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W25Q80DVSNIGT

Winbond Electronics

W25Q80DVSNIGT by Winbond Electronics

W25Q80DVSNIGT by Winbond Electronics is a 1MX8 Flash Memory with 104 MHz clock frequency. Operating at 3V, it has an industrial temperature grade and serial interface. Ideal for applications requiring high-speed data storage in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 100,250 parts In-Stock

1+ parts

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100,250

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Vyrian

USA . 1,610 parts In-Stock

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1,610

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 18,709 parts In-Stock

1+ parts

$2.280

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18,709

$2.280

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$2.480

100+ parts

$2.356

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$2.356

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350

$2.480

$2.356

$2.356

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Corohmni

South Africa . 227 parts In-Stock

1+ parts

$4.223

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227

$4.223

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AZTECH Wire

Italy . 352 parts In-Stock

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$14.205

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352

$14.205

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Continental Prestige Electronics

USA . 6,266 parts In-Stock

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Argo Parts USA

USA . 1,536 parts In-Stock

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Robosynatics

Brazil . 1,500 parts In-Stock

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Lucentia Tech

USA . 1,500 parts In-Stock

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1,500

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Bastille Electronics

Australia . 79 parts In-Stock

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Overview

Unlock the power of reliable and efficient data storage with the W25Q80DVSNIGT by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics brings you top-notch quality and cutting-edge technology in their Flash Memory products. Ideal for a wide range of applications, this compact and versatile memory solution offers customers unparalleled value and benefits. Trust Winbond Electronics to provide you with the performance and reliability you need for your projects. Choose the W25Q80DVSNIGT for all your memory needs and experience the difference that Winbond Electronics can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the flash memory, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speed and efficiency, making the flash memory a reliable choice for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage ensures stable and consistent power supply to the flash memory, preventing data loss or corruption.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, making it suitable for industrial and harsh conditions.

Memory Density: 8388608 bit

High memory density allows for storing a large amount of data in a compact form factor, maximizing storage capacity.

Technical Specifications

Flash Memory W25Q80DVSNIGT attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

104 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.85 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

W25Q80DVSNIGT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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