Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SDSDQAB-008G by Western Digital is a flash memory chip with 8GX8 organization and 8G word code. It operates b/w -25 to 85 °C, suitable for various applications requiring high memory density like flash cards. The chip features CMOS technology, rectangular shape, and upper terminal position for surface mounting.
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Surface mount allows for easy and reliable installation on PCBs, making it a convenient choice for electronic device manufacturers.
Rectangular shape allows for efficient use of space on the PCB, enabling compact design of electronic devices.
Uncased chip package style is ideal for applications where space is limited and weight needs to be minimized.
High maximum operating temperature ensures reliable performance even in demanding environmental conditions.
Organized as 8GX8, this flash memory offers a balance between data storage capacity and access speed, suitable for a variety of applications.
Low minimum operating temperature allows for operation in cold environments without compromising performance.
Upper terminal position facilitates easy connections and integration into electronic devices.
NAND type flash memory offers high storage capacity and fast data access, making it suitable for applications requiring large amounts of data storage.
CMOS technology provides low power consumption and high speed operation, making the flash memory efficient and reliable.
No lead terminal form is environmentally friendly and allows for easy recycling of the product.
High number of words provides ample storage capacity for data-intensive applications, making the flash memory versatile and efficient.
Memory width of 8 allows for efficient data transfer and processing, enhancing the overall performance of the product.
No. of words code 8G indicates a high storage capacity, making the flash memory suitable for applications requiring substantial data storage capabilities.
High memory density ensures that the flash memory can store a large amount of data in a compact form factor, making it an efficient choice for space-constrained applications.
Flash card memory IC type offers portability and flexibility, making it suitable for applications where data needs to be easily transferred between devices.
Flash Memory SDSDQAB-008G attributes and parameters. Explore more Flash Memory devices from Western Digital
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
Type:
SDSDQAB-008G Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Western Digital has long been at the forefront of game changing innovations. From the invention of the first hard drive to recent advancements in 3D NAND our journey of innovation continues to inspire those who dare to think big. Wherever you are, Western Digital is with you every step of the way. We are always at the cusp of innovation, pushing the boundaries of technology to make what you thought was once impossible, possible.
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
DRV5053VAQLPG
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
1N4148W-7-F
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
Semtech
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
ECA2DHG4R7
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
MT25QL512ABB1EW9-0SIT
Micron Technology
Micron Technology's MT25QL512ABB1EW9-0SIT is a 512Mx1 flash memory with synchronous operation, 133 MHz clock frequency, and 3V programming voltage. Ideal for industrial applications, it offers a memory density of 536870912 bits in a small outline package with a max temperature of 85°C.
EPCS128SI16N
Intel
EPCS128SI16N by Intel is a 16Mx8 configuration memory with 134217728-bit memory density. It operates at a max clock frequency of 40 MHz and has an endurance of 100000 write/erase cycles. Ideal for industrial applications requiring reliable, high-density flash memory with synchronous operation.
S25FL512SAGBHI310
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
AT45DB641E-MHN-Y
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1;
S25FL128P0XMFI001
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
W25Q80DVUXIETR
Winbond Electronics
W25Q80DVUXIETR by Winbond Electronics is a 1MX8 NOR flash memory with SPI serial bus, operating at up to 104 MHz. It has a supply voltage range of 2.7V to 3.6V and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact devices.
S25FL128SAGNFI011
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Width: 4;
S29GL064S70TFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 18.4 mm;
S29AL008J70TFI010
Infineon Technologies
Infineon's S29AL008J70TFI010 is a 512Kx16 NOR flash memory with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 524288 words, and parallel interface. Ideal for industrial applications requiring fast access time of 70ns and low standby current of 0.000005Amp.
SST26VF032BA-104I/SM
Microchip Technology
SST26VF032BA-104I/SM by Microchip Technology is a 32Mb NOR type flash memory with a max clock frequency of 104MHz. It operates at a nominal voltage of 3V and has a small outline package style. This memory IC is commonly used in industrial applications requiring high endurance and reliable data storage.
S29GL064S70BHI040
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 4MX16;
AT45DB642D-TU
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Width: 1;
IS25LP064A-JBLE-TR
Integrated Silicon Solution
IS25LP064A-JBLE-TR by Integrated Silicon Solution is a 64M Flash Memory with 67108864-bit memory density. Operating at 133MHz clock frequency, it has a supply voltage range of 2.3V to 3.6V and temperature grade suitable for industrial applications. This small outline package offers synchronous operation in a square shape, making it ideal for high-speed data storage needs.
S29JL032J70TFI020
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
S25FS512SAGBHI210
The Infineon Technologies S25FS512SAGBHI210 is a NOR type flash memory with 64Mx8 organization, operating at 133MHz. It features hardware/software write protection and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed synchronous operation in a compact grid array package.
S29AL016J70TFI013
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 18.4 mm;
AT25SF041B-SSHD-B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 100000 Write/Erase Cycles;
MT25QU512ABB8E12-0SIT
MT25QU512ABB8E12-0SIT by Micron Technology is a 512M NOR flash memory with 536870912-bit density. Operating at 166 MHz, it has a thin profile grid array package suitable for industrial applications. With synchronous operation and serial interface, it offers fast programming at 1.8V voltage.
SST39SF010A-70-4I-WHE
Silicon Storage Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
S25FL512SAGMFIR11
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: SPI;
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SDSDQAF3-008G-I
Western Digital
SDSDQAF3-008G-I by Western Digital is an 8GX8 flash memory chip with MLC NAND technology. It operates in ASYNCHRONOUS mode, has a memory density of 68719476736 bits, and can withstand temperatures from -25 to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
Sandisk
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Memory Density: 68719476736 bit;
SDSDQAB-008G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Terminal Position: UPPER;
SDSDQAF3-064G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Operating Mode: ASYNCHRONOUS; Terminal Form: NO LEAD;
SDSDQAF3-064G-I by Western Digital is a Flash Memory chip with 64GX8 organization and MLC NAND type technology. It operates in ASYNCHRONOUS mode, has a memory density of 549755813888 bit, and can withstand temperatures from -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQED-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;
SDSDQAF3-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Words Code: 8G; Minimum Operating Temperature: -40 Cel;
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Programming Voltage (V): 2.7; Package Body Material: UNSPECIFIED;
SDSDQAB-016G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8; Organization: 16GX8;
SDSDQ-4096
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz;
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8;
SDSDQAF3-016G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Minimum Operating Temperature: -25 Cel;
SDSDQAF3-016G-I by Western Digital is a Flash Memory chip with 16GX8 organization, MLC NAND type, and 137.4Gb memory density. It operates in ASYNCHRONOUS mode at temperatures ranging from -25°C to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQAF3-032G-I
SDSDQAF3-032G-I by Western Digital is a Flash Memory chip with 32GX8 organization, MLC NAND technology, and 274877906944 bit memory density. It operates in ASYNCHRONOUS mode with a temperature range of -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Words: 34359738368 words;
SDSDAF3-008G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Density: 68719476736 bit; Terminal Form: NO LEAD;
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Supply Voltage (Vsup): 3.6 V;
SDSDQAB-004G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Organization: 4GX8; Memory Width: 8;
SDSDQAB-032G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Maximum Operating Temperature: 85 Cel;
SDSDQAB-064G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; JESD-30 Code: R-XUUC-N; Memory Width: 8;
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