Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SDSDQAF3-008G-I by Western Digital is an 8GX8 flash memory chip with MLC NAND technology. It operates in ASYNCHRONOUS mode, has a memory density of 68719476736 bits, and can withstand temperatures from -25 to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
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Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.
Asynchronous operation provides flexibility and allows for independent control of read and write operations, optimizing performance.
With a high maximum operating temperature, this flash memory can withstand harsh environmental conditions and maintain reliable performance.
CMOS technology offers low power consumption and high noise immunity, making this flash memory energy-efficient and reliable.
Flash Memory SDSDQAF3-008G-I attributes and parameters. Explore more Flash Memory devices from Western Digital
JESD-30 Code:
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SDSDQAF3-008G-I Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Western Digital has long been at the forefront of game changing innovations. From the invention of the first hard drive to recent advancements in 3D NAND our journey of innovation continues to inspire those who dare to think big. Wherever you are, Western Digital is with you every step of the way. We are always at the cusp of innovation, pushing the boundaries of technology to make what you thought was once impossible, possible.
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99WT1G
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
ROHM
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
Semitronics
MBRS130LT3G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
ABS25-32.768KHZ-T
Abracon
Abracon's ABS25-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency, such as IoT devices and precision timing systems in industrial settings.
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
AT45DB161D-SU-2.5
Atmel
Atmel's AT45DB161D-SU-2.5 is a 16Mx1 NOR flash memory with 50MHz clock frequency, SPI serial bus type, and 100K write/erase cycles. Ideal for industrial applications requiring reliable data storage in a compact package with low power consumption.
MT25QL128ABA1EW9-0SITTR
Micron Technology
Micron Technology's MT25QL128ABA1EW9-0SITTR is a 128Mbit flash memory with synchronous operation, 133MHz clock frequency, and 100000 write/erase cycles. Ideal for industrial applications requiring high endurance and reliable data storage in a compact package.
AM29F400BT-90ED
Spansion
Spansion's AM29F400BT-90ED is a 256Kx16 NOR flash memory with 4194304-bit density. Operating at 5V, it offers fast access time of 90ns and endurance of 1M cycles. Ideal for applications requiring high-speed data storage in commercial-grade environments.
S25FL032P0XMFI011
Cypress Semiconductor
Cypress Semiconductor S25FL032P0XMFI011 is a NOR flash memory with 4Kx16 organization, SPI serial bus type, and 104 MHz clock frequency. It operates at -40 to 85°C, has 100000 write/erase cycles endurance, and is suitable for industrial applications requiring high-speed data storage in compact devices.
M29W640GH70ZA6E
STMicroelectronics
M29W640GH70ZA6E by STMicroelectronics is a 3V NOR flash memory with 4Mx16 organization, operating at -40 to 85°C. It features a 64K word sector size, parallel interface, and 70 ns access time. Ideal for industrial applications requiring fast data access and reliable non-volatile storage.
MT29F2G01ABAGDWB-IT:GTR
FLASH; Programming Voltage (V): 3.3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Type: SLC NAND TYPE;
MT25QL02GCBB8E12-0SIT
Micron Technology's MT25QL02GCBB8E12-0SIT is a 256MX8 NOR flash memory with 3V supply voltage, operating at up to 133MHz clock frequency. Ideal for industrial applications, it offers 100K write/erase cycles, SPI serial bus type, and compact dimensions of 6mm x 8mm.
M25P16-VMN6P
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 2MX8;
AT25SF321B-SSHB-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1;
S29AL008J70TFI020
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
M25P64-VMF6P
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz;
AT45DB161E-SSHD-B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Programming Voltage (V): 2.7;
MX25R6435FZAIL0
Macronix
Macronix's MX25R6435FZAIL0 is a 16MX4 flash memory IC with 67108864-bit memory density. Operating at 1.8V, it offers synchronous mode and supports up to 33MHz clock frequency. Ideal for industrial applications requiring reliable, high-speed data storage in a compact 4x4mm package.
S25FL512SAGMFIR10
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
S25FL256LAGNFV010
Infineon Technologies
S25FL256LAGNFV010 by Infineon is a NOR type Flash Memory with 32Mx8 organization, operating at 133MHz clock frequency. It offers 100000 write/erase cycles and supports SPI serial bus type. Ideal for industrial applications requiring high endurance and reliable data storage in compact form factor.
S25FL064LABNFI040
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;
AT25SF041-SHD-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
AT45DB641E-MWHN-Y
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Width: 6 mm;
AT45DB161E-SHF-B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
S25FL256SAGMFI001
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
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SDSDQAF3-008G-I
Sandisk
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Memory Density: 68719476736 bit;
SDSDQAB-008G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Terminal Position: UPPER;
Western Digital
SDSDQAB-008G by Western Digital is a flash memory chip with 8GX8 organization and 8G word code. It operates b/w -25 to 85 °C, suitable for various applications requiring high memory density like flash cards. The chip features CMOS technology, rectangular shape, and upper terminal position for surface mounting.
SDSDQAF3-064G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Operating Mode: ASYNCHRONOUS; Terminal Form: NO LEAD;
SDSDQAF3-064G-I by Western Digital is a Flash Memory chip with 64GX8 organization and MLC NAND type technology. It operates in ASYNCHRONOUS mode, has a memory density of 549755813888 bit, and can withstand temperatures from -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQED-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;
SDSDQAF3-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Words Code: 8G; Minimum Operating Temperature: -40 Cel;
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Programming Voltage (V): 2.7; Package Body Material: UNSPECIFIED;
SDSDQAB-016G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8; Organization: 16GX8;
SDSDQ-4096
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz;
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8;
SDSDQAF3-016G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Minimum Operating Temperature: -25 Cel;
SDSDQAF3-016G-I by Western Digital is a Flash Memory chip with 16GX8 organization, MLC NAND type, and 137.4Gb memory density. It operates in ASYNCHRONOUS mode at temperatures ranging from -25°C to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQAF3-032G-I
SDSDQAF3-032G-I by Western Digital is a Flash Memory chip with 32GX8 organization, MLC NAND technology, and 274877906944 bit memory density. It operates in ASYNCHRONOUS mode with a temperature range of -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Words: 34359738368 words;
SDSDAF3-008G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Density: 68719476736 bit; Terminal Form: NO LEAD;
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Supply Voltage (Vsup): 3.6 V;
SDSDQAF3-064G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 64GX8; JESD-30 Code: X-XUUC-N; Surface Mount: YES;
SDSDQAF3-032G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Width: 8; Terminal Position: UPPER; Surface Mount: YES;
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N; Terminal Form: NO LEAD;
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