics

Canada . 96 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.620

10k+ parts

$2.560

96

-

$2.670

$2.620

$2.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 625 parts In-Stock

1+ parts

$2.337

100+ parts

-

1k+ parts

-

10k+ parts

-

625

$2.337

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.283

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.283

-

-

-

Vyrian

USA . 3,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,288

-

-

-

-

Flip Electronics

USA . 2,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,568

-

-

-

-

IBS Electronics

USA . 672 parts In-Stock

1+ parts

-

100+ parts

$3.497

1k+ parts

$3.432

10k+ parts

$3.354

672

-

$3.497

$3.432

$3.354

Rutronik

Germany . 96 parts In-Stock

1+ parts

-

100+ parts

$4.820

1k+ parts

$3.460

10k+ parts

-

96

-

$4.820

$3.460

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 829 parts In-Stock

1+ parts

$2.214

100+ parts

-

1k+ parts

-

10k+ parts

-

829

$2.214

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.295

100+ parts

$2.180

1k+ parts

$2.180

10k+ parts

-

1,000

$2.295

$2.180

$2.180

-

Modulus Dynamics

Lithuania . 1,833 parts In-Stock

1+ parts

$2.803

100+ parts

$2.691

1k+ parts

$2.579

10k+ parts

-

1,833

$2.803

$2.691

$2.579

-

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$3.136

100+ parts

-

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-

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51

$3.136

-

-

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Argo Parts USA

USA . 1,274 parts In-Stock

1+ parts

$3.206

100+ parts

-

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-

10k+ parts

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1,274

$3.206

-

-

-

Continental Prestige Electronics

USA . 29 parts In-Stock

1+ parts

$3.206

100+ parts

-

1k+ parts

-

10k+ parts

$3.142

29

$3.206

-

-

$3.142

Semicontronic

India . 3,348 parts In-Stock

1+ parts

$4.310

100+ parts

$4.202

1k+ parts

$4.181

10k+ parts

-

3,348

$4.310

$4.202

$4.181

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Aztec Data Supply Inc.

USA . 115 parts In-Stock

1+ parts

$5.105

100+ parts

-

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-

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115

$5.105

-

-

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Perfect Parts

USA . 9,669 parts In-Stock

1+ parts

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100+ parts

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9,669

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A-Z Elektronik GmbH

Germany . 6,734 parts In-Stock

1+ parts

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6,734

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-

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Futuretech Components

Singapore . 6,000 parts In-Stock

1+ parts

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6,000

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

-

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Glotronic Ltd.

UK . 1,049 parts In-Stock

1+ parts

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1,049

-

-

-

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Kepictronics

USA . 1,043 parts In-Stock

1+ parts

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1,043

-

-

-

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GreenTree Electronics

Israel . 174 parts In-Stock

1+ parts

-

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-

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174

-

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$3.218

1k+ parts

$3.119

10k+ parts

$3.053

50

-

$3.218

$3.119

$3.053

Overview

Elevate your projects with the S29GL064S70TFI040 by Infineon Technologies, a top-tier manufacturer known for superior quality. This flash memory device offers reliability and high performance in a compact package, making it ideal for a wide range of applications. Whether you're looking to enhance the speed and efficiency of your system or store critical data securely, this product delivers unmatched value and benefits. Trust in Infineon Technologies to provide cutting-edge technology and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the flash memory, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and simplifying assembly processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables flexible and efficient data transfer, improving overall performance and responsiveness.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage of 3V ensures reliable and stable performance of the flash memory chip.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for use in industrial and harsh environments without compromising performance.

Memory IC Type: FLASH

Flash memory technology enables fast read and write speeds, efficient data storage, and reliable operation for various applications.

Technical Specifications

Flash Memory S29GL064S70TFI040 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

14 mm

Trade Compliance

S29GL064S70TFI040 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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