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IS25LP128F-JKLE

Integrated Silicon Solution

IS25LP128F-JKLE by Integrated Silicon Solution

IS25LP128F-JKLE by Integrated Silicon Solution is a 16MX8 NOR Flash Memory with SPI Serial Bus, operating at 166 MHz. It offers 100000 Write/Erase Cycles, ideal for industrial applications requiring high endurance and fast data transfer. With a compact size of 6mm x 5mm and low standby current of 0.00007A, it's suitable for space-constrained devices.

Median Price

$3.390

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 382 parts In-Stock

1+ parts

$2.130

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$1.680

1k+ parts

$1.620

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382

$2.130

$1.680

$1.620

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Arrow

USA . 793 parts In-Stock

1+ parts

$2.432

100+ parts

$1.889

1k+ parts

$1.785

10k+ parts

$1.456

793

$2.432

$1.889

$1.785

$1.456

Mouser Electronics

USA . 1,783 parts In-Stock

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$3.390

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$2.940

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$2.940

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Element14

Singapore . 518 parts In-Stock

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$4.800

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Verical

USA . 470 parts In-Stock

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$4.667

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470

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$4.667

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Nova Conductors

Japan . 74 parts In-Stock

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$2.178

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Vyrian

USA . 821 parts In-Stock

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Prism Electronics

USA . 60 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 10 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.134

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$2.049

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$2.134

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Argo Parts USA

USA . 1,985 parts In-Stock

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$2.178

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Corohmni

South Africa . 692 parts In-Stock

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$2.193

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Continental Prestige Electronics

USA . 615 parts In-Stock

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$2.370

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$1.660

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$1.480

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615

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$1.480

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Aztec Data Supply Inc.

USA . 59 parts In-Stock

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$4.050

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QUARKTWIN TECHNOLOGY LTD

USA . 29,658 parts In-Stock

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Lixinc

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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Authorized Procurement Solutions

USA . 1,410 parts In-Stock

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Overview

Unlock the limitless possibilities of data storage with the IS25LP128F-JKLE by Integrated Silicon Solution. Designed with precision and cutting-edge technology, this Flash Memory device offers unparalleled reliability and performance. Perfect for a wide range of applications, from consumer electronics to industrial equipment, this product ensures seamless operation and maximum efficiency. Experience the value of top-tier quality and innovation combined in one compact package. Elevate your projects with the IS25LP128F-JKLE and stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Memory Density: 134217728 bit

High memory density allows for storing a large amount of data in a compact space, making it efficient for data storage.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures smooth and efficient data transfer, improving overall performance.

Maximum Clock Frequency (fCLK): 166 MHz

High clock frequency enables fast data processing and access speeds, enhancing the product's performance.

Temperature Grade: INDUSTRIAL

Designed for rugged industrial environments, ensuring reliability and stability under harsh conditions.

Endurance: 100000 Write/Erase Cycles

High endurance rating allows for frequent read and write operations without compromising the product's reliability.

Serial Bus Type: SPI

Serial Peripheral Interface (SPI) enables easy integration with other devices, making it versatile for various applications.

Serial or Parallel: SERIAL

Serial communication improves data transfer speed and efficiency, enhancing the overall performance of the product.

Technical Specifications

Flash Memory IS25LP128F-JKLE attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Additional Features:

ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

166 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00007 Amp

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

IS25LP128F-JKLE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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