Loading...

S25FS512SAGBHI210

Infineon Technologies

S25FS512SAGBHI210 by Infineon Technologies

The Infineon Technologies S25FS512SAGBHI210 is a NOR type flash memory with 64Mx8 organization, operating at 133MHz. It features hardware/software write protection and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed synchronous operation in a compact grid array package.

Median Price

$7.850

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 376 parts In-Stock

1+ parts

$7.450

100+ parts

$6.400

1k+ parts

$5.960

10k+ parts

-

376

$7.450

$6.400

$5.960

-

Chip1Stop

Japan . 236 parts In-Stock

1+ parts

$7.830

100+ parts

$6.840

1k+ parts

-

10k+ parts

-

236

$7.830

$6.840

-

-

Mouser Electronics

USA . 569 parts In-Stock

1+ parts

$7.850

100+ parts

$6.760

1k+ parts

$6.300

10k+ parts

$6.200

569

$7.850

$6.760

$6.300

$6.200

DigiKey

USA . 367 parts In-Stock

1+ parts

$7.850

100+ parts

$6.752

1k+ parts

$6.300

10k+ parts

$6.207

367

$7.850

$6.752

$6.300

$6.207

Farnell

UK . 342 parts In-Stock

1+ parts

$8.280

100+ parts

$7.110

1k+ parts

$6.630

10k+ parts

-

342

$8.280

$7.110

$6.630

-

Element14

Singapore . 342 parts In-Stock

1+ parts

$13.570

100+ parts

$11.670

1k+ parts

$10.660

10k+ parts

-

342

$13.570

$11.670

$10.660

-

Verical

USA . 236 parts In-Stock

1+ parts

-

100+ parts

$5.780

1k+ parts

-

10k+ parts

-

236

-

$5.780

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 277 parts In-Stock

1+ parts

$6.222

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$6.222

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$7.870

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$7.870

-

-

-

Chip Stock

USA . 3,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,898

-

-

-

-

Vyrian

USA . 592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

592

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,467 parts In-Stock

1+ parts

$3.688

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

$3.688

-

-

-

Corphita

USA . 315 parts In-Stock

1+ parts

$5.895

100+ parts

-

1k+ parts

-

10k+ parts

-

315

$5.895

-

-

-

Component Stockers USA

USA . 2,734 parts In-Stock

1+ parts

$5.950

100+ parts

$5.950

1k+ parts

$5.950

10k+ parts

-

2,734

$5.950

$5.950

$5.950

-

Ampacity Inc.

Singapore . 174 parts In-Stock

1+ parts

$6.710

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$6.710

-

-

-

Semicontronic

India . 101 parts In-Stock

1+ parts

$6.710

100+ parts

$6.542

1k+ parts

$6.509

10k+ parts

-

101

$6.710

$6.542

$6.509

-

Continental Prestige Electronics

USA . 3,472 parts In-Stock

1+ parts

$7.870

100+ parts

-

1k+ parts

-

10k+ parts

$7.713

3,472

$7.870

-

-

$7.713

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.870

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$7.870

-

-

-

Modulus Dynamics

Lithuania . 857 parts In-Stock

1+ parts

$8.117

100+ parts

$7.792

1k+ parts

$7.468

10k+ parts

-

857

$8.117

$7.792

$7.468

-

Corohmni

South Africa . 295 parts In-Stock

1+ parts

$8.117

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$8.117

-

-

-

Microchip USA

USA . 2,275 parts In-Stock

1+ parts

$27.550

100+ parts

$27.160

1k+ parts

$26.960

10k+ parts

$26.760

2,275

$27.550

$27.160

$26.960

$26.760

Lixinc

USA . 19,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,222

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Argo Parts USA

USA . 1,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,567

-

-

-

-

Glotronic Ltd.

UK . 822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

822

-

-

-

-

Perfect Parts

USA . 757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

757

-

-

-

-

Overview

Elevate your electronics with the S25FS512SAGBHI210 by Infineon Technologies, a top-tier manufacturer known for quality and innovation. This Flash Memory device offers unparalleled performance and reliability, perfect for a wide range of applications. With its advanced features and cutting-edge technology, this product delivers exceptional value and benefits to customers seeking high-speed data storage solutions. Upgrade your systems today and experience the advantages of Infineon's superior products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand environmental factors.

Operating Mode: SYNCHRONOUS

Provides efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 1.8

Efficient power consumption at a standard voltage.

Write Protection: HARDWARE/SOFTWARE

Enhanced security feature to protect data integrity.

Technology: CMOS

Low power consumption and high noise immunity.

Technical Specifications

Flash Memory S25FS512SAGBHI210 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FS512SAGBHI210 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20