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S29GL256P10TFI010

Infineon Technologies

S29GL256P10TFI010 by Infineon Technologies

S29GL256P10TFI010 by Infineon Technologies is a 256Mx1 NOR flash memory with 256 sectors, operating at 3V. It features an industrial temperature grade, parallel interface, and asynchronous mode. Ideal for applications requiring fast access times and high memory density in compact designs.

Median Price

$8.833

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,820 parts In-Stock

1+ parts

$8.830

100+ parts

$6.600

1k+ parts

$6.170

10k+ parts

$6.110

1,820

$8.830

$6.600

$6.170

$6.110

Arrow

USA . 450 parts In-Stock

1+ parts

$9.566

100+ parts

$7.329

1k+ parts

$6.652

10k+ parts

$6.586

450

$9.566

$7.329

$6.652

$6.586

DigiKey

USA . 851 parts In-Stock

1+ parts

$9.930

100+ parts

$8.540

1k+ parts

$7.999

10k+ parts

-

851

$9.930

$8.540

$7.999

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Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$10.650

100+ parts

$8.430

1k+ parts

$7.470

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-

260

$10.650

$8.430

$7.470

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Rochester

USA . 562 parts In-Stock

1+ parts

-

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$6.550

1k+ parts

$5.860

10k+ parts

$5.510

562

-

$6.550

$5.860

$5.510

Verical

USA . 531 parts In-Stock

1+ parts

-

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$8.188

1k+ parts

$7.325

10k+ parts

$6.888

531

-

$8.188

$7.325

$6.888

Avnet

USA . 21 parts In-Stock

1+ parts

-

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$8.833

10k+ parts

$8.244

21

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$8.833

$8.244

Distributors (In-Stock)

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Digiode

USA . 669 parts In-Stock

1+ parts

$6.916

100+ parts

-

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669

$6.916

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Mobius Materials

USA . 44 parts In-Stock

1+ parts

$7.450

100+ parts

$5.958

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-

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44

$7.450

$5.958

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Nova Conductors

Japan . 50 parts In-Stock

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$7.731

100+ parts

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50

$7.731

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Chip Stock

USA . 24,182 parts In-Stock

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Cyclops Electronics Ltd

UK . 13,895 parts In-Stock

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Component Sense

UK . 201 parts In-Stock

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201

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HZD GmbH

Germany . 182 parts In-Stock

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ComSIT Distribution GmbH

Germany . 111 parts In-Stock

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ComSIT USA

USA . 111 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 73 parts In-Stock

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Martec Srl

Italy . 68 parts In-Stock

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Vyrian

USA . 34 parts In-Stock

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34

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Resion

USA . 25 parts In-Stock

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25

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EZ Electronic Parts

Israel . 22 parts In-Stock

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First Choice Components Inc.

USA . 17 parts In-Stock

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17

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Bristol Electronics

USA . 15 parts In-Stock

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NAC Semi

USA . 10 parts In-Stock

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10

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Connect4Technologies Inc.

Canada . 6 parts In-Stock

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6

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Sunrise Surplus Inc.

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,488 parts In-Stock

1+ parts

$2.087

100+ parts

$2.004

1k+ parts

$1.920

10k+ parts

-

1,488

$2.087

$2.004

$1.920

-

Aztec Data Supply Inc.

USA . 1,344 parts In-Stock

1+ parts

$5.494

100+ parts

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1,344

$5.494

-

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Semicontronic

India . 69 parts In-Stock

1+ parts

$5.560

100+ parts

$5.421

1k+ parts

$5.393

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69

$5.560

$5.421

$5.393

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$5.931

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289

$5.931

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Corphita

USA . 849 parts In-Stock

1+ parts

$6.552

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849

$6.552

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Continental Prestige Electronics

USA . 2,351 parts In-Stock

1+ parts

$7.731

100+ parts

-

1k+ parts

-

10k+ parts

$7.576

2,351

$7.731

-

-

$7.576

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.731

100+ parts

-

1k+ parts

$7.344

10k+ parts

$7.189

1,000

$7.731

-

$7.344

$7.189

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

1+ parts

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90,000

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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30,000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,052 parts In-Stock

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19,052

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Perfect Parts

USA . 12,578 parts In-Stock

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S.R.D Solutions

India . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 7,179 parts In-Stock

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7,179

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RC Electronics

USA . 7,169 parts In-Stock

1+ parts

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$7.890

1k+ parts

$7.200

10k+ parts

$6.980

7,169

-

$7.890

$7.200

$6.980

Kepictronics

USA . 3,230 parts In-Stock

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Lixinc

USA . 2,348 parts In-Stock

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2,348

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CPlus Electronics

USA . 1,146 parts In-Stock

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Authorized Procurement Solutions

USA . 1,040 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Futuretech Components

Singapore . 910 parts In-Stock

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910

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Argo Parts USA

USA . 215 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 84 parts In-Stock

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ChipstoGo Electronic ltd

UK . 59 parts In-Stock

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iodParts Technologies Inc.

India . 38 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the S29GL256P10TFI010 by Infineon Technologies. This versatile product offers a range of applications in various industries, providing seamless performance and data storage solutions. With Infineon Technologies' reputation for excellence in manufacturing, you can trust that this flash memory will deliver exceptional value and benefits to your projects. Experience the advantage of superior technology and innovation with the S29GL256P10TFI010, setting new standards for quality and performance in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the flash memory, allowing it to withstand various environmental conditions.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this flash memory compatible with a wide range of devices and power sources.

No. of Terminals: 56

Having 56 terminals allows for efficient connectivity and communication with other components in the device, ensuring smooth data transfer.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory can function reliably even in high-temperature environments.

Parallel or Serial: PARALLEL

Being a parallel flash memory allows for faster and simultaneous data transfers, making it suitable for applications requiring high-speed data processing.

Technical Specifications

Flash Memory S29GL256P10TFI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

100 ns

Alternate Memory Width:

8

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

256

No. of Terminals:

56

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

128K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

S29GL256P10TFI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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