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W25Q64FVSSIG

Winbond Electronics

W25Q64FVSSIG by Winbond Electronics

Winbond Electronics' W25Q64FVSSIG is an 8MX8 flash memory with SPI serial bus, operating at up to 104 MHz. It features a small outline package and can withstand industrial temperatures. Ideal for applications requiring high-speed data storage in compact devices.

Median Price

$1.121

Lifecycle Status

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22

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Chip Stock

USA . 41,816 parts In-Stock

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Component Sense

UK . 2,000 parts In-Stock

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$1.121

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$0.760

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Bristol Electronics

USA . 1,940 parts In-Stock

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ComSIT Distribution GmbH

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Sunrise Surplus Inc.

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Prism Electronics

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PC Components Company LLC

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Lantek

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Nova Conductors

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A2Z Electronics, Inc.

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Connector Distribution Corp

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Right Parts Inc.

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LWI Electronics Inc

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Connect4Technologies Inc.

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Atlantic Semiconductor

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Speed Components Ltd

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Bas Electronics GmbH & Co. KG

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Extreme Components

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Advanced Electronics

New Zealand . 20 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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Aztec Data Supply Inc.

USA . 533 parts In-Stock

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AZTECH Wire

Italy . 733 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Continental Prestige Electronics

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iodParts Technologies Inc.

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Bastille Electronics

Australia . 39 parts In-Stock

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ChipstoGo Electronic ltd

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Computer Components Inc. - USA

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Overview

Elevate your devices with the W25Q64FVSSIG by Winbond Electronics, a high-quality flash memory solution that delivers reliable performance and storage flexibility. As a leading manufacturer in the industry, Winbond Electronics ensures top-notch products that meet the demands of various applications. Whether you're designing consumer electronics, automotive systems, or industrial equipment, this flash memory offers exceptional value, benefits, and advantages to enhance your products. Trust Winbond Electronics to provide cutting-edge technology that elevates your innovation to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the flash memory, making it suitable for a variety of applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, enhancing the overall performance of the flash memory.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this flash memory can function reliably even in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making this flash memory energy-efficient and effective.

Memory Density: 67108864 bit

The high memory density of 67108864 bits allows for storing a large amount of data in a compact form, ideal for applications requiring high storage capacity.

Technical Specifications

Flash Memory W25Q64FVSSIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q64FVSSIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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