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S25FL256SAGNFI000

Infineon Technologies

S25FL256SAGNFI000 by Infineon Technologies

S25FL256SAGNFI000 by Infineon is a 64MX4 NOR flash memory with 268MB density. It operates at 3V, has SPI serial interface, and supports up to 133MHz clock frequency. Ideal for industrial applications requiring high endurance and fast data access.

Median Price

$2.960

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 131 parts In-Stock

1+ parts

$2.811

100+ parts

$2.584

1k+ parts

$2.537

10k+ parts

-

131

$2.811

$2.584

$2.537

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Avnet

USA . 3,376 parts In-Stock

1+ parts

$2.824

100+ parts

$2.612

1k+ parts

-

10k+ parts

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3,376

$2.824

$2.612

-

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Chip1Stop

Japan . 3,521 parts In-Stock

1+ parts

$2.960

100+ parts

-

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3,521

$2.960

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Farnell

UK . 240 parts In-Stock

1+ parts

$3.120

100+ parts

$2.370

1k+ parts

$2.200

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240

$3.120

$2.370

$2.200

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Newark

USA . 9,352 parts In-Stock

1+ parts

$3.400

100+ parts

$3.400

1k+ parts

$3.360

10k+ parts

-

9,352

$3.400

$3.400

$3.360

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DigiKey

USA . 10,999 parts In-Stock

1+ parts

$4.960

100+ parts

$4.281

1k+ parts

$3.998

10k+ parts

$3.939

10,999

$4.960

$4.281

$3.998

$3.939

Element14

Singapore . 240 parts In-Stock

1+ parts

$5.510

100+ parts

$4.350

1k+ parts

$4.160

10k+ parts

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240

$5.510

$4.350

$4.160

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Flip Electronics (Authorized)

USA . 41,820 parts In-Stock

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41,820

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Rochester

USA . 525 parts In-Stock

1+ parts

-

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$2.610

1k+ parts

$2.340

10k+ parts

$2.200

525

-

$2.610

$2.340

$2.200

Verical

USA . 525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.925

10k+ parts

$2.750

525

-

-

$2.925

$2.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 33 parts In-Stock

1+ parts

$3.211

100+ parts

-

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-

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33

$3.211

-

-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$4.454

100+ parts

-

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-

10k+ parts

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200

$4.454

-

-

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Maritex

Poland . 183 parts In-Stock

1+ parts

$8.113

100+ parts

$4.764

1k+ parts

$4.085

10k+ parts

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183

$8.113

$4.764

$4.085

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Chip Stock

USA . 21,819 parts In-Stock

1+ parts

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21,819

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Flip Electronics

USA . 21,296 parts In-Stock

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21,296

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Vyrian

USA . 7,657 parts In-Stock

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7,657

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Rutronik

Germany . 1,352 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.930

10k+ parts

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1,352

-

-

$3.930

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Avant Electronics Limited

UK . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,284 parts In-Stock

1+ parts

$2.940

100+ parts

-

1k+ parts

-

10k+ parts

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7,284

$2.940

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-

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Corphita

USA . 156 parts In-Stock

1+ parts

$3.042

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156

$3.042

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Argo Parts USA

USA . 4,628 parts In-Stock

1+ parts

$4.150

100+ parts

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10k+ parts

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4,628

$4.150

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$4.308

100+ parts

$4.093

1k+ parts

$4.093

10k+ parts

-

100

$4.308

$4.093

$4.093

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Netroflash

USA . 50 parts In-Stock

1+ parts

$4.454

100+ parts

-

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50

$4.454

-

-

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Aztec Data Supply Inc.

USA . 304 parts In-Stock

1+ parts

$4.598

100+ parts

-

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304

$4.598

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Modulus Dynamics

Lithuania . 1,145 parts In-Stock

1+ parts

$5.207

100+ parts

$4.999

1k+ parts

$4.790

10k+ parts

-

1,145

$5.207

$4.999

$4.790

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Continental Prestige Electronics

USA . 6,724 parts In-Stock

1+ parts

$5.400

100+ parts

$3.900

1k+ parts

-

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6,724

$5.400

$3.900

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Corohmni

South Africa . 507 parts In-Stock

1+ parts

$5.568

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507

$5.568

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Semicontronic

India . 8,761 parts In-Stock

1+ parts

$6.730

100+ parts

$6.562

1k+ parts

$6.528

10k+ parts

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8,761

$6.730

$6.562

$6.528

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RC Electronics

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

$4.500

1k+ parts

$4.100

10k+ parts

$3.980

16,000

-

$4.500

$4.100

$3.980

Lixinc

USA . 13,790 parts In-Stock

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13,790

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Metaverse IC Inc.

Canada . 11,936 parts In-Stock

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11,936

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QUARKTWIN TECHNOLOGY LTD

USA . 11,336 parts In-Stock

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11,336

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Perfect Parts

USA . 4,499 parts In-Stock

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4,499

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Glotronic Ltd.

UK . 3,042 parts In-Stock

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3,042

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Futuretech Components

Singapore . 480 parts In-Stock

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480

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iodParts Technologies Inc.

India . 361 parts In-Stock

1+ parts

-

100+ parts

$4.514

1k+ parts

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361

-

$4.514

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GreenTree Electronics

Israel . 200 parts In-Stock

1+ parts

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200

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Kepictronics

USA . 71 parts In-Stock

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Overview

Experience next-level data storage with the S25FL256SAGNFI000 by Infineon Technologies. Crafted with precision in a small outline, heat sink package, this industrial-grade flash memory device is designed to meet your most demanding requirements. Boasting a high endurance of 100,000 write/erase cycles and a maximum clock frequency of 133 MHz, this NOR type memory chip offers reliability and efficiency for a wide range of applications. From IoT devices to automotive systems, trust in Infineon's cutting-edge technology to elevate your products to new heights. Unlock the power of innovation with the S25FL256SAGNFI000.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the flash memory chip, ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making it convenient for integration into various devices.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for faster data transfer speeds and better performance in synchronous applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems while providing efficient power consumption.

Write Protection: HARDWARE/SOFTWARE

The hardware and software write protection feature adds an extra layer of security to prevent accidental data modification or corruption.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with a variety of digital systems.

Endurance: 100000 Write/Erase Cycles

With a high endurance rating of 100,000 write/erase cycles, this flash memory chip is reliable and can withstand frequent data read/write operations.

Technical Specifications

Flash Memory S25FL256SAGNFI000 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGNFI000 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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