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MT25QL128ABA8ESF-0SITTR

Micron Technology

MT25QL128ABA8ESF-0SITTR by Micron Technology

Micron Technology's MT25QL128ABA8ESF-0SITTR is a 16Mx8 NOR flash memory with SPI serial bus, 133MHz clock frequency, and 100000 write/erase cycles. It operates at -40 to 85°C, suitable for industrial applications requiring high endurance and fast data transfer.

Median Price

$2.840

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,889 parts In-Stock

1+ parts

$2.840

100+ parts

$2.280

1k+ parts

$2.040

10k+ parts

$1.840

1,889

$2.840

$2.280

$2.040

$1.840

Verical

USA . 11,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.150

10k+ parts

$2.565

11,000

-

-

$3.150

$2.565

Future Electronics

Canada . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.350

10k+ parts

$1.330

8,000

-

-

$1.350

$1.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 90 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$3.240

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.590

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.590

-

-

-

Chip Stock

USA . 11,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,000

-

-

-

-

Vyrian

USA . 3,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,659

-

-

-

-

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.900

10k+ parts

$3.610

2,000

-

-

$3.900

$3.610

Martec Srl

Italy . 978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

978

-

-

-

-

IBS Electronics

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$33.239

10k+ parts

-

960

-

-

$33.239

-

Sensible Micro Corp

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 472 parts In-Stock

1+ parts

$2.079

100+ parts

-

1k+ parts

-

10k+ parts

-

472

$2.079

-

-

-

Semicontronic

India . 8,246 parts In-Stock

1+ parts

$2.410

100+ parts

$2.350

1k+ parts

$2.338

10k+ parts

-

8,246

$2.410

$2.350

$2.338

-

Ampacity Inc.

Singapore . 4,608 parts In-Stock

1+ parts

$2.410

100+ parts

-

1k+ parts

-

10k+ parts

-

4,608

$2.410

-

-

-

Corphita

USA . 1,408 parts In-Stock

1+ parts

$3.069

100+ parts

-

1k+ parts

-

10k+ parts

-

1,408

$3.069

-

-

-

Continental Prestige Electronics

USA . 4,418 parts In-Stock

1+ parts

$3.487

100+ parts

-

1k+ parts

-

10k+ parts

$3.418

4,418

$3.487

-

-

$3.418

Argo Parts USA

USA . 2,016 parts In-Stock

1+ parts

$3.487

100+ parts

-

1k+ parts

-

10k+ parts

-

2,016

$3.487

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.590

100+ parts

$4.499

1k+ parts

-

10k+ parts

-

100

$4.590

$4.499

-

-

A-Z Elektronik GmbH

Germany . 18,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,842

-

-

-

-

Epart123

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Robosynatics

Brazil . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Overview

Unlock a world of possibilities with the MT25QL128ABA8ESF-0SITTR by Micron Technology. As a leader in flash memory technology, Micron delivers the highest quality products that guarantee reliability and performance. This NOR type memory chip, designed for industrial applications, offers 16M words of code with a fast clock frequency of 133 MHz. With 100,000 write/erase cycles, SPI serial bus type, and a compact package style, this product provides unmatched value and benefits for your storage needs. Trust Micron to provide the cutting-edge technology you need to power your innovations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product light-weight and durable, making it suitable for portable devices.

Surface Mount: YES

Being surface mountable allows for easy integration on PCBs, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation results in faster data transfer rates and improved system performance.

Nominal Supply Voltage: 3V

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of systems.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software write protection options provides added security for the stored data.

Maximum Clock Frequency: 133 MHz

A high maximum clock frequency of 133 MHz enables quick access to data and efficient operation.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Endurance: 100000 Write/Erase Cycles

With a high endurance of 100,000 write/erase cycles, the product can withstand frequent data read/write operations.

Memory Density: 134217728 bit

The high memory density of 134,217,728 bits allows for storing a large amount of data in a compact form factor.

Technical Specifications

Flash Memory MT25QL128ABA8ESF-0SITTR attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

5.29 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

16

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.29 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

MT25QL128ABA8ESF-0SITTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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