Loading...

S29GL256S90DHI010

Infineon Technologies

S29GL256S90DHI010 by Infineon Technologies

S29GL256S90DHI010 by Infineon Technologies is a 32MX8 NAND flash memory with 256 sectors and 33554432 words. Operating at 3V, it offers a max access time of 90ns and endurance of 100000 write/erase cycles. Ideal for applications requiring high-density data storage in devices with limited space and power constraints.

Median Price

$8.420

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,911 parts In-Stock

1+ parts

$8.890

100+ parts

$5.460

1k+ parts

$4.960

10k+ parts

$4.240

1,911

$8.890

$5.460

$4.960

$4.240

Mouser Electronics

USA . 2,538 parts In-Stock

1+ parts

$10.480

100+ parts

$8.990

1k+ parts

$8.460

10k+ parts

-

2,538

$10.480

$8.990

$8.460

-

Flip Electronics (Authorized)

USA . 27,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,636

-

-

-

-

DigiKey

USA . 13,778 parts In-Stock

1+ parts

-

100+ parts

$8.420

1k+ parts

-

10k+ parts

-

13,778

-

$8.420

-

-

Verical

USA . 13,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.396

10k+ parts

-

13,650

-

-

$4.396

-

Rochester

USA . 975 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

$5.070

10k+ parts

$4.770

975

-

$5.660

$5.070

$4.770

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 507 parts In-Stock

1+ parts

$4.959

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$4.959

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$6.070

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$6.070

-

-

-

Flip Electronics

USA . 18,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,796

-

-

-

-

Vyrian

USA . 6,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,940

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 55,393 parts In-Stock

1+ parts

$4.141

100+ parts

-

1k+ parts

-

10k+ parts

-

55,393

$4.141

-

-

-

Corohmni

South Africa . 62 parts In-Stock

1+ parts

$4.425

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$4.425

-

-

-

Corphita

USA . 550 parts In-Stock

1+ parts

$4.698

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$4.698

-

-

-

Semicontronic

India . 6,697 parts In-Stock

1+ parts

$4.840

100+ parts

$4.719

1k+ parts

$4.695

10k+ parts

-

6,697

$4.840

$4.719

$4.695

-

Modulus Dynamics

Lithuania . 5,748 parts In-Stock

1+ parts

$5.347

100+ parts

$5.133

1k+ parts

$4.919

10k+ parts

-

5,748

$5.347

$5.133

$4.919

-

Continental Prestige Electronics

USA . 6,470 parts In-Stock

1+ parts

$6.070

100+ parts

-

1k+ parts

-

10k+ parts

$5.949

6,470

$6.070

-

-

$5.949

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.070

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$6.070

-

-

-

Perfect Parts

USA . 4,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,551

-

-

-

-

Argo Parts USA

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

-

-

-

-

Kepictronics

USA . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

252

-

-

-

-

Overview

Experience unmatched reliability and performance with the S29GL256S90DHI010 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies offers top-quality flash memory solutions that cater to a wide range of applications. With features like a low profile grid array package and 100,000 write/erase cycles endurance, this NAND type flash memory provides exceptional value and benefits to customers. Whether you're looking to enhance data storage in industrial equipment or optimize performance in automotive electronics, the S29GL256S90DHI010 is the perfect choice for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory product, ensuring it can withstand various environmental conditions.

No. of Terminals: 64

Having a higher number of terminals allows for more efficient data transfer and connectivity, enhancing the overall performance of the flash memory.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for flexible control of the output signal, enabling versatile use of the flash memory in different applications.

Organization: 32MX8

The 32MX8 organization provides a high memory capacity and efficient data organization, making it suitable for storing large amounts of data effectively.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making the flash memory efficient and reliable for various electronic devices.

Endurance: 100000 Write/Erase Cycles

With a high endurance level, this flash memory product can withstand multiple write and erase cycles without degradation, ensuring data reliability and longevity.

Technical Specifications

Flash Memory S29GL256S90DHI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

90 ns

Additional Features:

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

Alternate Memory Width:

1

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

2

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

9 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

256

No. of Terminals:

64

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Page Size (words):

32

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Ready or Busy:

YES

Maximum Seated Height:

1.4 mm

Sector Size (Words):

128K

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

YES

Type:

NAND TYPE

Width:

9 mm

Trade Compliance

S29GL256S90DHI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20