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MT25QL512ABB8ESF-0SITTR

Micron Technology

MT25QL512ABB8ESF-0SITTR by Micron Technology

Micron Technology's MT25QL512ABB8ESF-0SITTR is a 64MX8 NOR type flash memory with 133 MHz clock frequency. Operating at -40 to 85 °C, it has a serial SPI interface and 3V supply voltage. Ideal for industrial applications requiring high-speed data storage in compact form factors.

Median Price

$7.600

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,051 parts In-Stock

1+ parts

$7.600

100+ parts

$6.530

1k+ parts

$6.010

10k+ parts

-

1,051

$7.600

$6.530

$6.010

-

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.940

10k+ parts

-

3,000

-

-

$3.940

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.346

10k+ parts

$7.937

1,000

-

-

$8.346

$7.937

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$7.711

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$7.711

-

-

-

Digiode

USA . 277 parts In-Stock

1+ parts

$7.790

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$7.790

-

-

-

Chip Stock

USA . 13,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,690

-

-

-

-

Vyrian

USA . 2,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,077

-

-

-

-

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.740

10k+ parts

$9.010

2,000

-

-

$9.740

$9.010

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$85.552

10k+ parts

-

1,000

-

-

$85.552

-

Cyclops Electronics Ltd

UK . 937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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937

-

-

-

-

Sensible Micro Corp

USA . 598 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

598

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,481 parts In-Stock

1+ parts

$4.156

100+ parts

-

1k+ parts

-

10k+ parts

-

1,481

$4.156

-

-

-

Aztec Data Supply Inc.

USA . 1,520 parts In-Stock

1+ parts

$4.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

$4.430

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$5.325

100+ parts

$5.059

1k+ parts

$5.059

10k+ parts

-

2,000

$5.325

$5.059

$5.059

-

Semicontronic

India . 4,564 parts In-Stock

1+ parts

$6.650

100+ parts

$6.484

1k+ parts

$6.450

10k+ parts

-

4,564

$6.650

$6.484

$6.450

-

Ampacity Inc.

Singapore . 1,816 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,816

$6.650

-

-

-

Continental Prestige Electronics

USA . 5,859 parts In-Stock

1+ parts

$7.119

100+ parts

-

1k+ parts

-

10k+ parts

$6.977

5,859

$7.119

-

-

$6.977

Corphita

USA . 1,097 parts In-Stock

1+ parts

$7.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,097

$7.380

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Argo Parts USA

USA . 4,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,765

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$7.556

1k+ parts

$7.325

10k+ parts

$7.171

1,000

-

$7.556

$7.325

$7.171

Perfect Parts

USA . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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915

-

-

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Infinite Electronics LLP (Excess)

. 205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

205

-

-

-

-

Overview

Get ready to experience the next level of performance with the MT25QL512ABB8ESF-0SITTR by Micron Technology. As a leading manufacturer in the industry, Micron delivers top-notch quality and reliability in their flash memory products. Whether you're looking to enhance the speed and efficiency of your industrial applications or seeking reliable storage for your electronic devices, this product offers unmatched value and benefits. Trust Micron to provide cutting-edge technology that will elevate your user experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for portability and reliability.

Surface Mount: YES

The surface mount feature makes it easy to install and replace the flash memory module on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

The synchronous operation mode ensures efficient and synchronized data transfers, improving overall performance and reliability of the flash memory.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V is a common standard in electronics, making it compatible with a wide range of systems and devices.

No. of Terminals: 16

With 16 terminals, the flash memory module provides a sufficient number of connections for data input/output, enabling versatile and high-speed data processing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, making it suitable for industrial use.

Organization: 64MX8

The organization of 64 Megabits x 8 bits offers a large capacity for storing data, making it suitable for applications that require ample storage space.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the memory to have multiple states (high impedance, low, high) which is useful for controlling data flow and reducing power consumption.

Write Protection: HARDWARE

The hardware write protection feature ensures data security by preventing unauthorized writes to the memory, safeguarding critical information stored on the flash memory.

Type: NOR TYPE

The NOR type flash memory offers fast read speeds and random access to data, making it suitable for applications that require quick data retrieval and processing.

Technical Specifications

Flash Memory MT25QL512ABB8ESF-0SITTR attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.5 mm

Write Protection:

HARDWARE

Trade Compliance

MT25QL512ABB8ESF-0SITTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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