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S25FL512SAGBHIA10

Infineon Technologies

S25FL512SAGBHIA10 by Infineon Technologies

S25FL512SAGBHIA10 by Infineon is a 64MX8 NOR flash memory with 512753664 bit density. Operating at 3V, it offers 133MHz clock frequency and 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed serial data transfer over SPI interface.

Median Price

$7.295

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 540 parts In-Stock

1+ parts

$4.541

100+ parts

$4.344

1k+ parts

-

10k+ parts

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540

$4.541

$4.344

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Newark

USA . 487 parts In-Stock

1+ parts

$5.940

100+ parts

$5.940

1k+ parts

$5.940

10k+ parts

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487

$5.940

$5.940

$5.940

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Chip1Stop

Japan . 638 parts In-Stock

1+ parts

$7.280

100+ parts

$6.370

1k+ parts

-

10k+ parts

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638

$7.280

$6.370

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Arrow

USA . 1,419 parts In-Stock

1+ parts

$7.295

100+ parts

$6.225

1k+ parts

$5.381

10k+ parts

$5.327

1,419

$7.295

$6.225

$5.381

$5.327

DigiKey

USA . 4,671 parts In-Stock

1+ parts

$7.850

100+ parts

$6.752

1k+ parts

$6.300

10k+ parts

$6.207

4,671

$7.850

$6.752

$6.300

$6.207

Mouser Electronics

USA . 519 parts In-Stock

1+ parts

$7.850

100+ parts

$6.330

1k+ parts

$6.040

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-

519

$7.850

$6.330

$6.040

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Farnell

UK . 1,170 parts In-Stock

1+ parts

$10.593

100+ parts

$7.430

1k+ parts

$7.327

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-

1,170

$10.593

$7.430

$7.327

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Element14

Singapore . 671 parts In-Stock

1+ parts

$14.090

100+ parts

$10.690

1k+ parts

$10.300

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671

$14.090

$10.690

$10.300

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Verical

USA . 7,324 parts In-Stock

1+ parts

-

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7,324

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Flip Electronics (Authorized)

USA . 1,053 parts In-Stock

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1,053

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Future Electronics

Canada . 676 parts In-Stock

1+ parts

-

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$4.470

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676

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-

$4.470

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 530 parts In-Stock

1+ parts

$9.338

100+ parts

-

1k+ parts

-

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530

$9.338

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.358

100+ parts

-

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50

$10.358

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Chip Stock

USA . 10,610 parts In-Stock

1+ parts

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10,610

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Flip Electronics

USA . 1,038 parts In-Stock

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1,038

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Vyrian

USA . 906 parts In-Stock

1+ parts

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906

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Component Sense

UK . 682 parts In-Stock

1+ parts

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682

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IBS Electronics

USA . 338 parts In-Stock

1+ parts

-

100+ parts

-

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$6.466

10k+ parts

$6.367

338

-

-

$6.466

$6.367

DigiKey Marketplace

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$6.840

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152

-

$6.840

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,639 parts In-Stock

1+ parts

$2.403

100+ parts

$2.307

1k+ parts

$2.211

10k+ parts

-

1,639

$2.403

$2.307

$2.211

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Aztec Data Supply Inc.

USA . 245 parts In-Stock

1+ parts

$3.652

100+ parts

-

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245

$3.652

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Corohmni

South Africa . 782 parts In-Stock

1+ parts

$3.793

100+ parts

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782

$3.793

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$3.820

100+ parts

$3.629

1k+ parts

$3.629

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-

350

$3.820

$3.629

$3.629

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Semicontronic

India . 1,005 parts In-Stock

1+ parts

$5.070

100+ parts

$4.943

1k+ parts

$4.918

10k+ parts

-

1,005

$5.070

$4.943

$4.918

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Continental Prestige Electronics

USA . 1,069 parts In-Stock

1+ parts

$8.100

100+ parts

$6.530

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-

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1,069

$8.100

$6.530

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Corphita

USA . 610 parts In-Stock

1+ parts

$8.847

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610

$8.847

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Component Stockers USA

USA . 2,283 parts In-Stock

1+ parts

$9.450

100+ parts

$6.700

1k+ parts

$6.770

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2,283

$9.450

$6.700

$6.770

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Microchip USA

USA . 4,850 parts In-Stock

1+ parts

$27.552

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4,850

$27.552

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QUARKTWIN TECHNOLOGY LTD

USA . 22,655 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,449 parts In-Stock

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7,449

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RC Electronics

USA . 6,779 parts In-Stock

1+ parts

-

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$8.200

1k+ parts

$7.490

10k+ parts

$7.260

6,779

-

$8.200

$7.490

$7.260

Argo Parts USA

USA . 4,712 parts In-Stock

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4,712

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Kepictronics

USA . 2,027 parts In-Stock

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2,027

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Authorized Procurement Solutions

USA . 1,300 parts In-Stock

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Metaverse IC Inc.

Canada . 1,014 parts In-Stock

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1,014

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Glotronic Ltd.

UK . 101 parts In-Stock

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101

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Unlock unlimited possibilities with the S25FL512SAGBHIA10 by Infineon Technologies. Crafted with precision and expertise, this flash memory device offers seamless performance and reliability for various applications. Whether you're looking to enhance your storage capabilities or streamline your operations, this product delivers unparalleled value, efficiency, and innovation. Trust in Infineon Technologies to provide cutting-edge solutions that empower your business to thrive in today's fast-paced world. Elevate your technology experience with the S25FL512SAGBHIA10 and take your endeavors to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to damage, making this flash memory product long-lasting.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and processing, improving overall performance.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency enables quick access and retrieval of data, enhancing the speed of the flash memory.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the flash memory energy-efficient and fast.

Memory Density: 512753664 bit

High memory density allows for storing a large amount of data in a compact space, making this flash memory suitable for storage-intensive applications.

Technical Specifications

Flash Memory S25FL512SAGBHIA10 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Alternate Memory Width:

4

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

512753664 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

64094208 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0003 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL512SAGBHIA10 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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