Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Memory Density: 68719476736 bit;
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Flash Memory SDSDQAF3-008G-I attributes and parameters. Explore more Flash Memory devices from Sandisk
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SDSDQAF3-008G-I Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
LM358N
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
Comchip Technology
Yangzhou Yangjie Electronics
M39029/56-351
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
Hitano Enterprise
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
S29JL032J70TFI320
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
SST39SF040-70-4C-NHE
SST39SF040-70-4C-NHE by Microchip Technology is a 512Kx8 NOR flash memory chip with 128 sectors and 524,288 words. Operating at 5V, it offers a max access time of 70ns and endurance of 100,000 write/erase cycles. Ideal for applications requiring high-speed data storage in commercial-grade environments.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
S25FL512SAGMFI011
Spansion's S25FL512SAGMFI011 is a NOR flash memory with 128MX4 organization, operating at 3V and up to 133MHz clock frequency. It is commonly used in industrial applications for its endurance of 100k write/erase cycles and serial bus type SPI.
AT25SF161B-SSHB-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
S70FL01GSAGMFI011
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 7.5 mm;
AM29F010B-70JF
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000005 Amp;
SST39SF010A-70-4C-NHE
Silicon Storage Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Toggle Bit: YES;
SST26VF016BT-104I/SM
SST26VF016BT-104I/SM by Microchip: 16MX1 organization, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring NOR flash memory with 100000 write/erase cycles endurance and 3.6V max supply voltage.
EPCQ16ASI8N
EPCQ16ASI8N by Intel is a 16MX1 flash memory with 3-STATE output, operating at 100 MHz clock frequency. It has a small outline package style and is suitable for industrial applications requiring high endurance of 100000 Write/Erase cycles. With a memory density of 16777216 bits, it offers reliable data retention and synchronous operation at temperatures ranging from -40 to 85°C.
SDINBDG4-8G-I1
Sandisk
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153; Maximum Supply Voltage (Vsup): 3.6 V;
SST26VF064BEUI-104I/SM
SST26VF064BEUI-104I/SM by Microchip: 64MX1 NOR Flash Memory with 104 MHz clock, SPI interface. Ideal for industrial applications, offers 100000 Write/Erase cycles and operates b/w -40 to 85 °C.
AT25XE041B-MAHN-T
Renesas Electronics
Renesas Electronics AT25XE041B-MAHN-T is a 4Mbit serial flash memory with synchronous operation, 85MHz clock frequency, and 1.8V programming voltage. Ideal for industrial applications requiring high-speed data storage in a compact 3x2mm package with -40 to 85°C operating temperature range.
MT29F1G08ABADAWP-ITX:D
Micron Technology
Micron Technology's MT29F1G08ABADAWP-ITX:D is a 128Mx8 SLC NAND flash memory with 3.3V programming voltage, operating in industrial temperature range. It features 2K page size, 128K sector size, and parallel interface. Ideal for applications requiring high-speed data storage and retrieval in harsh environments.
M29W320EB70ZE6E
STMicroelectronics M29W320EB70ZE6E is a 48-terminal NOR flash memory with 2MX16 organization, operating at 3V. It features a max temperature of 85°C and offers 8K/64K sector sizes. Suitable for industrial applications, it has a standby current of 0.0001A and access time of 70ns, making it ideal for high-speed data storage needs.
S25FL128SAGMFI011
Infineon Technologies
S25FL128SAGMFI011 by Infineon Technologies is a NOR type Flash Memory with 32MX4 organization, operating at 133 MHz clock frequency. It has a 100000 write/erase cycle endurance and supports SPI serial bus type. Ideal for industrial applications requiring high-speed synchronous operation and reliable data storage in compact devices.
KLM8G1GETF-B041
Samsung
Samsung's KLM8G1GETF-B041 is an 8GX8 flash memory with 68719476736-bit density. Operating at 1.8V, it features asynchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in a compact GRID ARRAY package style.
AT45DB641E-MHN-Y
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1;
MX25L25645GZ2I-08G
Macronix
MX25L25645GZ2I-08G by Macronix is a NOR flash memory with 32MX8 organization and 33554432 words. It operates at a max clock frequency of 120 MHz and has a memory density of 268435456 bits. It is commonly used in industrial applications for its endurance of 100000 write/erase cycles.
SST25VF016B-50-4C-S2AF
SST25VF016B-50-4C-S2AF by Microchip: 16MX1 NOR Flash Memory with 50 MHz clock, SPI interface. Ideal for commercial applications requiring 100000 Write/Erase Cycles, operating at temperatures from 0 to 70 °C.
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SDSDQAF3-008G-I
Western Digital
SDSDQAF3-008G-I by Western Digital is an 8GX8 flash memory chip with MLC NAND technology. It operates in ASYNCHRONOUS mode, has a memory density of 68719476736 bits, and can withstand temperatures from -25 to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQAB-008G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Terminal Position: UPPER;
SDSDQAB-008G by Western Digital is a flash memory chip with 8GX8 organization and 8G word code. It operates b/w -25 to 85 °C, suitable for various applications requiring high memory density like flash cards. The chip features CMOS technology, rectangular shape, and upper terminal position for surface mounting.
SDSDQAF3-064G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Operating Mode: ASYNCHRONOUS; Terminal Form: NO LEAD;
SDSDQAF3-064G-I by Western Digital is a Flash Memory chip with 64GX8 organization and MLC NAND type technology. It operates in ASYNCHRONOUS mode, has a memory density of 549755813888 bit, and can withstand temperatures from -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQED-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; Package Body Material: UNSPECIFIED; No. of Functions: 1;
SDSDQAF3-008G-XI
FLASH CARD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Words Code: 8G; Minimum Operating Temperature: -40 Cel;
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Programming Voltage (V): 2.7; Package Body Material: UNSPECIFIED;
SDSDQAB-016G
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8; Organization: 16GX8;
SDSDQ-4096
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz;
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Memory Width: 8;
SDSDQAF3-016G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Minimum Operating Temperature: -25 Cel;
SDSDQAF3-016G-I by Western Digital is a Flash Memory chip with 16GX8 organization, MLC NAND type, and 137.4Gb memory density. It operates in ASYNCHRONOUS mode at temperatures ranging from -25°C to 85°C. Ideal for applications requiring high-speed data storage in compact devices.
SDSDQAF3-032G-I
SDSDQAF3-032G-I by Western Digital is a Flash Memory chip with 32GX8 organization, MLC NAND technology, and 274877906944 bit memory density. It operates in ASYNCHRONOUS mode with a temperature range of -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Words: 34359738368 words;
SDSDAF3-008G-I
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Density: 68719476736 bit; Terminal Form: NO LEAD;
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Supply Voltage (Vsup): 3.6 V;
SDSDQAF3-064G-XI
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Width: 8; Maximum Supply Voltage (Vsup): 3.6 V;
SDSDQAF3-016G-XI
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 16GX8; Minimum Operating Temperature: -40 Cel;
SDSDQAF3-032G-XI
FLASH CARD; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N; Terminal Form: NO LEAD;
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